Method of manufacturing stacked mounting structure

Patent metadata

Field	Value
Publication number	US-10244639-B2
Application number	US-201213668982-A
Country	US
Kind code	B2
Filing date	Nov 5, 2012
Priority date	Sep 18, 2007
Publication date	Mar 26, 2019
Grant date	Mar 26, 2019

Abstract

A stacked mounting structure and a method of manufacturing stacked mounting structure are provided. The stacked mounting structure includes a plurality of members provided with a mounting area which is necessary for installing and operating components to be mounted on at least one principal surface, and an area for connections for signal transfer for operating the components to be mounted, and an electroconductive member which is disposed on the area for connections between the mutually facing members, and a cross section of the electroconductive member is same as or smaller than the area for connections, and an end portion of the electroconductive member is extended from a principal surface of one member up to a principal surface of the other member, and a height of the electroconductive member regulates a distance of the mounting area.

First claim

The invention claimed is:

1. A method of manufacturing a stacked mounting structure, the method comprising:
mounting components on a surface of a first substrate;
positioning one end portions of each of a plurality of electroconductive members to be joined to a second substrate using a jig for holding each of the plurality of electroconductive members in a predetermined position, a height of each of the plurality of electroconductive members being greater than a height of the components;
forming a conductive plating on each of the one end portions of the plurality of electroconductive members in a state of being positioned by the jig;
subsequent to the mounting, positioning and forming, joining the one end portion of each of the plurality of electroconductive members to the second substrate in the state of being positioned in the predetermined position by the jig;
mounting an other end portion of the plurality of electroconductive members on the surface of the first substrate, wherein the first and second substrates are disposed offset from each other with the electroconductive members disposed therebetween such that the one end portion is joined to the second substrate and the other end portion is joined to the first substrate;
forming a reinforcing member around the plurality of electroconductive members;
grinding the second substrate to expose the one end portion of each of the plurality of electroconductive members on a surface of the reinforcing member;
forming a metal film on the surface of the reinforcing member corresponding to each of the one end portions of the plurality of electroconductive members; and
forming a bump on each of the metal films.

2. The method of manufacturing a stacked mounting structure according to claim 1 , further comprising separating the stacked mounting structure to form individual modules by dicing the stacked mounting structure.

3. The method of manufacturing a stacked mounting structure according to claim 1 , further comprising, subsequent to forming the bumps on each of the metal films, mounting a third substrate on the metal bumps.

Assignees

• Olympus Corp

Inventors

• Nakamura Mikio
• Kondo Yu

Classifications

• H10W90/722

  between stacked chips · CPC title

• H10W90/721

  of bump connectors · CPC title

• H10W90/297

  characterised by the through-semiconductor vias [TSVs] in the stacked chips · CPC title

• H10W74/114

  by a substrate and the encapsulations · CPC title

• H10W74/01

  Manufacture or treatment · CPC title