Generating a unique die identifier for an electronic chip

US10236887B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10236887-B2
Application numberUS-201715808061-A
CountryUS
Kind codeB2
Filing dateNov 9, 2017
Priority dateNov 30, 2016
Publication dateMar 19, 2019
Grant dateMar 19, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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Abstract

Official abstract text for this publication.

Generating a unique die identifier for an electronic chip including placing the electronic chip in an identifier generation state, wherein the electronic chip comprises a set of test circuits, wherein each of the set of test circuits is attached to a corresponding component on the electronic chip; obtaining an ordered list of race pairs of the set of test circuits; for each race pair in the ordered list of race pairs of the set of test circuits: selecting the race pair of test circuits; executing a race between the selected race pair; and adding an element to the unique die identifier based on an outcome of the executed race; and returning the electronic chip to an operational state.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of generating a unique die identifier for an electronic chip, the method comprising: placing the electronic chip in an identifier generation state, wherein the electronic chip comprises a set of test circuits, and wherein each of the set of test circuits is attached to a corresponding component on the electronic chip; obtaining an ordered list of race pairs of the set of test circuits, wherein the ordered list of the race pairs of the set of test circuits is a programmed sequence of pairs of test circuits that are raced against one another; for each race pair in the ordered list of race pairs of the set of test circuits: selecting the race pair of test circuits; executing a race between the selected race pair; and adding an element to a unique die identifier based on an outcome of the executed race; and returning the electronic chip to an operational state. 2. The method of claim 1 , wherein each of the corresponding components on the electronic chip is a capacitor, and wherein returning the electronic chip to the operational state comprises: enabling each capacitor as a decoupling capacitor on the electronic chip. 3. The method of claim 1 , further comprising: storing the generated unique die identifier on the electronic chip. 4. The method of claim 1 , wherein executing the race between a race pair of the ordered list of race pairs comprises: transmitting a strobe signal simultaneously to each test circuit; and receiving, in response to the strobe signal, a response signal from each test circuit. 5. The method of claim 1 , wherein the outcome of the executed race is determined based on a relative strength of corresponding field-effect transistors within the test circuits. 6. The method of claim 1 , wherein placing the electronic chip in an identifier generation state comprises placing a portion of the electronic chip in a dormant state. 7. The method of claim 1 , wherein selecting the race of the test circuits comprises: sending a selection signal to each of the test circuits of the race pair, wherein the selection signal enables the test circuits to receive a strobe signal. 8. An electronic chip that generates a unique die identifier, the electronic chip having disposed within it logic that causes the electronic chip to carry out steps of: placing the electronic chip in an identifier generation state, wherein the electronic chip comprises a set of test circuits, and wherein each of the set of test circuits is attached to a corresponding component on the electronic chip; obtaining an ordered list of race pairs of the set of test circuits, wherein the ordered list of race pairs is programmed sequence of pairs of test circuits that are raced against one another; for each race pair in the ordered list of race pairs of the set of test circuits: selecting the race pair of test circuits; executing a race between the selected race pair; and adding an element to a unique die identifier based on an outcome of the executed race; and returning the electronic chip to an operational state. 9. The electronic chip of claim 8 , wherein each of the corresponding components on the electronic chip is a capacitor, and wherein returning the electronic chip to the operational state comprises: enabling each capacitor as a decoupling capacitor on the electronic chip. 10. The electronic chip of claim 8 , the steps further comprising: storing the generated unique die identifier on the electronic chip. 11. The electronic chip of claim 8 , wherein executing the race between a race pair of the ordered list of race pairs comprises: transmitting a strobe signal simultaneously to each test circuit; and receiving, in response to the strobe signal, a response signal from each test circuit. 12. The electronic chip of claim 8 , wherein the outcome of the executed race is determined based on a relative strength of corresponding field-effect transistors within the test circuits. 13. The electronic chip of claim 8 , wherein placing the electronic chip in an identifier generation state comprises placing a portion of the electronic chip in a dormant state. 14. The electronic chip of claim 8 , wherein selecting the race of the test circuits comprises: sending a selection signal to each of the test circuits of the race pair, wherein the selection signal enables the test circuits to receive a strobe signal. 15. A computer program product for generating a unique die identifier for an electronic chip, the computer program product disposed upon the electronic chip, the computer program product comprising computer program instructions that, when executed, cause the electronic chip to carry out steps of: placing the electronic chip in an identifier generation state, wherein the electronic chip comprises a set of test circuits, and wherein each of the set of test circuits is attached to a corresponding component on the electronic chip; obtaining an ordered list of race pairs of the set of test circuits, wherein the ordered list of race pairs is a programmed sequence of pairs of test circuits that are raced against one another; for each race pair in the ordered list of race pairs of the set of test circuits: selecting the race pair of test circuits; executing a race between the selected race pair; and adding an element to a unique die identifier based on an outcome of the executed race; and returning the electronic chip to an operational state. 16. The computer program product of claim 15 , wherein each of the corresponding components on the electronic chip is a capacitor, and wherein returning the electronic chip to the operational state comprises: enabling each capacitor as a decoupling capacitor on the electronic chip. 17. The computer program product of claim 15 , the steps further comprising: storing the generated unique die identifier on the electronic chip. 18. The computer program product of claim 15 , wherein executing the race between a race pair of the ordered list of race pairs comprises: transmitting a strobe signal simultaneously to each test circuit; and receiving, in response to the strobe signal, a response signal from each test circuit. 19. The computer program product of claim 15 , wherein placing the electronic chip in an identifier generation state comprises placing a portion of the electronic chip in a dormant state. 20. The computer program product of claim 15 , wherein selecting the race of the test circuits comprises: sending a selection signal to each of the test circuits of the race pair, wherein the selection signal enables the test circuits to receive a strobe signal.

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What does patent US10236887B2 cover?
Generating a unique die identifier for an electronic chip including placing the electronic chip in an identifier generation state, wherein the electronic chip comprises a set of test circuits, wherein each of the set of test circuits is attached to a corresponding component on the electronic chip; obtaining an ordered list of race pairs of the set of test circuits; for each race pair in the ord…
Who is the assignee on this patent?
IBM
What technology area does this patent fall under?
Primary CPC classification H03K19/17744. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Mar 19 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).