Multi-stacked electronic device with defect-free solder connection

Patent metadata

Field	Value
Publication number	US-10231334-B2
Application number	US-201815892740-A
Country	US
Kind code	B2
Filing date	Feb 9, 2018
Priority date	Jul 16, 2014
Publication date	Mar 12, 2019
Grant date	Mar 12, 2019

Abstract

A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe, the leadframes of each electronic component are physically joined together using a non-solder metal joining process to form a joint, and the joint is located outside a solder connection region.

First claim

What is claim is:

1. A multi-stacked electronic device, comprising:
first, second and third electronic components positioned in a stack, the first electronic component being positioned above the second and third electronic components in said stack, said second electronic component being positioned beneath the first and third electronic components in said stack, and the third electronic component being positioned between the first and second components in said stack;
the first electronic component including a lateral, outside downwardly extending first leadframe, the second electronic component including a lateral, upwardly extending second leadframe, the second leadframe extending upwardly, laterally inside of, and vertically overlapping with, the first leadframe, wherein the first and second leadframes include respective vertically overlapping portions, and the first leadframe including a lower portion spaced from said overlapping portions and defining a solder connection region for soldering the stacked electronic device to a soldering surface,
a joint directly between and physically joining together the overlapping portions of the first and second leadframes, with the third electronic component positioned between the first and second electronic components, and wherein the joint is located outside the solder connection region.

2. The multi-stacked electronic device according to claim 1 , further comprising a further joint to join the third electronic component to one of the first and second electronic components.

3. The multi-stacked electronic device according to claim 2 , wherein the further joint joins the third electronic component to the first electronic component.

4. The multi-stacked electronic device according to claim 2 , wherein the third electronic component includes a lateral third leadframe, and the further joint joins the third leadframe to one of the first and second electronic components.

5. The multi-stacked electronic device according to claim 4 , wherein the further joint joins the third leadframe to the first electronic component.

Assignees

• IBM

Inventors

• Ang Ai Kiar
• Lauri Michael

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W70/40

  Leadframes · CPC title

• H10W90/811

  Multiple chips on leadframes · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W70/442

  of multiple leadframes in a single chip · CPC title