Optical electronic-chip identification writer using dummy C4 bumps

Patent metadata

Field	Value
Publication number	US-10242951-B1
Application number	US-201715827063-A
Country	US
Kind code	B1
Filing date	Nov 30, 2017
Priority date	Nov 30, 2017
Publication date	Mar 26, 2019
Grant date	Mar 26, 2019

Abstract

Embodiments of the invention are directed to a method and resulting structures for forming optically readable chip identification (CID) codes using dummy controlled collapse chip connection (C4) bumps. In a non-limiting embodiment of the invention, a product chip is formed on a wafer. A chip location identifier including a plurality of controlled collapse chip connection (C4) bumps is formed on a surface of the product chip. The chip location identifier encodes a unique location of the product chip on the wafer prior to dicing. The plurality of C4 bumps are arranged into one or more optically readable alphanumeric characters.

First claim

What is claimed is:

1. A method for forming a semiconductor device, the method comprising:
forming a product chip on a wafer; and
forming a chip location identifier comprising a plurality of controlled collapse chip connection (C4) bumps on a surface of the product chip, the chip location identifier encoding a unique location of the product chip on the wafer prior to dicing;
wherein the plurality of C4 bumps are arranged into one or more optically readable alphanumeric characters that comprise a hexadecimal code, wherein each hexadecimal digit is mapped to a unique dot pattern of C4 bumps.

2. The method of claim 1 , wherein the hexadecimal code is a four or five digit hexadecimal code.

3. The method of claim 1 , wherein each unique dot pattern comprises a three C4 bump wide by five C4 bump high grid.

4. The method of claim 1 , wherein each unique dot pattern comprises a 1-dimensional C4 bump pattern.

5. The method of claim 1 further comprising dicing the wafer to detach the product chip.

6. The method of claim 1 , wherein the plurality of C4 bumps are dummy C4 bumps.

7. The method of claim 1 , wherein the alphanumeric characters comprise a base 10 code or a binary code.

8. The method of claim 1 , wherein the chip location identifier is formed in a corner region of the product chip.

9. The method of claim 1 , wherein the chip location identifier is formed in an electrically inactive central or peripheral region of the product chip.

10. A method for encoding a chip location identifier onto a surface of an integrated circuit (IC) chip, the method comprising:
forming the IC chip on a wafer;
forming a photoresist layer over the surface of the IC chip;
patterning the photoresist layer to expose one or more portions of the IC chip, the one or more exposed portions arranged to form a hexadecimal code, the hexadecimal code encoding chip location identification data; and
forming a controlled collapse chip connection (C4) bump on each exposed portion of the IC chip.

11. The method of claim 10 , wherein the photoresist layer is patterned using a direct write laser exposure or programmable lithography.

12. The method of claim 10 , wherein the chip location identification data comprises a unique location of the chip on the wafer prior to dicing.

13. The method of claim 10 , wherein the chip location identification data is optically readable.

14. The method of claim 10 further comprising recording the chip location identification data in a data structure.

15. The method of claim 14 , wherein the chip location identification data recorded in the data structure comprises a unique location of the IC chip on the wafer prior to dicing.

16. A semiconductor device comprising:
an integrated circuit (IC) chip; and
a chip location identifier comprising a plurality of controlled collapse chip connection (C4) bumps on a surface of the IC chip, the chip location identifier encoding a unique location of the IC chip on a wafer prior to dicing;
wherein the plurality of C4 bumps are arranged into one or more alphanumeric characters that comprise a hexadecimal code, wherein each hexadecimal digit is mapped to a unique dot pattern of C4 bumps.

17. The semiconductor device of claim 16 , wherein the alphanumeric characters comprise a hexadecimal code.

18. The semiconductor device of claim 17 , wherein the hexadecimal code is a four or five digit hexadecimal code.

Assignees

• IBM

Inventors

• Piper Daniel

Classifications

• H10P54/00

  Cutting or separating of wafers, substrates or parts of devices · CPC title

• H10W72/01255

  by using masks · CPC title

• H10W72/01251

  Changing the shapes of bumps · CPC title

• H10W72/01235

  by plating, e.g. electroless plating or electroplating · CPC title

• H10W72/952

  comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title