Laser machining apparatus
US-2018354070-A1 · Dec 13, 2018 · US
Laser processing system
US10226835B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10226835-B2 |
| Application number | US-201715704153-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 14, 2017 |
| Priority date | Sep 29, 2016 |
| Publication date | Mar 12, 2019 |
| Grant date | Mar 12, 2019 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A laser processing system includes a laser processing apparatus having a laser oscillator, a processing apparatus main body, and a laser nozzle that is provided in the processing apparatus main body, a robot for transferring a workpiece to a machining position of the laser nozzle to perform predetermined machining for the workpiece, an output measurement instrument that is located at a standby position provided in the processing apparatus main body and that is capable of measuring output of the laser beam from the laser nozzle, and a robot controller for controlling operation of the robot, wherein the robot controller controls the robot to support the output measurement instrument located at the standby position and to move the output measurement instrument to an irradiation position of the laser beam of the laser nozzle for measurement of the output.
First claim
Opening claim text (preview).
The invention claimed is: 1. A laser processing system comprising: a laser processing apparatus including a laser oscillator, a processing apparatus main body, and a laser nozzle that is provided in the processing apparatus main body and to which a laser beam is supplied from the laser oscillator; a robot which moves a workpiece to a machining position by the laser nozzle to perform predetermined machining for the workpiece; an output measurement instrument that is located at a standby position provided in the processing apparatus main body and that is capable of measuring output of the laser beam from the laser nozzle; and a robot controller for controlling operation of the robot, wherein the robot controller is configured to control the robot to support the output measurement instrument located at the standby position and to move the output measurement instrument to an irradiation position of the laser beam from the laser nozzle for measurement of the output. 2. The laser processing system according to claim 1 , wherein the robot controller controls the robot to move the output measurement instrument to the irradiation position at a predetermined timing for measurement of the output, and in a case where measured output is below a reference value, the robot controller causes a predetermined notification device to operate. 3. The laser processing system according to claim 1 , wherein a master plate of a tool changer is attached to a distal end of the robot, and wherein a tool-side member that is capable of being detachably attached to the master plate is attached to the output measurement instrument. 4. The laser processing system according to claim 1 , wherein the standby position is a position that is higher than the machining position of the laser beam from the laser nozzle.
Assignees
Inventors
Classifications
- B23K26/00Primary
Working by laser beam, e.g. welding, cutting or boring · CPC title
Beam measuring devices · CPC title
Devices involving relative movement between laser beam and workpiece · CPC title
- B23K26/02Primary
Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam · CPC title
Auxiliary equipment · CPC title
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Frequently asked questions
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- What does patent US10226835B2 cover?
- A laser processing system includes a laser processing apparatus having a laser oscillator, a processing apparatus main body, and a laser nozzle that is provided in the processing apparatus main body, a robot for transferring a workpiece to a machining position of the laser nozzle to perform predetermined machining for the workpiece, an output measurement instrument that is located at a standby …
- Who is the assignee on this patent?
- Fanuc Corp
- What technology area does this patent fall under?
- Primary CPC classification B23K26/00. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Mar 12 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 7 related publications on this page (citations in our corpus or others sharing the same primary CPC).