Optoelectronic device subassemblies and methods of manufacturing the same

Patent metadata

Field	Value
Publication number	US-10243111-B2
Application number	US-201715631361-A
Country	US
Kind code	B2
Filing date	Jun 23, 2017
Priority date	Jun 29, 2016
Publication date	Mar 26, 2019
Grant date	Mar 26, 2019

Abstract

The present disclosure describes wafer-level processes for fabricating optoelectronic device subassemblies that can be mounted, for example, to a circuit substrate, such as a flexible cable or printed circuit board, and integrated into optoelectronic modules that include one or more optical subassemblies stacked over the optoelectronic device subassembly. The optoelectronic device subassembly can be mounted onto the circuit substrate using solder reflow technology even if the optical subassemblies are composed of materials that are not reflow compatible.

First claim

What is claimed is:

1. A method of manufacturing an optoelectronic module, the method comprising:
fabricating optoelectronic device subassemblies in a wafer-level process;
mounting a singulated one of the optoelectronic device subassemblies onto a circuit substrate; and
subsequently attaching one or more optical subassemblies to the optoelectronic device subassembly mounted on the circuit substrate, wherein attaching one or more optical subassemblies to the optoelectronic device subassembly includes attaching at least two optical subassemblies in a stack over the optoelectronic device subassembly mounted on the circuit substrate.

2. The method of claim 1 wherein mounting the singulated optoelectronic device subassembly onto the circuit substrate includes using solder reflow technology.

3. The method of claim 2 wherein the at least two optical subassemblies are composed of materials that are not reflow compatible.

4. The method of claim 1 wherein mounting a singulated one of the optoelectronic device subassemblies onto a circuit substrate includes mounting the singulated optoelectronic device subassembly onto a flexible cable.

5. The method of claim 1 wherein the at least two optical subassemblies include a light guide and at least one optical diffuser or IR absorber.

6. The method of claim 1 wherein the at least two optical subassemblies include at least one optical diffuser or IR absorber.

7. The method of claim 1 including placing at least one of the at least two optical subassemblies onto a ledge of the optoelectronic device subassembly.

8. The method of claim 1 including placing a first one of the at least two optical subassemblies onto a first ledge of the optoelectronic device subassembly and placing a second one of the at least two optical subassemblies onto a second ledge of the optoelectronic device subassembly.

9. The method of claim 8 wherein the first and second ledges are recessed.

10. A wafer-level method of manufacturing optoelectronic device subassemblies, the method comprising:
providing a substrate on which optoelectronic devices are mounted;
forming respective trenches in respective regions of opaque encapsulant separating adjacent ones of the optoelectronic devices from one another, wherein each trench extends at least partially through the opaque encapsulant, the opaque encapsulant being substantially opaque to a wavelength or range of wavelengths of radiation emitted by or detectable by the optoelectronic devices; and
dicing the substrate at locations of the trenches so as to form singulated optoelectronic device subassemblies each of which includes at least one of the optoelectronic devices surrounded laterally by the opaque encapsulant.

11. The method of claim 10 further including removing, prior to dicing the substrate to form the singulated optoelectronic device subassemblies, some of the opaque encapsulant at upper edges of each trench so as to form steps adjacent the trench.

12. The method of claim 10 further including providing a protective covering over wiring for the optoelectronic devices.

13. The method of claim 12 further including, after providing the protective covering but before forming the respective trenches in the opaque encapsulant:
providing a transparent encapsulant over the substrate, including the optoelectronic devices, the transparent encapsulant being substantially transparent to a wavelength or range of wavelengths of radiation emitted by or detectable by the optoelectronic devices;
removing the transparent encapsulant from regions where the opaque encapsulant is to be provided; and
providing the opaque encapsulant in regions where the transparent encapsulant was removed.

14. The method of claim 12 providing at least one of the transparent encapsulant or opaque encapsulant by a vacuum injection technique.

15. The method of claim 12 wherein providing a protective covering includes providing the PDMS coating by a spray coating technique.

16. The method of claim 12 wherein providing a protective covering includes providing an epoxy containing an oxide filler.

17. The method of claim 10 further including:
mounting at least one of the singulated optoelectronic device subassemblies on a printed circuit board.

18. The method of claim 10 further including:
mounting at least one of the singulated optoelectronic device subassemblies on a flexible substrate.

19. The method of claim 10 further including mounting at least one of the singulated optoelectronic device subassemblies using a solder reflow process.

20. A method of manufacturing an optoelectronic module, the method comprising:
fabricating optoelectronic device subassemblies in a wafer-level process;
mounting a singulated one of the optoelectronic device subassemblies onto a circuit substrate; and
subsequently attaching one or more optical subassemblies to the optoelectronic device subassembly mounted on the circuit substrate, wherein attaching the one or more optical subassemblies includes placing at least one of the optical subassemblies onto a recessed ledge of the optoelectronic device subassembly.

Assignees

• Heptagon Micro Optics Pte Ltd
• Ams Sensors Singapore Pte Ltd

Inventors

• Rudmann Hartmut
• Yu Qichuan
• Gubser Simon
• Tesanovic Bojan
• Yi Xu
• Ong Eunice Ho Hui
• Liu Hongyuan
• Wang Ji
• Lua Edmund Koon Tian
• Paing Myo
• Tang Jian
• Lee Ming Jie

Classifications

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W90/00 Primary

  Package configurations · CPC title

• H01L25/167

  Electricity · mapped topic

• H01L2933/0033

  Electricity · mapped topic

• H01L2224/73265

  Electricity · mapped topic