Fluxing systems, bonding machines including fluxing systems, and methods of operating the same

Patent metadata

Field	Value
Publication number	US-10245668-B2
Application number	US-201715795387-A
Country	US
Kind code	B2
Filing date	Oct 27, 2017
Priority date	Oct 31, 2016
Publication date	Apr 2, 2019
Grant date	Apr 2, 2019

Abstract

A fluxing system for a bonding machine is provided. The fluxing system includes a flux holder defining a cavity for holding flux, and a fluid source for providing a cooling fluid to cool the flux holder.

First claim

What is claimed:

1. A bonding machine comprising:
(a) a bond head assembly including a bonding tool for bonding a semiconductor element to a substrate, the semiconductor element including a plurality of conductive structures; and
(b) a fluxing system including (i) a flux holder defining a cavity for holding flux, and (ii) a fluid source for providing a cooling fluid to cool the flux holder, the cooling fluid being provided by the fluid source to a surface of the flux holder beneath the cavity,
wherein, prior to bonding of the semiconductor element to the substrate, the bonding tool is configured to dip the conductive structures at least partially into the cavity such that the conductive structures contact the flux,
the bonding machine being at least one of a thermocompression bonding machine or a flip chip bonding machine.

2. The bonding machine of claim 1 wherein the fluid source is a gas supply configured to bring a cooling gas into contact with a portion of the flux holder.

3. The bonding machine of claim 1 wherein the fluid source is a liquid supply configured to bring a cooling liquid into contact with a portion of the flux holder.

4. The bonding machine of claim 1 wherein the fluid source directs the cooling fluid to the surface of the flux holder through at least one opening in a support structure supporting the flux holder.

5. The bonding machine of claim 1 wherein at least one channel is defined by the flux holder, the at least one channel being configured to receive the cooling fluid from the fluid source.

6. The bonding machine of claim 1 wherein the surface of the flux holder includes a depression following a curved path along at least a portion of a length of the surface, the cooling fluid configured to be directed toward the depression.

7. The bonding machine of claim 1 further comprising a flux tool configured to pass over an upper surface of the flux holder adjacent the cavity.

8. The bonding machine of claim 1 further comprising a fluid control system for controlling flow of the cooling fluid from the fluid source.

9. The bonding machine of claim 8 further comprising at least one sensor for sensing a temperature related characteristic of the flux holder in connection with operation of the fluid control system.

10. A method of operating a fluxing system for a bonding machine, the method comprising the steps of:
(a) providing a flux holder on the bonding machine defining a flux cavity, the flux cavity including flux;
(b) providing a bond head assembly on the bonding machine, the bond head assembly including a bonding tool for bonding a semiconductor element to a substrate, the semiconductor element including a plurality of conductive structures;
(c) dipping the conductive structures at least partially into the cavity such that the conductive structures contact the flux prior to bonding the semiconductor element to the substrate; and
(d) directing a cooling fluid from a fluid source to a surface of the flux holder beneath the cavity to cool the flux holder,
the bonding machine being at least one of a thermocompression bonding machine or a flip chip bonding machine.

11. The method of claim 10 wherein step (d) includes directing a cooling gas from a gas supply into contact with a portion of the flux holder.

12. The method of claim 10 wherein step (d) includes directing a cooling liquid from a liquid supply into contact with a portion of the flux holder.

13. The method of claim 10 wherein step (d) includes directing the cooling fluid to the surface of the flux holder through at least one opening in a support structure supporting the flux holder.

14. The method of claim 10 wherein step (d) includes directing the cooling fluid to at least one channel defined by the flux holder.

15. The method of claim 10 wherein step (d) includes directing the cooling fluid to the surface of the flux holder, the surface defining a depression following a curved path along at least a portion of a length of the surface.

16. The method of claim 10 wherein step (d) includes operating a fluid control system for controlling flow of the cooling fluid from the fluid source.

17. The method of claim 16 further comprising the steps of receiving data from at least one sensor for sensing a temperature related characteristic of the flux holder, and (d) using the data in connection with operation of the fluid control system.

18. The method of claim 16 wherein step (d) includes operating the fluid control system according to closed loop process for controlling flow of the cooling fluid from the fluid source.

19. The method of claim 16 wherein step (d) includes operating the fluid control system according to model control process derived using experimental data.

Assignees

• Kulicke & Soffa Ind Inc

Inventors

• Buergi Daniel P
• Colosimo Jr Thomas J
• Laurent Edward T
• Schmidt-Lange Michael P

Classifications

• H10W90/726

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/722

  between stacked chips · CPC title

• H10W72/07233

  Ultrasonic bonding, e.g. thermosonic bonding · CPC title

• H10W72/07232

  Compression bonding, e.g. thermocompression bonding · CPC title