Laser wire processing device

Patent metadata

Field	Value
Publication number	US-10239159-B2
Application number	US-201615199896-A
Country	US
Kind code	B2
Filing date	Jun 30, 2016
Priority date	Jun 30, 2016
Publication date	Mar 26, 2019
Grant date	Mar 26, 2019

Abstract

A wire guide and a laser wire-processing device that includes a wire guide are provided. The laser wire-processing device includes a housing and an aperture in a side of the housing, wherein the aperture defines a longitudinal axis that is substantially perpendicular to the aperture. The laser wire-processing device also includes a backstop arranged in the housing and aligned with the longitudinal axis, the backstop defining a wire-contact surface in a facing relationship with the aperture. The laser wire-processing device also includes a wire guide arranged in the housing to manipulate a wire inserted through the aperture into a desired position relative to the longitudinal axis between the aperture and the backstop. The laser wire-processing device also includes a laser operable to direct a laser beam toward an insulation layer of the wire. The wire guide could be a tube arranged in the device or a backstop guide.

First claim

What is claimed is:

1. A laser wire-processing device, comprising:
a housing;
an aperture in a side of the housing, wherein a longitudinal axis extends through and is substantially perpendicular to the aperture;
a wire guide arranged in the housing to manipulate a wire inserted through the aperture into a cutting position along and relative to the longitudinal axis; and
a laser operable to direct at least one laser beam toward an insulation layer of the wire while in the cutting position.

2. The laser wire-processing device of claim 1 , wherein the wire guide comprises a plurality of tubes each having different passageway dimensions relative to each other, and wherein the tubes of the plurality of tubes are configured for selective insertion into the aperture for use with a respective wire each having different exterior dimensions relative to each other.

3. The laser wire-processing device of claim 1 , wherein the wire guide comprises a tube disposed in the aperture and extending along the longitudinal axis toward a backstop such that a longitudinal symmetry axis of the tube is substantially coaxial with the longitudinal axis, and wherein the wire guide receives the wire through a passageway therethrough.

4. The laser wire-processing device of claim 3 , wherein the backstop is arranged in the housing and aligned with the longitudinal axis, the backstop defining a wire contact surface in a facing relationship with the aperture,
wherein the backstop is movable toward and away from the aperture, and wherein the tube is slidably disposed within the aperture; wherein, while the wire contact surface contacts an end of the tube and moves in a direction of the aperture, the tube is urged through the aperture out of the housing.

5. The laser wire-processing device of claim 3 , wherein the wire guide further comprises a first centering member arranged in the passageway of the tube at a first location along the longitudinal symmetry axis, wherein the first centering member urges the wire in the passageway toward the longitudinal symmetry axis.

6. The laser wire-processing device of claim 5 , wherein the tube defines a first end portion and a second end portion along the longitudinal symmetry axis, and a middle portion between the first end portion and the second end portion, wherein the middle portion defines a laser cutting region; and wherein the first location of the first centering member is in the first end portion.

7. The laser wire-processing device of claim 6 , wherein the tube includes a laser-access window arranged in the middle portion.

8. The laser wire-processing device of claim 5 , wherein the first centering member includes a first plurality of compliant fronds on an interior surface of the passageway, wherein the first plurality of compliant fronds extend from the interior surface toward the longitudinal symmetry axis.

9. The laser wire-processing device of claim 5 , wherein the first centering member includes a plurality of leaf springs arranged around an interior surface of the passageway, wherein a pair of ends of each respective leaf spring is attached to the interior surface of the passageway, and wherein the leaf spring between the ends extends from the interior surface of the passageway toward the longitudinal symmetry axis of the passageway.

10. The laser wire-processing device of claim 5 , wherein the first centering member includes an elastomeric grommet attached to an interior surface of the passageway and extending toward the longitudinal symmetry axis of the tube.

11. The laser wire-processing device of claim 10 , wherein the elastomeric grommet expands toward the longitudinal symmetry axis when a pressure within the passageway is reduced, and, wherein the elastomeric grommet, in an expanded state, extend further toward the longitudinal symmetry axis of the passageway than in an unexpanded state.

12. The laser wire-processing device of claim 3 , wherein the at least one laser beam is rotatable about the longitudinal axis to expose an outer periphery 125 of the insulation layer to the at least one laser beam.

13. The laser wire-processing device of claim 3 , wherein the tube includes at least one opening that is configured to couple to a vacuum system, the vacuum system operable to displace at least one of air and particulates from the passageway.

14. The laser wire-processing device of claim 3 , wherein the backstop is arranged in the housing and aligned with the longitudinal axis, the backstop defining a wire-contact surface in a facing relationship with the aperture; and
a backstop clamp arranged on the backstop and aligned with an end of the tube, wherein the backstop clamp is selectively movable from an unclamped position to a clamped position to grip an end of the wire extending through the passageway of the tube.

15. A method for processing a wire with an insulation layer, comprising:
arranging a wire guide, comprising a tube, in an aperture of a laser wire-processing device, the tube having a passageway defined therethrough, wherein a longitudinal symmetry axis of the passageway is aligned with a longitudinal axis of the aperture;
inserting the wire into the wire guide,
operating at least one laser beam in the laser wire-processing device to at least partially sever the insulation layer around a periphery of the wire at a location along the longitudinal axis, forming a processed wire; and
removing the processed wire from the laser wire-processing device.

16. The method of claim 15 , further comprising removing a portion of the insulation layer from the processed wire.

17. The method of claim 15 , wherein inserting the wire into the wire guide comprises urging the wire toward the longitudinal symmetry axis of the passageway of the tube.

18. A wire guide, comprising:
a tube configured for insertion into a laser wire-processing device, the tube forming a passageway that defines a longitudinal symmetry axis, wherein the passageway receives a wire therethrough; and
a first centering member arranged in the passageway of the tube at a first location along the longitudinal symmetry axis, wherein the first centering member urges the wire in the passageway toward the longitudinal symmetry axis of the passageway.

19. The wire guide of claim 18 , wherein the tube is substantially optically transparent to a wavelength of light of a laser beam.

20. The wire guide of claim 18 , wherein the tube includes a laser-access window.

Assignees

• Boeing Co

Inventors

• Evans Nick S
• Mitchell Bradley J
• Blumenkrantz Mark

Classifications

• B23K2101/38

  Conductors · CPC title

• B23K26/123

  in an atmosphere of particular gases · CPC title

• B23K26/127

  in an enclosure · CPC title

• B23K26/0604

  by a combination of beams · CPC title

• B23K2101/34

  Coated articles {; Surface treated articles} · CPC title