Method for centering a tire component
US-2016263847-A1 · Sep 15, 2016 · US
Moldable photovoltaic solar cell module
US10243095B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10243095-B2 |
| Application number | US-201816040190-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 19, 2018 |
| Priority date | Sep 22, 2011 |
| Publication date | Mar 26, 2019 |
| Grant date | Mar 26, 2019 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A method is provided for making a molded photovoltaic module. The module includes a flexible polymeric flex-circuit substrate having an electrically conductive printed wiring pattern and solder pads defined on it. Small photovoltaic cells are affixed to the flex-circuit substrate by back-surface contacts in electrical contact with the solder pads. At least one thermoformable polymeric film is joined to the flex-circuit substrate. Each said solder pad comprises a solder composition that, after an initial melt, has a melting point that lies above at least a portion of the temperature range for thermoforming the polymeric film.
First claim
Opening claim text (preview).
What is claimed is: 1. A method for making a photovoltaic module, comprising: providing a flexible polymeric flex-circuit substrate; joining a thermoformable polymeric film having a thermoforming temperature range to the flex-circuit substrate; printing an electrically conductive printed wiring pattern on the flex-circuit substrate; adding a plurality of solder-paste solder-pad precursors on the flex-circuit substrate in electrical continuity with portions of the printed wiring pattern; adding a plurality of photovoltaic cells to the flex-circuit substrate, each said cell having two back-surface electrical contacts, by affixing each said contact to a respective one of said solder-pad precursors; reflowing the solder paste of the solder-pad precursors at a reflow temperature; wherein the reflow temperature is below the thermoforming temperature range; and wherein the solder paste has a variable-temperature solder composition such that after the reflow, the solder pads have a melting point that lies above at least a portion of the temperature range for thermoforming the polymeric film; wherein the reflow temperature of the solder paste of the solder-pad precursors is at least 30° C. less than the melting point of the solder pads after the reflow. 2. The method of claim 1 , further comprising thermoforming the photovoltaic module into a three-dimensional shape at a thermoforming temperature below the solder-pad melting point. 3. The method of claim 1 , further comprising removing portions of the flex-circuit substrate so as to define gore panels therein that have outlines adapted to conform to a specified post-forming shape after the photovoltaic module is thermoformed.
Assignees
Inventors
Classifications
Electricity · mapped topic
- H01L31/0516Primary
Electricity · mapped topic
Monocrystalline silicon PV cells · CPC title
Electricity · mapped topic
Photovoltaic [PV] energy · CPC title
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Frequently asked questions
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- What does patent US10243095B2 cover?
- A method is provided for making a molded photovoltaic module. The module includes a flexible polymeric flex-circuit substrate having an electrically conductive printed wiring pattern and solder pads defined on it. Small photovoltaic cells are affixed to the flex-circuit substrate by back-surface contacts in electrical contact with the solder pads. At least one thermoformable polymeric film is j…
- Who is the assignee on this patent?
- Nat Tech & Eng Solutions Sandia Llc
- What technology area does this patent fall under?
- Primary CPC classification H01L31/0516. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Mar 26 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).