Systems and methods for MEMS-based cross-point electrical switching

US10239749B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10239749-B2
Application numberUS-201715834185-A
CountryUS
Kind codeB2
Filing dateDec 7, 2017
Priority dateSep 16, 2013
Publication dateMar 26, 2019
Grant dateMar 26, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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Abstract

Official abstract text for this publication.

An electrical cross-point switch N inputs, each at least 10 Gbps, connected to input transmission lines; M outputs, each at least 10 Gbps, connected to output transmission lines; at least two Radio Frequency (RF) Microelectromechanical systems (MEMS) switches selectively interconnecting each input transmission line and each output transmission line; and control and addressing circuitry configured to selectively control interconnection of each input transmission line and each output transmission line via the at least two RF MEMS switches. The at least two RF MEMS switches can be embedded in each input transmission line and each output transmission line. The input transmission lines and the output transmission lines can each be partially shielded microwave transmission lines.

First claim

Opening claim text (preview).

What is claimed is: 1. An electrical cross-point switch, comprising: N inputs, each at least 10 Gbps, electrically connected to input transmission lines; M outputs, each at least 10 Gbps, electrically connected to output transmission lines; at least two Radio Frequency (RF) Microelectromechanical systems (MEMS) switches selectively and electrically interconnecting each input transmission line and each output transmission line; and control and addressing circuitry configured to selectively control interconnection of each input transmission line and each output transmission line via the at least two RF MEMS switches, wherein the at least two RF MEMS switches are each formed on a first die with the input transmission lines and the output transmission lines, and wherein the at least two RF MEMS switches comprise three RF MEMS with a first RF MEMS switch on the respective input transmission line, a second RF MEMS switch on the respective output transmission line, and a third RF MEMS switch interconnecting the respective input transmission line and the respective output transmission line. 2. The electrical cross-point switch of claim 1 , wherein the at least two RF MEMS switches are embedded in each input transmission line and each output transmission line. 3. The electrical cross-point switch of claim 1 , wherein the input transmission lines and the output transmission lines are each partially shielded microwave transmission lines. 4. The electrical cross-point switch of claim 1 , wherein N and M are equal and greater than or equal to 32. 5. The electrical cross-point switch of claim 1 , wherein the control and addressing circuitry is formed on a second die interconnected to the first die through silicon vias, micro bumps, or metal pillars. 6. The electrical cross-point switch of claim 5 , wherein the first die and the second die are flip-chip attached. 7. The electrical cross-point switch of claim 1 , wherein the at least two RF MEMS switches are each formed on a first die with interconnections between one another through one of differential semi-coax style (D-SC) and single semi-coax (S-SC) structures. 8. The electrical cross-point switch of claim 1 , wherein the control and addressing circuitry comprises digital control implemented on a separate substrate from each of the at least two RF MEMS switches, the input transmission lines, and the output transmission lines. 9. The electrical cross-point switch of claim 1 , wherein the control and addressing circuitry are implemented in CMOS. 10. The electrical cross-point switch of claim 1 , wherein the at least two RF MEMS switches utilize a row fan-out to column fan-out between the input transmission lines and the output transmission lines. 11. The electrical cross-point switch of claim 1 , wherein the at least two RF MEMS switches utilize a simple cantilever MEMS switch each with a cantilever beam, a pull-down electrode, and an RF transmission line electrode. 12. The electrical cross-point switch of claim 1 , wherein the at least two RF MEMS switches utilize a direct-contact cantilever MEMS switch each with a cantilever beam, a pull-down electrode, an RF transmission line electrode, and a dimple on the cantilever beam that makes contact with the RF transmission line electrode during an ON state. 13. An electrical cross-point switch system, comprising: a first die comprising N inputs, each at least 10 Gbps, electrically connected to input transmission lines, M outputs, each at least 10 Gbps, electrically connected to output transmission lines, and at least two Radio Frequency (RF) Microelectromechanical systems (MEMS) switches selectively and electrically interconnecting each input transmission line and each output transmission line; a second die comprising control and addressing circuitry configured to selectively control interconnection of each input transmission line and each output transmission line via the at least two RF MEMS switches; and interconnections between the one or more first die and the second die through silicon vias, micro bumps, or metal pillars, wherein the at least two RF MEMS switches comprise three RF MEMS with a first RF MEMS switch on the respective input transmission line, a second RF MEMS switch on the respective output transmission line, and a third RF MEMS switch interconnecting the respective input transmission line and the respective output transmission line. 14. The electrical cross-point switch system of claim 13 , wherein the at least two RF MEMS switches are embedded in each input transmission line and each output transmission line. 15. The electrical cross-point switch system of claim 13 , wherein the input transmission lines and the output transmission lines are each partially shielded microwave transmission lines. 16. The electrical cross-point switch system of claim 13 , wherein the at least two RF MEMS switches utilize a row fan-out to column fan-out between the input transmission lines and the output transmission lines. 17. The electrical cross-point switch system of claim 13 , wherein the at least two RF MEMS switches utilize a cantilever MEMS switch each with a cantilever beam, a pull-down electrode, and an RF transmission line electrode. 18. A method, comprising: electrically receiving N inputs, each at least 10 Gbps, at input transmission lines; selectively and electrically interconnecting each input transmission line to a respective output transmission line via at least two Radio Frequency (RF) Microelectromechanical systems (MEMS) switches; and controlling the at least two RF MEMS switches to provide cross-point switching between the N inputs and M outputs, wherein the at least two RF MEMS switches are each formed on a first die with the input transmission lines and the output transmission lines, and wherein the at least two RF MEMS switches comprise three RF MEMS with a first RF MEMS switch on the respective input transmission line, a second RF MEMS switch on the respective output transmission line, and a third RF MEMS switch interconnecting the respective input transmission line and the respective output transmission line.

Assignees

Inventors

Classifications

  • H04Q11/00Primary

    Selecting arrangements for multiplex systems (multiplex systems H04J) · CPC title

  • Coordinate switches, crossbar, 4/2 with relays, coupling field · CPC title

  • Relay switches · CPC title

  • Switch and router aspects · CPC title

  • characterised by the shape · CPC title

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What does patent US10239749B2 cover?
An electrical cross-point switch N inputs, each at least 10 Gbps, connected to input transmission lines; M outputs, each at least 10 Gbps, connected to output transmission lines; at least two Radio Frequency (RF) Microelectromechanical systems (MEMS) switches selectively interconnecting each input transmission line and each output transmission line; and control and addressing circuitry configur…
Who is the assignee on this patent?
Ciena Corp
What technology area does this patent fall under?
Primary CPC classification H04Q11/00. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Mar 26 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).