Laminated body, molded body, molded product, and method for manufacturing molded product

US10239290B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10239290-B2
Application numberUS-201414780792-A
CountryUS
Kind codeB2
Filing dateMar 26, 2014
Priority dateMar 29, 2013
Publication dateMar 26, 2019
Grant dateMar 26, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A resin sheet is manufactured by: forming a rapidly-cooled transparent polypropylene sheet by rapidly cooling a molten polypropylene resin; laminating on the rapidly-cooled transparent polypropylene sheet a resin layer of polyurethane resin, the polyurethane resin having a tensile-rupture elongation in a range from 150% to 900% and a softening point in a range from 50 degrees C. to 180 degrees C.; and laminating a print layer on the resin layer. A molded article having a non-planar molding made of the resin sheet is provided by insert molding. The molding is formed into a complicated shape where a part of the molding has: 150% or more of an elongation ratio; 0.8 or less of a film-thickness ratio (B/A) before and after the sheet is molded; and/or a surface area ratio (Y/X) before and after the sheet is molded in a range from 1.5 to 5.

First claim

Opening claim text (preview).

The invention claimed is: 1. A laminate comprising: a transparent polypropylene layer (A) of a polypropylene resin; and a resin layer (B) of a polyurethane resin, the polyurethane resin having a tensile-rupture elongation in a range from 150% to 900% and a softening point in a range from 50 degrees C. to 180 degrees C., the transparent polypropylene layer (A) and the resin layer (B) being laminated with each other, wherein the transparent polypropylene layer (A) has 1 J/g or more of an exothermic peak at a low-temperature side of the maximum endothermic peak in a differential scanning calorimetry (DSC) curve, and the transparent polypropylene layer (A) is formed by rapidly cooling a molten resin of the polypropylene resin. 2. The laminate according to claim 1 , wherein the molten resin is rapidly cooled using a cooling roller whose surface temperature is kept in a range from a dew point to 50 degrees C. to form the transparent polypropylene layer (A). 3. The laminate according to claim 1 , wherein the resin layer (B) is made of a resin obtained by reacting at least diisocyanate, a high-molecular-weight polyol and a chain extender, the high-molecular-weight polyol being selected from polyether polyol and polycarbonate polyol. 4. The laminate according to claim 1 , wherein at least a part of a side of the resin layer (B) opposite to a side adjacent to the transparent polypropylene layer (A) is applied with printing. 5. A laminate comprising: a transparent polypropylene layer (A) of a polypropylene resin; and a resin layer (B) of a polyurethane resin, the polyurethane resin having a tensile-rupture elongation in a range from 150% to 900% and a softening point in a range from 50 degrees C. to 180 degrees C., the transparent polypropylene layer (A) and the resin layer (B) being laminated with each other, wherein the transparent polypropylene layer (A) has 4 μm or less of an average spherulite radius, 600 or less per mm 2 of an average spherulite number in a cross section of the sheet, 0.896 g/cm 3 or less of a solid density, less than 90 J/g of a fusion enthalpy ΔH of a maximum endothermic peak in a differential scanning calorimetry (DSC) curve, 90% or more of a glossiness on at least one side, and 1 J/g or more of an exothermic peak at a low-temperature side of the maximum endothermic peak in a differential scanning calorimetry (DSC) curve.

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What does patent US10239290B2 cover?
A resin sheet is manufactured by: forming a rapidly-cooled transparent polypropylene sheet by rapidly cooling a molten polypropylene resin; laminating on the rapidly-cooled transparent polypropylene sheet a resin layer of polyurethane resin, the polyurethane resin having a tensile-rupture elongation in a range from 150% to 900% and a softening point in a range from 50 degrees C. to 180 degrees …
Who is the assignee on this patent?
Idemitsu Unitech Co Ltd
What technology area does this patent fall under?
Primary CPC classification B32B27/08. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Mar 26 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).