Solid-state latent heat pump system

Patent metadata

Field	Value
Publication number	US-10234176-B2
Application number	US-201615240098-A
Country	US
Kind code	B2
Filing date	Aug 18, 2016
Priority date	Aug 18, 2016
Publication date	Mar 19, 2019
Grant date	Mar 19, 2019

Abstract

A heat pump system includes a structure, in turn including a solid-state phase change material. The solid-state phase change material has a first phase state and a second phase state dependent on the temperature. A heat source is configured to supply heat to a first area of the structure, thereby creating a first domain having the first phase state and thereby storing latent heat in the first domain. The first domain is separated by domain walls from second domains having the second phase state. A heat sink is configured to receive heat from a second area of the structure. Furthermore, an electrical energy supply is configured to supply an electrical current to the structure, thereby moving the first domain and the corresponding latent heat stored in the first domain along the structure from the first area to the second area. A related thermal computing device, a related method, and a related computer program product are also disclosed.

First claim

What is claimed is:

1. A heat pump system comprising:
a structure comprising a solid-state phase change material, the solid-state phase change material having a first phase state and a second phase state dependent on the temperature;
a heat source configured to supply heat to a first area of the structure, thereby creating a first domain having the first phase state and storing latent heat in the first domain, the first domain being separated by domain walls from second domains having the second phase state;
a heat sink configured to receive heat from a second area of the structure; and
an electrical energy supply configured to supply an electrical current to the structure, thereby moving the first domain and the corresponding latent heat stored in the first domain along the structure from the first area to the second area.

2. The heat pump system according to claim 1 , wherein the first phase state is a metallic state and the second phase state is an insulating state.

3. The heat pump system according to claim 2 , wherein the solid-state phase change material is selected from the group consisting of VO 2 , V 4 O 7 , V 6 O 11 , V 2 O 3 , V 6 O 13 , V 5 O 9 , VO, V 8 O 15 , NbO 2 , Ti 2 O 3 , LaCoO 3 , Ti 3 O 5 , SmNiO 3 , NdNiO 3 , PrNiO 3 and Fe 3 O 4 .

4. The heat pump system according to claim 1 , wherein the heat source is an unsteady heat source operable to supply heat pulses to the first area.

5. The heat pump system according to claim 1 , wherein the heat source is a steady heat source operable to steadily supply heat to the first area, wherein the system comprises a thermal switch arranged between the steady heat source and the first area, the thermal switch being configured to control the heat transferred from the steady heat source to the first area.

6. The heat pump system according to claim 5 , wherein the heat pump system comprises a controller for controlling the thermal switch and wherein the heat pump system is configured to
apply thermal pulses to the first area; and
adapt the timing of the thermal pulses to the duration of the movement of the first domain between the first and the second area.

7. The heat pump system according to claim 5 , wherein the thermal switch is a device to switch between at least two thermal conductance states in response to a mechanical stimulus or an electrical stimulus.

8. The heat pump system according to claim 1 , wherein the system comprises a controller for controlling the electrical energy supply and wherein the controller is configured to control the amplitude and/or the frequency of the electrical current.

9. The heat pump system according to claim 1 , wherein the structure is a nanowire.

10. The heat pump system according to claim 1 , wherein the system is configured to apply strain to the solid-state phase change material in the first area, thereby tuning the phase change characteristics of the structure in the first area.

11. The heat pump system according to claim 1 , wherein the first area of the solid-state phase change material is doped to tune the phase change characteristics of the structure in the first area.

12. The heat pump system according to claim 1 , wherein the system is configured to keep the temperature of the first domain between a first transition temperature and a second transition temperature during its movement from the first area to the second area.

13. The heat pump system according to claim 1 , wherein the heat source is an electronic device.

14. The heat pump system according to claim 1 , wherein the heat source is an integrated circuit or an element of an integrated circuit.

15. A thermal computing device comprising a heat pump system, said heat pump system in turn comprising:
a structure comprising a solid-state phase change material, the solid-state phase change material having a first phase state and a second phase state dependent on the temperature;
a heat source configured to supply heat to a first area of the structure, thereby creating a first domain having the first phase state and storing latent heat in the first domain, the first domain being separated by domain walls from second domains having the second phase state;
a heat sink configured to receive heat from a second area of the structure; and
an electrical energy supply configured to supply an electrical current to the structure, thereby moving the first domain and the corresponding latent heat stored in the first domain along the structure from the first area to the second area.

16. The thermal computing device according to claim 15 , wherein the first domain represents data that can be moved along the structure by the electric current.

17. The thermal computing device according to claim 15 , wherein
the heat source is implemented as write device that is configured to write the data represented by the first domain into the structure;
the structure is implemented as a data link that is configured to transmit the data represented by the first domain; and
the heat sink is implemented as a read device that is configured to read out the data represented by the first domain, thereby annihilating the first domain.

18. A method for moving latent heat in a heat pump system, the heat pump system comprising a structure comprising a solid-state phase change material, the solid-state phase change material having a first phase state and a second phase state dependent on the temperature; the method comprising
supplying, by a heat source, heat to a first area of the structure, thereby creating a first domain having the first phase state and storing latent heat in the first domain, the first domain being separated by domain walls from second domains having the second phase state;
supplying, by an electrical energy supply, an electrical current to the structure;
moving the first domain and the corresponding latent heat stored in the first domain along the structure from the first area to a second area of the structure; and
transferring heat from the second area of the structure to a heat sink, thereby annihilating the first domain.

19. The method according to claim 18 , the method further comprising:
applying thermal pulses to the first area; and
adapting the timing of the thermal pulses to the duration of the movement of the first domain between the first and the second area.

20. A computer program product for operating a thermal computing device, the thermal computing device comprising a heat pump system, the heat pump system comprising a structure comprising a solid-state phase change material, the solid-state phase change material having a first phase state and a second phase state dependent on the temperature, said computer program product comprising a non-transitory computer readable storage medium having program instructions embodied therewith, the program instructions executable by the thermal computing device to perform a method comprising:
supplying, by a heat source, heat to a first area of the structure, thereby creating a first domain having the first phase state and storing latent heat in the first domain, the first domain being separated by domain walls from second domains having the second phase state;
supplying, by an electrical energy supply, an electrical current to the structure;
moving the first domain and the corresponding latent heat stored in the first domain along the structure from the first area to a second area of the structure; and
transferring heat from the second area of the structure to a heat sink, thereby annihilating the first domain

Assignees

• IBM

Inventors

• Gotsmann Bernd W
• Menges Fabian

Classifications

• G06F1/206

  comprising thermal management · CPC title

• F25B21/04

  reversible · CPC title

• F25B23/00 Primary

  Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect · CPC title

• F25B2321/0212

  of electric power, current or voltage · CPC title