Free access floor structure, and manufacturing apparatus and carrier apparatus adapted for floor structure

Patent metadata

Field	Value
Publication number	US-10240350-B2
Application number	US-201415101603-A
Country	US
Kind code	B2
Filing date	Dec 2, 2014
Priority date	Dec 3, 2013
Publication date	Mar 26, 2019
Grant date	Mar 26, 2019

Abstract

A free access floor structure to install a manufacturing apparatus such as a semiconductor manufacturing apparatus, in a short time, and a manufacturing apparatus and a carrier apparatus adapted for the floor structure. An embodiment of the manufacturing apparatus includes an apparatus-side connector which is provided, facing downward, to a bottom plate of a manufacturing apparatus. A floor structure of an embodiment includes a floor plate to be worked into a floor surface. The floor structure includes a floor-side connector which is provided, facing upward, to the floor plate so as to be connected with the apparatus-side connector according to a lowering operation of the manufacturing apparatus. An installation step (mounting step, piping/wiring step) of the manufacturing apparatus may thereby be performed in one step. As a result, the labor and the time required to install the manufacturing apparatus may be saved.

First claim

The invention claimed is:

1. A free access floor structure comprising:
a floor plate that is installable on a floor surface, and
a floor-side connector which is connectable to one of a gas supply pipe and an exhaust gas pipe, and is provided to the floor plate so that, when the floor plate is installed on the floor surface, the floor-side connector faces upward, wherein
the free access floor structure is configured so that a semiconductor manufacturing apparatus, which includes a bottom plate and an apparatus-side connector provided to the bottom plate, is mountable on the free access floor structure through a lowering operation of the semiconductor manufacturing apparatus in which the semiconductor manufacturing apparatus is lowered integrally as one body together with the apparatus-side connector, toward the floor plate, with the floor plate installed on the floor surface, the floor-side connector facing upward, and the apparatus-side connector facing downward, and
the floor-side connector is configured so that the apparatus-side connector and the floor-side connector complete a connection to each other through the lowering operation, to thereby mount the semiconductor manufacturing apparatus on the free access floor structure through the lowering operation with the semiconductor manufacturing apparatus being connectable to the one of a gas supply line and an exhaust gas pipe through the connected apparatus-side connector and the floor-side connector,
so that the lowering operation thereby operates as a single operation to mount the semiconductor manufacturing apparatus on the free access floor structure and connect the apparatus-side connector and the floor-side connector to each other.

2. The free access floor structure according to claim 1 , wherein the floor plate is provided with a first positioning mechanism to position the bottom plate of the manufacturing apparatus at a predetermined position with respect to the floor plate, so that fitting positions of the apparatus-side connector and the floor-side connector coincide with each other in a horizontal direction.

3. The free access floor structure according to claim 1 , wherein the floor plate is provided with a second positioning mechanism to position, in a width direction, a frame of a carrier apparatus carrying the manufacturing apparatus.

4. The free access floor structure according to claim 1 , wherein
the floor-side connector is attached to a through hole of the floor plate without protruding upward from an upper surface of the floor plate, and
the free access floor structure comprises a cover provided to the through hole in a detachable/attachable manner.

5. A semiconductor manufacturing apparatus comprising:
a bottom plate,
an apparatus-side connector provided to the bottom plate, and
a first positioning target mechanism provided to the bottom plate, wherein
the semiconductor manufacturing apparatus is configured so that the semiconductor manufacturing apparatus is mountable on a free access floor structure, which includes a floor plate, a floor-side connector provided to the floor plate and connectable to one of a gas supply pipe and an exhaust gas pipe, and a first positioning mechanism provided to the floor plate, through a lowering operation of the semiconductor manufacturing apparatus in which the semiconductor manufacturing apparatus is lowered integrally as one body together with the apparatus-side connector, toward the floor plate, with the floor plate installed on a floor surface, the floor-side connector facing upward, and the apparatus-side connector facing downward, and
the apparatus-side connector is configured so that the apparatus-side connector and the floor-side connector complete a connection to each other through the lowering operation, and the first positioning target mechanism is configured to cooperate with the first positioning mechanism through the lowering operation to position the bottom plate with respect to the floor plate, to thereby mount the semiconductor manufacturing apparatus on the free access floor structure through the lowering operation with the semiconductor manufacturing apparatus being connectable to the one of a gas supply line and an exhaust gas pipe through the connected apparatus-side connector and the floor-side connector,
so that the lowering operation thereby operates as a single operation to mount the semiconductor manufacturing apparatus on the free access floor structure and connect the apparatus-side connector and the floor-side connector to each other.

6. The semiconductor manufacturing apparatus according to claim 5 , wherein
one of the first positioning mechanism and the first positioning target mechanism includes three V-grooves and the other of the first positioning mechanism and the first positioning target mechanism includes three spherical bodies, and
the first positioning target mechanism cooperates with the first positioning mechanism so that the bottom plate is positioned with respect to the floor plate by the spherical bodies becoming fitted into the corresponding V-grooves.

7. The semiconductor manufacturing apparatus according to claim 6 , wherein the three V-grooves are formed along a substantially Y shape in plan view.

8. An apparatus comprising:
a free access floor structure including
a floor plate that is installable on a floor surface, and
a floor-side connector that is connectable to one of a gas supply pipe and an exhaust gas pipe, and is provided to the floor plate so that, when the floor plate is installed on the floor surface, the floor-side connector faces upward, and

a semiconductor manufacturing apparatus including
a bottom plate, and
an apparatus-side connector provided to the bottom plate,

wherein
the semiconductor manufacturing apparatus and the free access floor structure are configured so that the semiconductor manufacturing apparatus is mountable on the free access floor structure through a lowering operation of the semiconductor manufacturing apparatus in which the semiconductor manufacturing apparatus is lowered integrally as one body together with the apparatus-side connector, toward the floor plate, with the floor plate installed on a floor surface, the floor-side connector facing upward, and the apparatus-side connector facing downward, and
the apparatus-side connector and the floor-side connector are configured so that the apparatus-side connector and the floor-side connector complete a connection to each other through the lowering operation, to thereby mount the semiconductor manufacturing apparatus on the free access floor structure through the lowering operation with the semiconductor manufacturing apparatus being connectable to the one of a gas supply line and an exhaust gas pipe through the connected apparatus-side connector and the floor-side connector,
so that the lowering operation thereby operates as a single operation to mount the semiconductor manufacturing apparatus on the free access floor structure and connect the apparatus-side connector and the floor-side connector to each other.

Assignees

• Sanyo Co Ltd
• Aist

Inventors

• Anpo Tadanari
• Hara Shiro

Classifications

• H10P72/3408

  Docking arrangements · CPC title

• H10P72/3214

  by means of a cart or a vehicle · CPC title

• B62B3/0643

  the wheels remaining stationary while the supporting surface is lifted · CPC title

• B62B3/06

  for simply clearing the load from the ground (masted lift trucks B66F) · CPC title

• B62B2205/06

  Foldable with a scissor-like mechanism · CPC title