System-level camera module with encapsulated electrical support

US10230876B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10230876-B2
Application numberUS-201615057057-A
CountryUS
Kind codeB2
Filing dateFeb 29, 2016
Priority dateNov 13, 2015
Publication dateMar 12, 2019
Grant dateMar 12, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A camera module includes an optical lens, a photosensitive sensor and an electrical support. The electrical support includes a circuit arrangement embedded in a support body to form an integral structure, a connecting member provided on the support body to electrically connect with the circuit arrangement, and a camera component coupled at the support body and electrically connected to the connecting member. Therefore, the electrical support not only forms a circuit board to electrically connect with the camera component but only serves as a base to support the camera component.

First claim

Opening claim text (preview).

What is claimed is: 1. An electrical support for a camera module including different camera components and an optical lens, comprising: a support body which is made of electrical insulation material for supporting the optical lens on said support body, wherein said support body has a top surface, a bottom surface, and a through hole for allowing light passing through the optical lens and said through hole to reach a photosensitive sensor as one of the camera components coupled at said bottom surface of said support body; a circuit arrangement which comprises a plurality of electrical conductors and a plurality of electronic elements which are electrically pre-connected with said electrical conductors, wherein said electrical conductors and said electronic elements are integrally encapsulated in said support body; and a connecting member provided at said support body and electrically connected to said electrical conductors and said electronic elements of said circuit arrangement, wherein said connecting member comprises a plurality of photosensitive sensor conductive members for electrically connecting with the photosensitive sensor without a wire bonding process and a plurality of PCB conductive members for electrically connecting with a circuit board as one of the camera components, wherein said photosensitive sensor conductive members and said PCB conductive members are spacedly provided at said bottom surface of said support body, such that said support body serves as a support for supporting the optical lens and as an electrical connection for electrically connecting the photosensitive sensor with the circuit board when the photosensitive sensor and the circuit board are coupled at said bottom surface of said support body; wherein said connecting member further comprises a plurality of electric component conductive members for electrically connecting with an electric component as one of the camera components, and a plurality of driver conductive members for electrically connecting with a driver as one of the camera components, wherein said electric component conductive members and said driver conductive members are provided at said top surface of said support body for electrically connecting with the electric component and the driver when the electric component and the driver are supported on said top surface of said support body. 2. The electrical support, as recited in claim 1 , wherein said top surface of said support body is a stepped surface to form a first top surface and a second top surface, wherein said first top surface is at a level lower than said second top surface, wherein said electric component conductive members are provided at said first top surface for electrically connecting with the electric component, and said driver conductive members are provided at said second top surface for electrically connecting with the driver. 3. The electrical support, as recited in claim 2 , wherein said support body further has a top recess formed at said first top surface of said support body at a position that said through hole is extended through said top recess, wherein said top recess is configured for receiving an optical filter as one of the camera components therein. 4. An electrical support for a camera module including different camera components and an optical lens, comprising: a support body which is made of electrical insulation material for supporting the optical lens on said support body, wherein said support body has a top surface, a bottom surface, and a through hole for allowing light passing through the optical lens and said through hole to reach a photosensitive sensor as one of the camera components coupled at said bottom surface of said support body, wherein said support body has a bottom recess formed at said bottom surface of said support body at a position that said through hole is extended through said bottom recess, wherein the photosensitive sensor is adapted to be received in said bottom recess; wherein said bottom surface of said support body is a stepped surface to form a first bottom surface and a second bottom surface, wherein said second bottom surface is at a level lower than said first bottom surface to form said bottom recess; a circuit arrangement which comprises a plurality of electrical conductors and a plurality of electronic elements which are electrically pre-connected with said electrical conductors, wherein said electrical conductors and said electronic elements are integrally encapsulated in said support body; and a connecting member provided at said support body and electrically connected to said electrical conductors and said electronic elements of said circuit arrangement, wherein said connecting member comprises a plurality of photosensitive sensor conductive members for electrically connecting with the photosensitive sensor without a wire bonding process and a plurality of PCB conductive members for electrically connecting with a circuit board as one of the camera components, wherein said photosensitive sensor conductive members and said PCB conductive members are spacedly provided at said bottom surface of said support body, such that said support body serves as a support for supporting the optical lens and as an electrical connection for electrically connecting the photosensitive sensor with the circuit board when the photosensitive sensor and the circuit board are coupled at said bottom surface of said support body; wherein said photosensitive sensor conductive members are provided at said first bottom surface for electrically connecting with the photosensitive sensor and said PCB conductive members are provided at said second bottom surface for electrically connecting with the circuit board; wherein said connecting member further comprises a plurality of electric component conductive members for electrically connecting with an electric component as one of the camera components, and a plurality of driver conductive members for electrically connecting with a driver as one of the camera components, wherein said electric component conductive members and said driver conductive members are provided at said top surface of said support body for electrically connecting with the electric component and the driver when the electric component and the driver are supported on said top surface of said support body. 5. The electrical support, as recited in claim 4 , wherein said top surface of said support body is a stepped surface to form a first top surface and a second top surface, wherein said first top surface is at a level lower than said second top surface, wherein said electric component conductive members are provided at said first top surface for electrically connecting with the electric component, and said driver conductive members are provided at said second top surface for electrically connecting with the driver. 6. The electrical support, as recited in claim 5 , wherein said support body further has a top recess formed at said first top surface of said support body at a position that said through hole is extended through said top recess, wherein said top recess is configured for receiving an optical filter as one of the camera components therein. 7. A camera module, comprising: an optical lens; a flexible PCB; a photosensitive sensor, wherein said optical lens is positioned along a photosensitive path of said photosensitive sensor; an electric component; a driver; and an electrical support, which comprises: a support body which is made of electrical insulation material, wherein said optical lens is supported on said support body, wherein said support body has a top surface, a bottom surface, and a through hole for allowing light passing through said optical lens and said through hole to reach said photosensitive sensor which is cou

Assignees

Inventors

Classifications

  • H04N23/54Primary

    Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils · CPC title

  • H04N23/50Primary

    Constructional details · CPC title

  • Optical parts specially adapted for electronic image sensors; Mounting thereof · CPC title

  • Housings · CPC title

  • Electricity · mapped topic

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Frequently asked questions

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What does patent US10230876B2 cover?
A camera module includes an optical lens, a photosensitive sensor and an electrical support. The electrical support includes a circuit arrangement embedded in a support body to form an integral structure, a connecting member provided on the support body to electrically connect with the circuit arrangement, and a camera component coupled at the support body and electrically connected to the conn…
Who is the assignee on this patent?
Ningbo Sunny Optotech Co Ltd, Ningbo Sunny Opotech Co Ltd
What technology area does this patent fall under?
Primary CPC classification H04N23/54. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Mar 12 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).