Heat dissipating structure and electronic apparatus

Patent metadata

Field	Value
Publication number	US-10244668-B2
Application number	US-201615745730-A
Country	US
Kind code	B2
Filing date	Jul 28, 2016
Priority date	Aug 5, 2015
Publication date	Mar 26, 2019
Grant date	Mar 26, 2019

Abstract

A heat radiation structure includes a heat spreader provided on a heating component mounted on a substrate, a heat sink disposed at a position facing the heat spreader, a heat transfer member disposed between the heat spreader and the heat sink, and transmitting heat from the heat spreader to the heat sink, and a conductive member electrically connecting the heat spreader and the heat sink.

First claim

The invention claimed is:

1. A heat radiation structure comprising:
a heat spreader provided on a heating component mounted on a substrate;
a heat sink disposed at a position facing the heat spreader;
a heat transfer member disposed between the heat spreader and the heat sink, and transmitting heat from the heat spreader to the heat sink; and
a conductive member electrically connecting the heat spreader and the heat sink, wherein:
the conductive member is a conductive tape contacting each of the heat spreader and the heat sink,
one end portion of the conductive tape is pinched between the heat spreader and the heat transfer member, and
an other end portion of the conductive tape contacts an area on a back face of the heat sink, at which the heat transfer member is not disposed.

2. The heat radiation structure according to claim 1 , wherein
the heat spreader and the heating component are integrally formed.

3. The heat radiation structure according to claim 1 , wherein
the heating component is a semiconductor integrated circuit.

4. A heat radiation structure comprising:
a heat spreader provided on a heating component mounted on a substrate;
a heat sink disposed at a position facing the heat spreader;
a heat transfer member disposed between the heat spreader and the heat sink, and transmitting heat from the heat spreader to the heat sink; and
a conductive member electrically connecting the heat spreader and the heat sink, wherein:
the conductive member is a conductive tape contacting each of the heat spreader and the heat sink, and
the conductive tape is wrapped around the heat transfer member so as to pass between the heat spreader and the heat transfer member and between the heat sink and the heat transfer member.

5. The heat radiation structure according to claim 4 , wherein
the heat spreader and the heating component are integrally formed.

6. The heat radiation structure according to claim 4 , wherein
the heating component is a semiconductor integrated circuit.

7. An electronic device comprising:
a substrate;
a heating component mounted on the substrate, and including a heat spreader;
a heat sink disposed at a position facing the heat spreader;
a heat transfer member disposed between the heat spreader and the heat sink, and transmitting heat from the heat spreader to the heat sink; and
a conductive member electrically connecting the heat spreader and the heat sink, wherein:
the conductive member is a conductive tape contacting each of the heat spreader and the heat sink,
one end portion of the conductive tape is pinched between the heat spreader and the heat transfer member, and
an other end portion of the conductive tape contacts an area on a back face of the heat sink, at which the heat transfer member is not disposed.

8. An electronic device comprising:
a substrate;
a heating component mounted on the substrate, and including a heat spreader;
a heat sink disposed at a position facing the heat spreader;
a heat transfer member disposed between the heat spreader and the heat sink, and transmitting heat from the heat spreader to the heat sink; and
a conductive member electrically connecting the heat spreader and the heat sink, wherein:
the conductive member is a conductive tape contacting each of the heat spreader and the heat sink, and
the conductive tape is wrapped around the heat transfer member so as to pass between the heat spreader and the heat transfer member and between the heat sink and the heat transfer member.

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Nakanishi Yoshihide
• Yahata Norihiro
• Serita Hisashi
• Koshimuta Masaya

Classifications

• H10W70/681

  comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage · CPC title

• H10W40/611

  Bolts or screws · CPC title

• H10W40/242

  comprising thermal conductors between chips and the and the arrangements for cooling, e.g. compliant heat-spreaders · CPC title

• H10W40/237

  attached to additional arrangements for cooling · CPC title

• H10W99/00

  Subject matter not provided for in other groups of this subclass · CPC title