Image sensor
US-12094907-B2 · Sep 17, 2024 · US
US10243018B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10243018-B2 |
| Application number | US-201514720312-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 22, 2015 |
| Priority date | Jun 28, 2011 |
| Publication date | Mar 26, 2019 |
| Grant date | Mar 26, 2019 |
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Official abstract text for this publication.
A device includes a three-dimensionally curved substrate, a patterned metal layer disposed on the curved substrate, and an array of optoelectronic devices, each optoelectronic device including an optoelectronic structure supported by the curved substrate. Each optoelectronic structure includes an inorganic semiconductor stack. The device further includes a set of contact stripes extending across the curved substrate, each optoelectronic structure being coupled to a respective contact stripe of the set of contact stripes. The array of optoelectronic devices is secured to the curved substrate via a bond between the patterned metal layer and the set of contact stripes.
Opening claim text (preview).
What is claimed is: 1. A device comprising: a three-dimensionally curved substrate; a patterned metal layer disposed on the curved substrate; an array of optoelectronic devices, each optoelectronic device comprising an optoelectronic structure supported by the curved substrate, wherein each optoelectronic structure comprises an inorganic semiconductor stack; and a set of contact stripes extending across the curved substrate, each optoelectronic structure being coupled to a r…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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