Optical fiber module
US-2017153400-A1 · Jun 1, 2017 · US
Semiconductor laser module and three-dimensional laminating and shaping apparatus
US10234645B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10234645-B2 |
| Application number | US-201615513371-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 14, 2016 |
| Priority date | Sep 14, 2016 |
| Publication date | Mar 19, 2019 |
| Grant date | Mar 19, 2019 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A variation in coupling ratio of output light from a laser element to an optical fiber is suppressed. A semiconductor laser module including a plurality of semiconductor laser elements, an optical fiber, a condenser that condenses a laser beam emitted from each of the semiconductor laser elements to the optical fiber, and a housing that implements the laser elements, the condenser, and the optical fiber includes at least one thin plate that is arranged between the laser elements and a top of the housing, and arranged on the top to form a gap with the top.
First claim
Opening claim text (preview).
The invention claimed is: 1. A semiconductor laser module including a plurality of semiconductor laser elements, an optical fiber, a condenser that condenses a laser beam emitted from each of said semiconductor laser elements to said optical fiber, and a housing that implements said laser elements, said condenser, and said optical fiber, the semiconductor laser module comprising: at least one thin plate that is arranged on the top to form a gap for shielding heat by the laser beam with the top, wherein said thin plate includes a folding portion in at least one end portion, and is arranged on the top via said folding portion so that the gap is formed. 2. The semiconductor laser module according to claim 1 , wherein said thin plate has a size to cover at least part of said semiconductor laser elements. 3. The semiconductor laser module according to claim 1 , wherein said thin plate has a size to cover said plurality of semiconductor laser elements. 4. The semiconductor laser module according to claim 1 , wherein said thin plate has one of a rectangular shape, a circular shape, and a polygonal shape. 5. The semiconductor laser module according to claim 1 , wherein said thin plate has a thickness of 0.1 mm to 0.2 mm. 6. The semiconductor laser module according to claim 1 , wherein said thin plate is made of aluminum. 7. A three-dimensional laminating and shaping apparatus using a semiconductor laser module defined in claim 1 . 8. A semiconductor laser module including a plurality of semiconductor laser elements, an optical fiber, a condenser that condenses a laser beam emitted from each of said semiconductor laser elements to said optical fiber, and a housing that implements said laser elements, said condenser, and said optical fiber, the semiconductor laser module comprising: at least one thin plate that is arranged between said laser elements and a top of said housing, and arranged on the top to form a gap with the top, said thin plate includes a folding portion in at least one end portion, and is arranged on the top via said folding portion, said thin plate is provided at a position facing said semiconductor laser elements. 9. The semiconductor laser module according to claim 8 , wherein said thin plate has a size to cover at least part of said semiconductor laser element. 10. The semiconductor laser module according to claim 8 , wherein said thin plate has a size to cover said plurality of semiconductor laser elements. 11. The semiconductor laser module according to claim 8 , wherein said thin plate has a size to cover said plurality of semiconductor laser elements, said thin plate has one of a rectangular shape, a circular shape, and a polygonal shape. 12. The semiconductor laser module according to claim 8 , wherein said thin plate has a size to cover at least part of the top, said thin plate has a thickness of 0.1 mm to 0.2 mm. 13. The semiconductor laser module according to claim 8 , wherein said thin plate has a size to cover said plurality of semiconductor laser elements, said thin plate has one of a rectangular shape, a circular shape, and a polygonal shape, said thin plate has a thickness of 0.1 mm to 0.2 mm.
Assignees
Inventors
Classifications
Housings, e.g. machine housings · CPC title
characterised by the configuration of the radiation means · CPC title
characterised by the type, e.g. laser or electron beam · CPC title
Direct deposition of metal particles, e.g. direct metal deposition [DMD] or laser engineered net shaping [LENS] · CPC title
of energy beam parameters · CPC title
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Frequently asked questions
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- What does patent US10234645B2 cover?
- A variation in coupling ratio of output light from a laser element to an optical fiber is suppressed. A semiconductor laser module including a plurality of semiconductor laser elements, an optical fiber, a condenser that condenses a laser beam emitted from each of the semiconductor laser elements to the optical fiber, and a housing that implements the laser elements, the condenser, and the opti…
- Who is the assignee on this patent?
- Tech Res Association Future Additive Manufacturing
- What technology area does this patent fall under?
- Primary CPC classification H01S5/024. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Mar 19 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).