Fingerprint recognition device, method of manufacturing the same, and electronic device thereof

Patent metadata

Field	Value
Publication number	US-10229306-B2
Application number	US-201415114982-A
Country	US
Kind code	B2
Filing date	Sep 15, 2014
Priority date	Aug 8, 2013
Publication date	Mar 12, 2019
Grant date	Mar 12, 2019

Abstract

A fingerprint recognition device includes: an integrated circuit electrically connected to at least one sensor electrode; a first circuit board located at an upper portion of the integrated circuit and provided with the at least one sensor electrode; a second circuit board electrically connected to the first circuit board and located at under the integrated circuit; a molding layer provided under the first circuit board to surround the integrated circuit so as to protect the integrated circuit from the outside; and a connection part electrically connecting the first circuit board and the second circuit board.

First claim

The invention claimed is:

1. A fingerprint recognition device comprising:
an integrated circuit electrically connected to at least one sensor electrode;
a first circuit substrate disposed on an upper portion of the integrated circuit, and on which the at least one sensor electrode is provided;
a second circuit substrate electrically connected to the first circuit substrate and disposed under the integrated circuit;
a molding layer provided under the first circuit substrate and configured to surround the integrated circuit to protect the integrated circuit from the outside; and
a connecting part electrically connecting the first circuit substrate to the second circuit substrate,
wherein the first circuit substrate comprises a structure in which a plurality of circuit layers are rearranged to transmit a signal sensed by the at least one sensor electrode to the integrated circuit.

2. The fingerprint recognition device of claim 1 , wherein the at least one sensor electrode is provided on a surface of the first circuit substrate which is exposed to the outside.

3. The fingerprint recognition device of claim 1 , wherein the at least one sensor electrode is provided in the first circuit substrate and is adjacent to a surface of the first circuit substrate which is exposed to the outside.

4. The fingerprint recognition device of claim 1 , wherein at least one signal transmission path is formed on the first circuit substrate to transmit the signal sensed by the at least one sensor electrode to the integrated circuit, and
wherein the at least one signal transmission path comprises:
a first circuit layer on which the at least one sensor electrode is disposed;
a second circuit layer on which an electrode provided under the first circuit substrate is disposed; and
a micro via electrically connecting the first circuit to the second circuit.

5. The fingerprint recognition device of claim 4 , wherein the at least one signal transmission path further comprises at least one third circuit layer disposed between the first circuit layer and the second circuit layer,
wherein the micro via electrically connects the first circuit layer, the at least one third circuit layer, and the second circuit layer which have a stacked structure.

6. The fingerprint recognition device of claim 4 , wherein, in order to transmit the signal sensed by the at least one sensor electrode to the integrated circuit through the at least one signal transmission path, the electrode is electrically connected to the integrated circuit through a connecting member.

7. The fingerprint recognition device of claim 1 , wherein a receiving recess recessed toward the integrated circuit is formed on a bottom surface of the molding layer, and
the second circuit substrate is received in the receiving recess and separated from a structure disposed under the molding layer.

8. The fingerprint recognition device of claim 7 , wherein the receiving recess and the second circuit substrate received in the receiving recess are bent.

9. The fingerprint recognition device of claim 7 , wherein the receiving recess is formed on a central portion of the bottom surface of the molding layer.

10. The fingerprint recognition device of claim 7 , wherein the receiving recess is formed on a side portion of the bottom surface of the molding layer.

11. The fingerprint recognition device of claim 7 , wherein the receiving recess is formed on one end portion of the bottom surface of the molding layer.

12. The fingerprint recognition device of claim 1 , wherein at least one of a recessed portion and a punching portion is formed on the second circuit substrate, and
the at least one of the recessed portion and the punching portion is filled by the molding layer.

13. The fingerprint recognition device of claim 1 , wherein a receiving recess recessed toward the integrated circuit is formed on a bottom surface of the molding layer, and
one end portion of the first circuit substrate is bent to face a lower surface of the integrated circuit and received in the receiving recess.

14. The fingerprint recognition device of claim 1 , wherein one end portion of the first circuit substrate is bent away from the integrated circuit along the molding layer.

15. The fingerprint recognition device of claim 1 , wherein the first circuit substrate comprises a structure in which a plurality of circuit layers are rearranged to transmit a signal sensed by the at least one sensor electrode to the integrated circuit, and
the first circuit substrate comprises a rigid-flexible printed circuit board and a rigid-flexible separated-connected printed circuit board.

16. A method of manufacturing a fingerprint recognition device, comprising:
electrically connecting an integrated circuit to a first circuit substrate on which at least one sensor electrode is provided through a connecting member; and
forming a molding layer configured to surround the integrated circuit on the first circuit substrate to protect the integrated circuit from the outside,
wherein the first circuit substrate comprises a structure in which a plurality of circuit layers are rearranged to transmit a signal sensed by the at least one sensor electrode to the integrated circuit.

17. The method of manufacturing the fingerprint recognition device of claim 16 , wherein the first circuit substrate is formed by stacking the plurality of circuit layers.

18. An electronic device using a fingerprint recognition device, the electronic device comprising:
an integrated circuit electrically connected to at least one sensor electrode;
a first circuit substrate disposed on an upper portion of the integrated circuit and on which the at least one sensor electrode is provided;
a second circuit substrate electrically connected to the first circuit substrate and disposed under the integrated circuit; and
a molding layer provided under the first circuit substrate and configured to surround the integrated circuit to protect the integrated circuit from the outside, and
wherein a curved surface is formed at a periphery of the fingerprint recognition device, and
wherein the first circuit substrate comprises a structure in which a plurality of circuit layers are rearranged to transmit a signal sensed by the at least one sensor electrode to the integrated circuit.

19. The electronic device of claim 18 , wherein a receiving recess recessed toward the integrated circuit is formed on a bottom surface of the molding layer, and
the second circuit substrate is received in the receiving recess and spaced apart from the structure.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Kim Il
• Moon Young Jun
• Park Tae Sang
• Jang Kyung Woon
• Oh Seung Hee
• Chung Chang Kyu
• Lee Dong Yul

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W70/63

  Vias, e.g. via plugs · CPC title

• G06F3/03547

  Touch pads, in which fingers can move on a surface · CPC title

• G06F2203/0338

  Fingerprint track pad, i.e. fingerprint sensor used as pointing device tracking the fingertip image · CPC title