Method and arrangement for pre-curing an adhesive layer

US10245818B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10245818-B2
Application numberUS-201514967330-A
CountryUS
Kind codeB2
Filing dateDec 13, 2015
Priority dateNov 13, 2015
Publication dateApr 2, 2019
Grant dateApr 2, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The invention provides a method for pre-curing an adhesive layer bonding a first component to a second component. The adhesive layer is heated by treating an adhesive layer component as heating the first component with a pair of electrodes that are in electrical contact with a surface of the first component, the pair of electrodes applying a predetermined electrical current (I1, I2) to the first component. The invention further provides an arrangement for pre-curing a layer of adhesive.

First claim

Opening claim text (preview).

What is claimed: 1. A method for pre-curing an adhesive layer bonding a first component to a second component before main curing, comprising: heating the adhesive layer by treating an adhesive layer component with a pair of electrodes, wherein the pair of electrodes applies a predetermined electrical current to the first component, wherein a first electrical current (I 1 ) is applied to the first component with the pair of electrodes for raising a temperature of the adhesive layer above an activation threshold (AT) and thereafter a second electrical current (I 2 ) is applied to the first component with the pair of electrodes for maintaining the temperature of the adhesive layer within a predetermined temperature range (TR) above the activation threshold (AT), wherein the first electrical current (I 1 ) is applied to the first component for a time duration (t 1 ) of about 1000 ms to 7000 ms, wherein the second electrical current (I 2 ) is applied at a predetermined number of pulses, and each of the pulses is applied to the first component for a time duration (t 2 ) of 300 ms to 700 ms, and wherein a mechanical pressure (P) is applied to a surface of the first component and a surface of the second component for a predetermined time duration (t 3 ) during pre-curing of the adhesive layer. 2. The method according to claim 1 , wherein the predetermined temperature range (TR) is less than a degradation temperature (DT) of the adhesive layer. 3. The method according to claim 2 , wherein the adhesive layer comprises a one-component epoxy, a two-component epoxy, a one-component polyurethane, a two-component polyurethane or a two-component acrylic. 4. The method according to claim 3 , wherein, when the adhesive layer comprises the one-component epoxy, the activation threshold (AT) of the adhesive layer is about 180° C., the degradation temperature (DT) of the adhesive layer is greater than about 240° C., and the predetermined temperature range is of about 180° C. to 240° C. 5. The method according to claim 3 , wherein, when the adhesive layer comprises the two-component epoxy, the activation threshold (AT) of the adhesive layer is about 120° C., the degradation temperature (DT) of the adhesive layer is greater than about 200° C., and the predetermined temperature range is of about 120° C. to 200° C. 6. The method according to claim 3 , wherein when the adhesive layer comprises the one-component polyurethane, the degradation temperature (DT) of the adhesive layer is greater than about 160° C., and the activation threshold (AT) of the adhesive layer is about 100° C., the predetermined temperature range is of about 100° C. to 160° C. 7. The method according to claim 3 , wherein, when the adhesive layer comprises the two-component polyurethane, the degradation temperature (DT) of the adhesive layer is greater than about 140° C., and the activation threshold (AT) of the adhesive layer is about 90° C., the predetermined temperature range is of about 90° C. and 140° C. 8. The method according to claim 3 , wherein, when the adhesive layer comprises the two-component acrylic, the activation threshold (AT) of the adhesive layer is about 60° C., the degradation temperature (DT) of the adhesive layer is greater than about 120° C., and the predetermined temperature range is of about 60° C. to 120° C. 9. The method according to claim 1 , wherein the first electrical current (I 1 ) is of about 500 A to 5500 A. 10. The method according to claim 1 , wherein there is a pause of about 1 ms to 2000 ms between applying the first electrical current (I 1 ) and the second electrical current (I 2 ). 11. The method according to claim 1 , wherein the second electrical current (I 2 ) is applied at the predetermined number of pulses of about 250 A to 1450 A. 12. The method according to claim 11 , wherein, after each of the pulses, there is a pause of about 100 ms to 900 ms and the predetermined number of pulses is 10 to 50 pulses.

Assignees

Inventors

Classifications

  • Epoxy resins · CPC title

  • Vehicles · CPC title

  • Time · CPC title

  • Shear strength · CPC title

  • comprising one layer of ceramic material, e.g. porcelain, ceramic tile (layered products with at least two ceramic layers composed mainly of ceramic B32B18/00) · CPC title

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Frequently asked questions

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What does patent US10245818B2 cover?
The invention provides a method for pre-curing an adhesive layer bonding a first component to a second component. The adhesive layer is heated by treating an adhesive layer component as heating the first component with a pair of electrodes that are in electrical contact with a surface of the first component, the pair of electrodes applying a predetermined electrical current (I1, I2) to the firs…
Who is the assignee on this patent?
Hyundai Motor Co Ltd, Hyundai Motor Europe Technical Center Gmbh, Kia Motors Corp
What technology area does this patent fall under?
Primary CPC classification B32B37/12. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Apr 02 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).