High voltage monolithic LED chip with improved reliability

Patent metadata

Field	Value
Publication number	US-10243121-B2
Application number	US-201514699302-A
Country	US
Kind code	B2
Filing date	Apr 29, 2015
Priority date	Jun 24, 2011
Publication date	Mar 26, 2019
Grant date	Mar 26, 2019

Abstract

Monolithic LED chips are disclosed comprising a plurality of active regions on a submount, wherein the submount comprises integral electrically conductive interconnect elements in electrical contact with the active regions and electrically connecting at least some of the active regions in series. The submount also comprises an integral insulator element electrically insulating at least some of the interconnect elements and active regions from other elements of the submount. The active regions are mounted in close proximity to one another to minimize the visibility of the space during operation. The LED chips can also comprise layers structures and compositions that allow improved reliability under high current operation.

First claim

We claim:

1. A monolithic LED chip, comprising:
a plurality of active regions on a submount;
electrically conductive interconnect elements connecting at least two of said active regions, wherein said interconnect elements comprise a material and/or structure that resists electromigration, wherein said interconnect elements comprise at least one reflective layer between adjacent active regions and around the edge of said adjacent active regions, wherein said at least one reflective layer reflects light from at least one of said plurality of active regions that would otherwise reach said interconnect elements, wherein said interconnect elements interconnect said active regions from a same side of said active regions, wherein said interconnect elements are embedded within said submount.

2. The LED chip of claim 1 , wherein said interconnect elements are in said submount and in electrical contact with said active regions and electrically connect at least some of said active regions in series.

3. The LED chip of claim 1 , wherein said interconnect elements are between said submount and said active regions.

4. The LED chip of claim 1 , wherein said active regions comprise epitaxial layers and wherein the primary emission surface is an epitaxial layer.

5. The LED chip of claim 1 , wherein said active regions are on a growth substrate.

6. The LED chip of claim 5 , wherein the primary emission surface is said growth substrate.

7. The LED chip of claim 1 , wherein said interconnect elements connect at least two of said active regions in series.

8. The LED chip of claim 1 , wherein said interconnect elements comprise layer structures having separate electrically conductive and reflective layers.

9. The LED chip of claim 1 , wherein said conductive interconnect elements comprise an interconnection layer comprising a material that resists electromigration under high current operation.

10. The LED chip of claim 9 , wherein said at least one reflective layer has higher reflectivity than said interconnection layer.

11. The LED chip of claim 1 , wherein said at least one reflective layer is electrically isolated from the interconnect elements in said LED chip.

12. The LED chip of claim 9 , wherein said at least one reflective layer is below said active regions and above said interconnection layer.

13. The LED chip of claim 9 , wherein said interconnection layer comprises a plurality of layers in a stack.

14. The LED chip of claim 13 , wherein said plurality of layers comprises at least one adhesion/barrier and electrically conductive layer.

15. The LED chip of claim 1 , wherein said conductive interconnect elements comprise a conductive layer sandwiched between layers of material having higher resistance to electromigration than said conductive layer.

16. The LED chip of claim 1 , wherein said conductive interconnect elements comprises a metal alloy.

17. The LED chip of claim 1 , wherein said materials that resist electromigration can comprise Al, Ti, TiW and Pt, combinations thereof, or multiple layers thereof.

18. A monolithic LED chip, comprising:
a plurality of active regions on a submount;
interconnection layers between said active regions and said submount that carry an electrical signal to and are in electrical contact with said active regions, wherein said interconnection layers are embedded within said submount between said active regions, wherein said interconnection layers interconnect said active regions from a same side of said active regions;
a reflective layer in said submount that is positioned to reflect LED chip light that would otherwise reach said interconnection layers; and
a current spreading layer between said reflective layer and one of said active regions.

19. The LED chip of claim 18 , wherein said interconnection layers electrically connect at least some of said active regions in series.

20. The LED chip of claim 18 , wherein said reflective layer has a higher reflectivity than said interconnection layers.

21. The LED chip of claim 18 , wherein said interconnection layers comprises a material that resists electromigration under high current operation.

22. The LED chip of claim 18 , wherein said reflective layer is electrically isolated from the interconnection layers in said LED chip.

23. The LED chip of claim 18 , wherein said reflective layer is below said active regions and above said interconnection layers.

24. The LED chip of claim 18 , wherein said reflective layer is between said active regions.

25. The LED chip of claim 18 wherein said reflective layer is around the edge of said active regions.

26. A monolithic LED chip, comprising:
a plurality of active regions on a submount; and
electrically conductive interconnect elements in said submount between said active regions, wherein said interconnect elements are in electrical contact with said active regions, wherein said conductive interconnect elements comprise a first layer of electrically conductive material and a second layer of material having a higher resistance to electromigration than said first layer, wherein said interconnect elements interconnect said active regions from a same side of said active regions, and wherein said first layer extends beyond four edges of said second layer.

27. The LED chip of claim 26 , further comprising another second layer, with said first layer sandwiched between said layers of second material.

28. The LED chip of claim 26 , comprising a plurality of first and second layers arranged in stack.

29. The LED chips of claim 28 , wherein the topmost and bottommost layers comprise said second layers.

30. The LED chip of claim 27 , wherein said first layer comprises a material with a higher reflectivity than said second layers.

31. The LED chip of claim 27 , wherein said second layers comprise a material with higher reflectivity than said first layers.

32. A monolithic LED chip, comprising:
a plurality of active regions on a submount;
integral electrically conductive interconnect elements in said submount between said active regions, wherein said interconnect elements are in electrical contact with said active regions on a same side of said active regions wherein said conductive interconnect elements comprise a metal alloy interconnection layer; and
a current spreading layer between a reflective layer and one of said active regions, wherein said reflective layer is at least partially between said interconnect elements and said active regions, and wherein said reflective layer is distinct from said interconnect elements.

33. The LED chip of claim 32 , wherein said metal alloy interconnection layer exhibits reduced electromigration compared to a non-alloy conductive interconnection layer.

34. The LED chip of claim 32 , wherein said metal alloy interconnection layer comprises Al with alloying materials.

35. The LED chip of claim 34 , wherein said alloying materials comprise copper, silicon, scandium, or combinations thereof.

36. The LED chip of claim 32 , wherein said metal alloy interconnection layer comprises a metal with an alloying material comprising copper, silicon, scandium, or combinations thereof.

37. The LED chip of claim 5 , wherein said active regions are between

Assignees

• Cree Inc

Inventors

• Williams Bradley E
• Haberern Kevin W
• Langsdorf Bennett D
• Breva Manuel L

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W90/00

  Package configurations · CPC title