Electromagnetic interference containment system

Patent metadata

Field	Value
Publication number	US-10238016-B2
Application number	US-201715445065-A
Country	US
Kind code	B2
Filing date	Feb 28, 2017
Priority date	May 30, 2014
Publication date	Mar 19, 2019
Grant date	Mar 19, 2019

Abstract

A chassis includes a flash module comprising a cover and an integrated connector, a metal stiffener, an electromagnetic interference (EMI) gasket, and a midplane. The flash module is connected to the midplane using the integrated connector, the integrated connector extends past the cover of the flash module, and, when the flash module is connected to the midplane, the cover of the flash module is in direct contact with the EMI gasket, in which the metal stiffener is interposed between the EMI gasket and the midplane.

First claim

What is claimed is:

1. An electromagnetic interference (EMI) containment system, comprising:
a chassis, comprising:
a front section, comprising:
a module bay configured to accommodate a plurality of removably insertable flash modules;

a rear section that is EMI contained; and
a separation section that separates the front section from the rear section, the separation section comprising:
a metal stiffener, comprising:
a first plurality of openings, configured to enable airflow between the module bay and the rear section; and
a second plurality of openings; and

a midplane printed circuit board (PCB), disposed between the metal stiffener and the rear section, the midplane PCB having a plurality of holes, each of the holes corresponding to a respective opening of the first plurality of openings to enable the airflow between the module bay and the rear section;

at least one flash module of the plurality of removably insertable flash modules, disposed within the module bay, the at least one flash module comprising:
a cover providing EMI containment to flash module circuits; and
a connector that extends beyond the cover,
wherein upon insertion of the at least one flash module into the module bay:
the connector interfaces with the midplane PCB, through at least one of the second plurality of openings, and
the connector is EMI contained.

2. The chassis of claim 1 , wherein the cover of the flash module provides heat dissipation to the flash module circuits.

3. The chassis of claim 2 , wherein the airflow removes heat from the cover while traversing through the module bay.

4. The chassis of claim 2 , wherein the airflow removes heat from the midplane PCB.

5. A chassis that does not provide chassis level electromagnetic interference (EMI) containment, the chassis comprising:
a module bay that does not provide EMI containment for flash modules disposed in the module bay;
a rear section that does provide EMI containment for elements disposed in the rear section;
a metal stiffener disposed between the module bay and the rear section, the metal stiffener comprising:
a first plurality of holes that enables an airflow between the module bay and the rear section; and
a second plurality of holes, wherein each hole of the second plurality of holes is configured to:
receive a flash module of the flash modules, and
form an electromagnetic seal between the metal stiffener and the flash module; and

a midplane printed circuit board (PCB), disposed between the metal stiffener and the rear section, the midplane PCB having a plurality of holes, each of the holes corresponding to a respective hole of the first plurality of holes, enabling the airflow between the module bay and the rear section,

wherein forming the electromagnetic seal provides the EMI containment for the flash module within the module bay.

6. The chassis of claim 5 , wherein the rear section provides front EMI containment on a side of the rear section proximate to the metal stiffener, and wherein the airflow passes through the metal stiffener.

7. The chassis of claim 5 , wherein the metal stiffener and a cover of the flash module provide the EMI containment of the flash module, and the module bay allows airflow to pass therethrough.

8. The chassis of claim 7 , wherein the module bay does not provide front EMI containment, wherein the airflow passes through a front opening of the module bay.

9. The chassis of claim 5 , wherein the module bay comprises a front opening that does not provide EMI containment, the front opening opposite to the metal stiffener.

Assignees

• Emc Ip Holding Co Llc

Inventors

• Frank Christopher
• Olesiewicz Timothy
• Willis Clifford

Classifications

• H05K7/20563 Primary

  within sub-racks for removing heat from electronic boards · CPC title

• H05K7/1424

  Card cages · CPC title

• H05K9/0015 Primary

  Gaskets or seals · CPC title

• G06F1/182

  with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI] · CPC title

• H05K7/2039

  characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title