Electromagnetic interference shield
US-2016192545-A1 · Jun 30, 2016 · US
US10230470B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10230470-B2 |
| Application number | US-201715475082-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 30, 2017 |
| Priority date | Mar 30, 2017 |
| Publication date | Mar 12, 2019 |
| Grant date | Mar 12, 2019 |
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In accordance with an embodiment, a multi-layered flexible printed circuit (FPC) is disclosed that includes two or more insulating layers to route conductive traces carrying radio frequency (RF) signals, e.g., data signals, and conductive traces carrying direct current (DC) signals, e.g., power signals and low-frequency control signals, while sufficiently isolating the RF signals from electrical interference by the DC transmission lines. This advantageously eliminates having two or more separate FPCs to electrically couple each optical subassembly, e.g., receiver optical subassemblies (ROSAs) and transmitter optical subassemblies (TOSAs), to associated circuitry in a transceiver housing, which saves space and reduces manufacturing complexity, for example.
Opening claim text (preview).
What is claimed is: 1. An optical transceiver module comprising: a housing; a receive connecting circuit; a receiver optical subassembly (ROSA) arrangement disposed in the housing; and a first flexible printed circuit (FPC) having a first region electrically coupled to the receive connecting circuit and a second region electrically coupled to the ROSA arrangement, the first FPC comprising: a first plurality of conductive traces for providing a radio frequency (RF) signal between the ROSA arrangement and the receive connecting circuit; a second plurality of conductive traces for providing a power waveform; at least one insulating layer disposed between the first and second plurality of conductive traces; and wherein the first plurality of conductive traces is electrically isolated from the second plurality of conductive traces to prevent interference with the RF signal. 2. The optical transceiver module of claim 1 , wherein the first FPC further comprises an RF ground reference plane disposed between the first and second plurality of conductive traces to provide electrical isolation between the RF signal of the first plurality of conductive traces and the power waveform of the second plurality of conductive traces. 3. The optical transceiver module of claim 1 , wherein the first FPC includes a cut-out for receiving an array of photodiodes associated with the ROSA arrangement. 4. The optical transceiver module of claim 3 , wherein a plurality of conductive pads are disposed around a perimeter of the cut-out and are electrically coupled to respective conductive traces of the second plurality of conductive traces, and wherein a first conductive pad and a second conductive pad of the plurality of conductive pads are positioned on opposite sides of the cut-out from each other. 5. The optical transceiver module of claim 1 , wherein the at least one insulating layer comprises at least first and second insulating layers, the second insulating layer being disposed on the first insulating layer, and wherein the first plurality of conductive traces are disposed on an external surface of the first insulating layer and the second plurality of conductive traces are disposed on the second insulating layer. 6. The optical transceiver module of claim 5 , wherein the first FPC includes a conductive terminal disposed on the external surface of the first insulating layer, and wherein a conductive trace of the second plurality of conductive traces extends through the first insulating layer to electrically couple to the conductive terminal. 7. The optical transceiver module of claim 1 , wherein the first FPC further comprises a first arm portion and a second arm portion, the first and second arm portions extending along a longitudinal axis of the first FPC and separated from each other by a gap. 8. The optical transceiver module of claim 7 , wherein the first FPC further comprises a first flexible region extending between the first arm portion and an end of the FPC. 9. The optical transceiver module of claim 1 , wherein the first plurality of conductive traces include a separation spacing between conductive traces that is greater than a separation spacing between conductive traces of the second plurality of conductive traces. 10. An optical transceiver module comprising: a housing; a transmit connecting circuit and a receive connecting circuit each disposed at least partially within the housing; a receiver optical subassembly (ROSA) arrangement disposed in the housing; a first flexible printed circuit (FPC) having a first region electrically coupled to the receive connecting circuit and a second region electrically coupled to the ROSA arrangement, the first FPC comprising: a first plurality of conductive traces for providing a radio frequency (RF) signal between the ROSA arrangement and the receive connecting circuit; a second plurality of conductive traces for providing a power waveform; and wherein the first plurality of conductive traces is electrically isolated from the second plurality of conductive traces to prevent interference with the RF signal; a transmitter optical subassembly (TOSA) arrangement disposed in the housing; and a second flexible printed circuit (FPC) having a first region electrically coupled to the transmit connecting circuit and a second region electrically coupled to the TOSA arrangement, the second FPC comprising: a first plurality of conductive traces for providing a radio frequency (RF) signal between the transmit connecting circuit and the TOSA arrangement; a second plurality of conductive traces for providing a power waveform; and wherein the first plurality of conductive traces is electrically isolated from the second plurality of conductive traces to prevent interference with the RF signal. 11. The optical transceiver module of claim 10 , wherein the second FPC includes a cut-out for receiving an array of photodiodes associated with the ROSA arrangement. 12. The optical transceiver module of claim 11 , wherein a plurality of conductive pads is disposed around a perimeter of the cut-out of the first FPC, each of the plurality of conductive pads being electrically coupled to an associated conductive trace of the second plurality of conductive traces, and wherein a first conductive pad and a second conductive pad of the plurality of conductive pads are disposed on opposite sides of the cut-out from each other. 13. The optical transceiver module of claim 10 , wherein each of the first and second FPCs further comprise at least a first, second, and third insulating layer, the second insulating layer being coupled between the first and second insulating layers, and wherein the first plurality of conductive traces is disposed on the first insulating layer and the second plurality of conductive traces is disposed on the third insulating layer. 14. The optical transceiver module of claim 13 , wherein the first FPC includes a conductive terminal disposed on an external surface of the first insulating layer, and wherein a conductive trace of the second plurality of conductive traces extends through the first and second insulating layers to electrically couple to the conductive terminal. 15. The optical transceiver module of claim 10 , wherein the first FPC further comprises a first arm portion and a second arm portion, the first and second arm portions extending along a longitudinal axis of the first FPC and separated from each other by a gap. 16. The optical transceiver module of claim 10 implemented as a Quad Small Form-Factor Pluggable transceiver. 17. An optical transceiver comprising: a housing; a transmit connecting circuit and a receive connecting circuit each disposed at least partially within the housing; a receiver optical subassembly (ROSA) arrangement disposed in the housing; a first flexible printed circuit (FPC) having a first region electrically coupled to the receive connecting circuit and a second region electrically coupled to the ROSA arrangement, the first FPC comprising: a first plurality of conductive traces for providing a radio frequency (RF) signal between the ROSA arrangement and the receive connecting circuit; a second plurality of conductive traces for providing a power waveform; and wherein the first plurality of conductive traces is electrically isolated from the second plurality of conductive traces to prevent interference with the RF signal; a transmitter optical subassembly (TOSA) arrangement disposed in the housing; and a second flexible printed circuit (FPC) having a first region electrically coupled to the tra
characterised by the shape of the housing (for semiconductor lasers H01S5/02208) · CPC title
Details of housings · CPC title
the printed circuit boards being flexible (in general H05K1/147) · CPC title
characterised by the use of flexible or folded printed circuits · CPC title
specially for flexible printed circuits, e.g. using folded portions · CPC title
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