Multilayered flexible printed circuit with both radio frequency (RF) and DC transmission lines electrically isolated from each other and an optical transceiver using same

US10230470B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10230470-B2
Application numberUS-201715475082-A
CountryUS
Kind codeB2
Filing dateMar 30, 2017
Priority dateMar 30, 2017
Publication dateMar 12, 2019
Grant dateMar 12, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

In accordance with an embodiment, a multi-layered flexible printed circuit (FPC) is disclosed that includes two or more insulating layers to route conductive traces carrying radio frequency (RF) signals, e.g., data signals, and conductive traces carrying direct current (DC) signals, e.g., power signals and low-frequency control signals, while sufficiently isolating the RF signals from electrical interference by the DC transmission lines. This advantageously eliminates having two or more separate FPCs to electrically couple each optical subassembly, e.g., receiver optical subassemblies (ROSAs) and transmitter optical subassemblies (TOSAs), to associated circuitry in a transceiver housing, which saves space and reduces manufacturing complexity, for example.

First claim

Opening claim text (preview).

What is claimed is: 1. An optical transceiver module comprising: a housing; a receive connecting circuit; a receiver optical subassembly (ROSA) arrangement disposed in the housing; and a first flexible printed circuit (FPC) having a first region electrically coupled to the receive connecting circuit and a second region electrically coupled to the ROSA arrangement, the first FPC comprising: a first plurality of conductive traces for providing a radio frequency (RF) signal between the ROSA arrangement and the receive connecting circuit; a second plurality of conductive traces for providing a power waveform; at least one insulating layer disposed between the first and second plurality of conductive traces; and wherein the first plurality of conductive traces is electrically isolated from the second plurality of conductive traces to prevent interference with the RF signal. 2. The optical transceiver module of claim 1 , wherein the first FPC further comprises an RF ground reference plane disposed between the first and second plurality of conductive traces to provide electrical isolation between the RF signal of the first plurality of conductive traces and the power waveform of the second plurality of conductive traces. 3. The optical transceiver module of claim 1 , wherein the first FPC includes a cut-out for receiving an array of photodiodes associated with the ROSA arrangement. 4. The optical transceiver module of claim 3 , wherein a plurality of conductive pads are disposed around a perimeter of the cut-out and are electrically coupled to respective conductive traces of the second plurality of conductive traces, and wherein a first conductive pad and a second conductive pad of the plurality of conductive pads are positioned on opposite sides of the cut-out from each other. 5. The optical transceiver module of claim 1 , wherein the at least one insulating layer comprises at least first and second insulating layers, the second insulating layer being disposed on the first insulating layer, and wherein the first plurality of conductive traces are disposed on an external surface of the first insulating layer and the second plurality of conductive traces are disposed on the second insulating layer. 6. The optical transceiver module of claim 5 , wherein the first FPC includes a conductive terminal disposed on the external surface of the first insulating layer, and wherein a conductive trace of the second plurality of conductive traces extends through the first insulating layer to electrically couple to the conductive terminal. 7. The optical transceiver module of claim 1 , wherein the first FPC further comprises a first arm portion and a second arm portion, the first and second arm portions extending along a longitudinal axis of the first FPC and separated from each other by a gap. 8. The optical transceiver module of claim 7 , wherein the first FPC further comprises a first flexible region extending between the first arm portion and an end of the FPC. 9. The optical transceiver module of claim 1 , wherein the first plurality of conductive traces include a separation spacing between conductive traces that is greater than a separation spacing between conductive traces of the second plurality of conductive traces. 10. An optical transceiver module comprising: a housing; a transmit connecting circuit and a receive connecting circuit each disposed at least partially within the housing; a receiver optical subassembly (ROSA) arrangement disposed in the housing; a first flexible printed circuit (FPC) having a first region electrically coupled to the receive connecting circuit and a second region electrically coupled to the ROSA arrangement, the first FPC comprising: a first plurality of conductive traces for providing a radio frequency (RF) signal between the ROSA arrangement and the receive connecting circuit; a second plurality of conductive traces for providing a power waveform; and wherein the first plurality of conductive traces is electrically isolated from the second plurality of conductive traces to prevent interference with the RF signal; a transmitter optical subassembly (TOSA) arrangement disposed in the housing; and a second flexible printed circuit (FPC) having a first region electrically coupled to the transmit connecting circuit and a second region electrically coupled to the TOSA arrangement, the second FPC comprising: a first plurality of conductive traces for providing a radio frequency (RF) signal between the transmit connecting circuit and the TOSA arrangement; a second plurality of conductive traces for providing a power waveform; and wherein the first plurality of conductive traces is electrically isolated from the second plurality of conductive traces to prevent interference with the RF signal. 11. The optical transceiver module of claim 10 , wherein the second FPC includes a cut-out for receiving an array of photodiodes associated with the ROSA arrangement. 12. The optical transceiver module of claim 11 , wherein a plurality of conductive pads is disposed around a perimeter of the cut-out of the first FPC, each of the plurality of conductive pads being electrically coupled to an associated conductive trace of the second plurality of conductive traces, and wherein a first conductive pad and a second conductive pad of the plurality of conductive pads are disposed on opposite sides of the cut-out from each other. 13. The optical transceiver module of claim 10 , wherein each of the first and second FPCs further comprise at least a first, second, and third insulating layer, the second insulating layer being coupled between the first and second insulating layers, and wherein the first plurality of conductive traces is disposed on the first insulating layer and the second plurality of conductive traces is disposed on the third insulating layer. 14. The optical transceiver module of claim 13 , wherein the first FPC includes a conductive terminal disposed on an external surface of the first insulating layer, and wherein a conductive trace of the second plurality of conductive traces extends through the first and second insulating layers to electrically couple to the conductive terminal. 15. The optical transceiver module of claim 10 , wherein the first FPC further comprises a first arm portion and a second arm portion, the first and second arm portions extending along a longitudinal axis of the first FPC and separated from each other by a gap. 16. The optical transceiver module of claim 10 implemented as a Quad Small Form-Factor Pluggable transceiver. 17. An optical transceiver comprising: a housing; a transmit connecting circuit and a receive connecting circuit each disposed at least partially within the housing; a receiver optical subassembly (ROSA) arrangement disposed in the housing; a first flexible printed circuit (FPC) having a first region electrically coupled to the receive connecting circuit and a second region electrically coupled to the ROSA arrangement, the first FPC comprising: a first plurality of conductive traces for providing a radio frequency (RF) signal between the ROSA arrangement and the receive connecting circuit; a second plurality of conductive traces for providing a power waveform; and wherein the first plurality of conductive traces is electrically isolated from the second plurality of conductive traces to prevent interference with the RF signal; a transmitter optical subassembly (TOSA) arrangement disposed in the housing; and a second flexible printed circuit (FPC) having a first region electrically coupled to the tra

Assignees

Inventors

Classifications

  • characterised by the shape of the housing (for semiconductor lasers H01S5/02208) · CPC title

  • Details of housings · CPC title

  • the printed circuit boards being flexible (in general H05K1/147) · CPC title

  • characterised by the use of flexible or folded printed circuits · CPC title

  • specially for flexible printed circuits, e.g. using folded portions · CPC title

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What does patent US10230470B2 cover?
In accordance with an embodiment, a multi-layered flexible printed circuit (FPC) is disclosed that includes two or more insulating layers to route conductive traces carrying radio frequency (RF) signals, e.g., data signals, and conductive traces carrying direct current (DC) signals, e.g., power signals and low-frequency control signals, while sufficiently isolating the RF signals from electrica…
Who is the assignee on this patent?
Applied Optoelectronics Inc
What technology area does this patent fall under?
Primary CPC classification H04B10/40. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Mar 12 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).