Conveyance apparatus

Patent metadata

Field	Value
Publication number	US-10227183-B2
Application number	US-201715828603-A
Country	US
Kind code	B2
Filing date	Dec 1, 2017
Priority date	Dec 5, 2016
Publication date	Mar 12, 2019
Grant date	Mar 12, 2019

Abstract

A soldering apparatus as a conveyance apparatus includes a substrate loading portion to load a substrate on the soldering apparatus, an intermittent feeding unit to intermittently feed the substrate loaded on the soldering apparatus, a substrate discharge portion to discharge the intermittently fed substrate to the outside of the soldering apparatus and a controller to control conveyance of the substrate. The substrate loading portion includes a first conveyance path to convey the substrate, a first sensor provided in the vicinity of a substrate loading inlet of the substrate loading portion, and a second sensor arranged in a downstream side of the first sensor along the substrate conveyance direction. The intermittent feeding unit includes a second conveyance path for conveying the substrate, and a third sensor placed in the vicinity of an upstream end of the intermittent feeding unit along the substrate conveyance direction.

First claim

The invention claimed is:

1. A conveyance apparatus that conveys a substrate, comprising:
a substrate loading portion configured to load the substrate on the conveyance apparatus;
an intermittent feeding unit configured to intermittently feed the substrate loaded on the conveyance apparatus;
a substrate discharge portion configured to discharge the intermittently fed substrate to the outside of the conveyance apparatus; and
a controller configured to control conveyance of the substrate, said substrate loading portion, said intermittent feeding unit, said substrate discharge portion being arranged from an upstream side to a downstream side along a substrate conveyance direction,
wherein the substrate loading portion having a substrate loading inlet includes
a first conveyance path configured to convey the substrate;
a first sensor provided in the vicinity of the substrate loading inlet thereof, and
a second sensor arranged in a downstream side of the first sensor along the substrate conveyance direction, and

wherein the intermittent feeding unit having an upstream end along the substrate conveyance direction includes
a second conveyance path for conveying the substrate, and
a third sensor placed in the vicinity of the upstream end thereof

wherein when the second sensor detects the substrate conveyed on the first conveyance path, the third sensor does not detect a substrate which precedes the substrate, and the first sensor detects the substrate,
the controller continues conveyance of the substrate until the substrate is no longer detected by the first sensor.

2. The conveyance apparatus according to claim 1 , wherein the conveyance apparatus further comprises a pusher configured to push the substrate conveyed on the first conveyance path to the second conveyance path, and
wherein, when the first sensor does not detect the substrate conveyed on the first conveyance path, the second sensor detects the substrate, and the third sensor does not detect the substrate which precedes the substrate, the controller drives the pusher.

3. The conveyance apparatus according to claim 1 , wherein the intermittent feeding unit includes a fourth sensor placed in an upstream side of the third sensor along the substrate conveyance direction, and
the controller determines that the substrate is placed in a normal position when the third sensor detects the substrate, and the fourth sensor does not detect the substrate.

4. The conveyance apparatus according to claim 1 , wherein the intermittent feeding unit includes a pair of conveyance claws configured to press the substrate.

5. The conveyance apparatus according to claim 1 , wherein the intermittent feeding unit includes a third conveyance path in a downstream side of the second conveyance path along the substrate conveyance direction, and
the substrate discharge portion includes a fourth conveyance path.

6. The conveyance apparatus according to claim 1 , wherein the intermittent feeding unit includes at least a chamber for performing a process in a sealed space.

7. The conveyance apparatus according to claim 1 , wherein the intermittent feeding unit includes
a pre-heating portion configured to pre-heat the substrate,
a main heating portion configured to solder the pre-heated substrate,
a vacuum deaerating portion having a vacuum chamber for vacuum deaeration for the soldered substrate, and
a cooling portion configured to cool the substrate subjected to the vacuum deaeration.

8. A conveyance apparatus that conveys a substrate, comprising:
a substrate loading portion configured to load the substrate on the conveyance apparatus;
an intermittent feeding unit configured to intermittently feed the substrate loaded on the conveyance apparatus;
a substrate discharge portion configured to discharge the intermittently fed substrate to the outside of the conveyance apparatus; and
a controller configured to control conveyance of the substrate, said substrate loading portion, said intermittent feeding unit, said substrate discharge portion being arranged from an upstream side to a downstream side along a substrate conveyance direction,
wherein the substrate loading portion having a substrate loading inlet includes
a first conveyance path configured to convey the substrate;
a first sensor provided in the vicinity of the substrate loading inlet thereof, and
a second sensor arranged in a downstream side of the first sensor along the substrate conveyance direction,

wherein the intermittent feeding unit having an upstream end along the substrate conveyance direction includes
a second conveyance path for conveying the substrate, and
a third sensor placed in the vicinity of the upstream end thereof, and the conveyance apparatus further comprises:

a pusher configured to push the substrate conveyed on the first conveyance path to the second conveyance path,
wherein when the second sensor detects the substrate conveyed on the first conveyance path, and the third sensor detects a substrate which is preceded by the substrate,
the controller suspends conveyance of the substrate,
wherein when the first sensor does not detect the substrate conveyed on the first conveyance path, the second sensor detects the substrate, and the third sensor does not detect a preceding substrate out of the substrates conveyed by the conveyance apparatus, and
the controller drives the pusher.

9. The conveyance apparatus according to claim 8 , wherein the intermittent feeding unit includes a pair of conveyance claws configured to press the substrate.

10. The conveyance apparatus according to claim 8 , wherein the intermittent feeding unit includes a third conveyance path in a downstream side of the second conveyance path along the substrate conveyance direction, and
the substrate discharge portion includes a fourth conveyance path.

11. The conveyance apparatus according to claim 8 , wherein the intermittent feeding unit includes a fourth sensor placed in an upstream side of the third sensor along the substrate conveyance direction, and
the controller determines that the substrate is placed in a normal position when the third sensor detects the substrate, and the fourth sensor does not detect the substrate.

12. The conveyance apparatus according to claim 8 , wherein the intermittent feeding unit includes at least a chamber for performing a process in a sealed space.

13. The conveyance apparatus according to claim 8 , wherein the intermittent feeding unit includes
a pre-heating portion configured to pre-heat the substrate,
a main heating portion configured to solder the pre-heated substrate,
a vacuum deaerating portion having a vacuum chamber for vacuum deaeration for the soldered substrate, and
a cooling portion configured to cool the substrate subjected to the vacuum deaeration.

14. A conveyance apparatus that conveys a substrate, comprising:
a substrate loading portion configured to load the substrate on the conveyance apparatus;
an intermittent feeding unit configured to intermittently feed the substrate loaded on the conveyance apparatus;
a substrate discharge portion configured to discharge the intermittently fed substrate to the outside of the conveyance apparatus; and
a controller configured to control conveyance of the substrate, said substrate loading portion, said intermittent feeding unit, said substrate discharge portion being arranged from an upstream side to a downstream side along a substrate conveyance direction,
wherein the substrate loading portion having a substrate loading inlet includes
a first conveyance path configured to convey the substrate;
a first sensor pr

Assignees

• Senju Metal Industry Co

Inventors

• Saito Yuta

Classifications

• H10P72/3411

  involving loading and unloading of wafers · CPC title

• H10P72/3402

  Mechanical parts of transfer devices · CPC title

• H10P72/0618

  using identification means, e.g. labels on substrates or labels on containers · CPC title

• H10P72/0612

  Production flow monitoring, e.g. for increasing throughput · CPC title

• H10P72/0446

  Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates · CPC title