Aluminium-silicon carbide composite, and power-module base plate

Patent metadata

Field	Value
Publication number	US-10233125-B2
Application number	US-201515127214-A
Country	US
Kind code	B2
Filing date	Mar 18, 2015
Priority date	Mar 18, 2014
Publication date	Mar 19, 2019
Grant date	Mar 19, 2019

Abstract

To provide an aluminum-silicon carbide composite which is suitable for use as a power-module base plate. An aluminum-silicon carbide composite wherein a peripheral portion having, as a main component thereof, an aluminum-ceramic fiber composite containing ceramic fibers having an average fiber diameter of at most 20 μm and an average aspect ratio of at least 100, is provided on the periphery of a flat plate-shaped aluminum-silicon carbide composite having a plate thickness of 2 to 6 mm formed by impregnating, with a metal containing aluminum, a porous silicon carbide molded body having a silicon carbide content of 50 to 80 vol %, and wherein the proportion of the aluminum-ceramic fiber composite occupied in the peripheral portion is at least 50 area %.

First claim

The invention claimed is:

1. An aluminum-silicon carbide composite comprising
a first phase comprising a flat plate-shaped aluminum-silicon carbide composite having a plate thickness of 2 to 6 mm formed by impregnating, with a metal containing aluminum, a porous silicon carbide molded body having a silicon carbide content of 50 to 80 vol %; and
on a periphery of the first phase, a second phase comprising an aluminum-ceramic fiber composite containing, at a proportion of 3 to 20% by volume, ceramic fibers comprising alumina or silica and having an average fiber diameter of at most 20 μm and an average aspect ratio of at least 100;
wherein a proportion of the aluminum-ceramic fiber composite contained in the second phase is at least 50 area % of the peripheral area of the first phase.

2. The aluminum-silicon carbide composite according to claim 1 , wherein a thermal expansion coefficient of the aluminum-ceramic fiber composite is less than 20×10 −6 /K, a strength at 25° C. is at least 200 MPa and a strength at 150° C. is at least 150 MPa.

3. The aluminum-silicon carbide composite according to claim 1 , wherein both main surfaces of the first phase are covered by an aluminum alloy layer or an aluminum-ceramic fiber layer.

4. The aluminum-silicon carbide composite according to claim 1 , wherein one main surface of the first phase is covered by an aluminum alloy layer or an aluminum-ceramic fiber layer.

5. The aluminum-silicon carbide composite according to claim 1 , wherein a ceramic fiber content in the aluminum-ceramic fiber composite contained in the second phase is 5 to 20 vol % with respect to an entire aluminum-ceramic fiber composite.

6. The aluminum-silicon carbide composite according to claim 1 , wherein the ceramic fiber comprises one or more materials chosen from among alumina, silica, boron nitride, and silicon nitride.

7. A power-module base plate formed by plating a surface of the aluminum-silicon carbide composite according to claim 1 .

8. The aluminum-silicon carbide composite according to claim 1 , wherein the aluminum alloy layer has an average thickness of 0.05 mm to 0.3 mm.

Assignees

• Denka Company Ltd

Inventors

• Goto Daisuke
• Hirotsuru Hideki
• Taniguchi Yoshitaka
• Iwamoto Goh
• Koyanagi Kazunori

Classifications

• H10W70/02

  of conductive package substrates serving as an interconnection, e.g. of metal plates (manufacture or treatment of leadframes H10W70/04) · CPC title

• H10W40/257

  having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures (H10W40/254, H10W40/251 take precedence) · CPC title

• C04B2235/402

  Aluminium · CPC title

• C04B41/009

  characterised by the material treated · CPC title

• C04B41/5155

  Aluminium · CPC title