Liquid chemical for forming protecting film

Patent metadata

Field	Value
Publication number	US-10236175-B2
Application number	US-201615264776-A
Country	US
Kind code	B2
Filing date	Sep 14, 2016
Priority date	Oct 28, 2009
Publication date	Mar 19, 2019
Grant date	Mar 19, 2019

Abstract

Disclosed is a liquid chemical for forming a water-repellent protecting film on a wafer. The liquid chemical is a liquid chemical containing a water-repellent-protecting-film-forming agent for forming the water-repellent protecting film, at the time of cleaning the wafer which has a finely uneven pattern at its surface and contains at least at a part of a surface of a recessed portion of the uneven pattern at least one kind of matter selected from the group consisting of titanium, titanium nitride, tungsten, aluminum, copper, tin, tantalum nitride, ruthenium and silicon, at least on the surface of the recessed portion. The liquid chemical is characterized in that the water-repellent-protecting-film-forming agent is a water-insoluble surfactant. The water-repellent protecting film formed with the liquid chemical is capable of preventing a pattern collapse of the wafer, in a cleaning step.

First claim

The invention claimed is:

1. A process for cleaning a wafer which has at its surface a finely uneven pattern formed with a recessed portion and contains at least at a part of a surface of the recessed portion of the uneven pattern at least one kind of matter selected from the group consisting of titanium, titanium nitride, tungsten, aluminum, copper, tin, tantalum nitride, ruthenium and silicon, the process comprising:
a protecting film-forming step of retaining a liquid chemical for forming a protecting film at least in the recessed portion of the uneven pattern;
a drying step of drying the uneven pattern; and
a film-removing step of removing the protecting film,
wherein the liquid chemical for forming the protecting film contains a water-repellent-protecting-film-forming agent for forming a water-repellent film at least on the surface of the recessed portion and that the water-repellent-protecting-film-forming agent is a water-insoluble surfactant,
wherein the water-insoluble surfactant is selected from the group consisting of general formula [1], the general formula [2], and salt compounds thereof,

where R 1 represents one of a monovalent organic group having hydrocarbon group whose carbon number is 1 to 18 and a monovalent organic group having a fluoroalkyl chain whose carbon number is 1 to 8, and U represents a group selected from the group consisting of fluoro group, chloro group, bromo group and iodo group,
R 2 R 3 R 4 N  [2]

where R 2 represents one of a monovalent organic group having hydrocarbon group whose carbon number is 1 to 18 and a monovalent organic group having a fluoroalkyl chain whose carbon number is 1 to 8; R 3 represents one of hydrogen atom, a monovalent organic group having hydrocarbon group whose carbon number is 1 to 18, and a monovalent organic group having a fluoroalkyl chain whose carbon number is 1 to 8; and R 4 represents one of hydrogen atom, a monovalent organic group having hydrocarbon group whose carbon number is 1 to 18, and a monovalent organic group having a fluoroalkyl chain whose carbon number is 1 to 8.

2. A cleaning process as claimed in claim 1 , wherein removal of the water-repellent protecting film in the film-removing step is carried out by at least one treatment selected from irradiating the wafer surface with light, heating the wafer, and exposing the wafer to ozone.

3. A cleaning process as claimed in claim 1 , wherein the water-insoluble surfactant has an HLB value obtained by Griffin's method of from 0.001 to 10.

4. A cleaning process as claimed in claim 1 , wherein the water-insoluble surfactant is at least one kind selected from the group consisting of: a compound in which R 1 is a monovalent organic group having hydrocarbon group whose carbon number is 8 to 18 in the water-insoluble surfactant represented by the general formula [1]; a compound in which R 2 is a monovalent organic group having hydrocarbon group whose carbon number is 6 to 18, R 3 is one of a hydrogen atom and a monovalent organic group having hydrocarbon group whose carbon number is 1 to 18, and R 4 is one of a hydrogen atom and a monovalent organic group having hydrocarbon group whose carbon number is 1 to 18, in the water-insoluble surfactant represented by the general formula [2]; and a salt compound thereof.

5. A cleaning process as claimed in claim 1 , wherein the liquid chemical for forming the water-repellent protecting film contains a diluent solvent.

6. A cleaning process as claimed in claim 1 , wherein removal of the water-repellent protecting film in the film-removing step is carried out by heating the wafer.

7. A cleaning process as claimed in claim 1 , wherein removal of the water-repellent protecting film in the film-removing step is carried out by heating the wafer at not higher than 300° C.

8. A cleaning process as claimed in claim 1 , further comprising a subsequent cleaning step of substituting the liquid chemical for forming the protecting film with a cleaning liquid different from the liquid chemical, between the protecting film-forming step and the drying step, wherein the cleaning liquid is at least one kind selected from the group consisting of: a water-based cleaning liquid; an organic solvent; a mixture of the water-based cleaning liquid and the organic solvent, wherein the water-insoluble surfactant is present in the cleaning liquid at a concentration lower than that in the liquid chemical.

9. A cleaning process as claimed in claim 8 , wherein the cleaning liquid substituted in the subsequent cleaning step is retained for not shorter than 10 seconds.

Assignees

• Central Glass Co Ltd

Inventors

• Saito Masanori
• Arata Shinobu
• Saio Takashi
• Kumon Soichi
• Nanai Hidehisa
• Akamatsu Yoshinori

Classifications

• H10P76/00

  Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography · CPC title

• H10P70/20 Primary

  Cleaning during device manufacture · CPC title

• H10P50/286

  of organic materials · CPC title

• H10P50/00 Primary

  Etching of wafers, substrates or parts of devices · CPC title

• H10P14/687

  the materials being fluorocarbon compounds, e.g. (CHxFy) n or polytetrafluoroethylene · CPC title