Fingerprint sensor-compatible overlay material

Patent metadata

Field	Value
Publication number	US-10235558-B2
Application number	US-201715472473-A
Country	US
Kind code	B2
Filing date	Mar 29, 2017
Priority date	Nov 13, 2015
Publication date	Mar 19, 2019
Grant date	Mar 19, 2019

Abstract

A fingerprint sensor-compatible overlay material which uses anisotropic conductive material to enable accurate imaging of a fingerprint through an overlay is disclosed. The anisotropic conductive material has increased conductivity in a direction orthogonal to the fingerprint sensor, increasing the capacitive coupling of the fingerprint to the sensor surface, allowing the fingerprint sensor to accurately image the fingerprint through the overlay. Methods for forming a fingerprint sensor-compatible overlay are also disclosed.

First claim

What is claimed is:

1. A method comprising:
disposing a plurality of conductive elements in a material such that the conductive elements are aligned in a first direction from a first surface of the material to a second surface of the material, wherein a first conductivity in the first direction is greater than a second conductivity in at least one other direction; and
disposing the material over a sensor surface to form a fingerprint sensor-compatible overlay, wherein the sensor surface corresponds to a plurality of capacitive sense elements of a fingerprint sensor that measures changes in capacitance corresponding to a presence of an object, wherein the fingerprint sensor-compatible overlay comprises a first overlay surface corresponding to the first surface and a second overlay surface corresponding to the second surface, wherein the first conductivity is in a first direction between the first overlay surface and the second overlay surface, and wherein the first overlay surface is adjacent to the sensor surface and the second overlay surface is disposed to receive the object in direct contact with or in close proximity to the second overlay surface such that the first conductivity increases a capacitive coupling of the object to the plurality of capacitive sense elements.

2. The method of claim 1 , further comprising aligning the conductive elements in the first direction by applying a field across the material in the first direction.

3. The method of claim 1 , wherein the material is flexible.

4. The method of claim 1 , wherein the plurality of capacitive sense elements is coupled to a capacitance measurement circuit.

5. An apparatus comprising
an overlay, comprising:
a first overlay surface disposed adjacent to a sensor surface corresponding to a plurality of capacitive sense elements of a fingerprint sensor that measures changes in capacitance corresponding to fingerprint features; and
a second overlay surface, wherein a first conductivity in a first direction between the first overlay surface and the second overlay surface is greater than a second conductivity in at least one other direction,
wherein the overlay is configured to:
receive a fingerprint in direct contact with or in close proximity to the second overlay surface; and
increase a capacitive coupling of fingerprint features of the fingerprint to the plurality of capacitive sense elements such that the plurality of capacitive sense elements measure changes in capacitance corresponding to the fingerprint features.

6. The apparatus of claim 5 , wherein the overlay is flexible.

7. The apparatus of claim 5 , wherein the second overlay surface is configured to conform to a curvature of a finger.

8. The apparatus of claim 5 , wherein the first conductivity is substantially constant.

9. The apparatus of claim 5 , wherein the overlay comprises conductive pillars comprising conductive elements disposed in a material, and wherein the conductive pillars are aligned in the first direction.

10. The apparatus of claim 9 , wherein the conductive pillars are disposed in the material symmetrically around an axis in the first direction.

11. The apparatus of claim 9 , wherein the conductive pillars are disposed in the material asymmetrically around an axis in the first direction.

12. The apparatus of claim 11 , wherein the conductive pillars are further disposed randomly in the material.

13. The apparatus of claim 5 , further comprising:
the fingerprint sensor comprising the plurality of capacitive sense elements disposed adjacent to the sensor surface; and
a processor coupled to the fingerprint sensor, wherein the processor is configured to:
receive measurements of changes in capacitance corresponding to the fingerprint features; and
based on the measurements of changes in capacitance, generate a set of data values that represent the fingerprint in a digital format.

14. The apparatus of claim 5 , wherein the overlay comprises a plurality of conductive elements disposed in a material such that conductive elements are aligned in the first direction from a first surface of the material to a second surface of the material.

Assignees

• Cypress Semiconductor Corp

Inventors

• Klein Hans
• Kolych Igor
• Karpin Oleksandr
• Kravets Igor
• Hoshtanar Oleksandr

Classifications

• G06K9/00053 Primary

  Physics · mapped topic

• H01S3/1312

  by controlling the optical pumping · CPC title

• A61B18/20

  using laser · CPC title

• A61B2017/00057

  Light · CPC title

• A61B2018/00476

  Hair follicles · CPC title