Magnetic circuit board and method for manufacturing same

Patent metadata

Field	Value
Publication number	US-10225934-B2
Application number	US-201515313457-A
Country	US
Kind code	B2
Filing date	Mar 19, 2015
Priority date	May 26, 2014
Publication date	Mar 5, 2019
Grant date	Mar 5, 2019

Abstract

A circuit board ( 01 ), including at least two electrically conductive layers ( 02 ) arranged one above the other and at least one dielectric layer ( 03 ), which is arranged between adjacent electrically conductive layers ( 02 ), is provided. The circuit board ( 01 ) is characterized in particular in that the plate has at least two magnetically conductive layers ( 05 ), wherein each magnetically conductive layer ( 05 ) is arranged at least indirectly adjacent to an electrically conductive layer ( 02 ), and that the circuit board also has vertical recesses for accommodating magnetic vias ( 08 ) for connecting the magnetically conductive layers ( 05 ) in a specific manner. A method for producing such a circuit board ( 01 ) is provided.

First claim

The invention claimed is:

1. A circuit board comprising:
at least two electrically conductive layers situated one above the other and spaced apart from one another;
at least one dielectric layer situated between the electrically conductive layers;
at least two-magnetically conductive layers spaced apart from one another, each magnetically conductive layer being situated at least indirectly adjacent to one of the electrically conductive layers, the magnetically conductive layers being made of ferromagnetic powder-filled plastic sheets or metal sheets, the magnetically conductive layers including a first magnetically conductive layer and a second magnetically conductive layer, the electrically conductive layers including a first electrically conductive layer and a second electrically conductive layer, the first electrically conductive layer and the second electrically conductive layer being between the first magnetically conductive layer and the second magnetically conductive layer; and
vertical recesses for accommodating magnetic vias for magnetically connecting the magnetically conductive layers in a targeted manner, two of the vertical recesses penetrating each of the ferromagnetic powder-filled plastic sheets or metal sheets,
wherein the circuit board is designed as a panel including a plurality of adjacently situated individual circuit boards, the magnetically conductive layers being applied over the entire surface area of the panel.

2. The circuit board as recited in claim 1 wherein the magnetic vias include a magnetically conductive material introduced into the vertical recesses.

3. The circuit board as recited in claim 1 wherein the first and the second magnetically conductive layers are outermost layers of the circuit board.

4. The circuit board as recited in claim 1 wherein a symmetrical sequence of the electrically conductive layers and the magnetically conductive layers is present.

5. The circuit board as recited in claim 4 wherein the symmetrical sequence includes insulating layers of the at least one dielectric layer.

6. The circuit board as recited in claim 1 wherein the magnetically conductive layers have magnetic flux-collecting properties or shielding properties.

7. The circuit board as recited in claim 1 wherein the circuit board is designed as a flexible circuit board.

8. The circuit board as recited in claim 1 wherein the electrically conductive layers form at least one coil.

9. The circuit board as recited in claim 1 further comprising at least two auxiliary layers, each of the auxiliary layers mechanically connecting one of the electrically conductive layers to one of the ferromagnetic powder-filled plastic sheets or metal sheets.

10. The circuit board as recited in claim 9 wherein the magnetically conductive layers are made of ferromagnetic powder-filled plastic sheets and the auxiliary layers are electrically and/or magnetically and/or thermally insulating.

11. The circuit board as recited in claim 1 wherein the magnetically conductive layers are made of metal sheets in the form of foil materials.

12. The circuit board as recited in claim 1 wherein the magnetic vias are formed of ferromagnetic materials.

13. The circuit board as recited in claim 1 further comprising electrical vias electrically connecting the electrically conductive layers, the electrical vias being distinct from the magnetic vias.

14. A circuit board comprising:
at least two electrically conductive layers situated one above the other and spaced apart from one another;
at least one dielectric layer situated between the electrically conductive layers;
at least two magnetically conductive layers spaced apart from one another, each magnetically conductive layer being situated at least indirectly adjacent to one of the electrically conductive layers, the magnetically conductive layers being made of ferromagnetic powder-filled plastic sheets or metal sheets, the magnetically conductive layers including a first magnetically conductive layer and a second magnetically conductive layer, the electrically conductive layers including a first electrically conductive layer and a second electrically conductive layer, the first electrically conductive layer and the second electrically conductive layer being between the first magnetically conductive layer and the second magnetically conductive layer; and
vertical recesses for accommodating magnetic vias for magnetically connecting the magnetically conductive layers in a targeted manner, two of the vertical recesses penetrating each of the ferromagnetic powder-filled plastic sheets or metal sheets,
wherein the electrically conducting layers includes a third electrically conductive layer and a fourth electrically conductive layer, the magnetically conductive layers including a third magnetically conductive layer and a fourth magnetically conductive layer, the third electrically conductive layer and the fourth electrically conductive layer being between the third magnetically conductive layer and the fourth magnetically conductive layer.

15. The circuit board as recited in claim 14 wherein the first electrically conductive layer, the second electrically conductive layer, the third electrically conductive layer and the fourth electrically conductive layer are between the first magnetically conductive layer and the fourth magnetically conductive layer.

Assignees

• Schaeffler Technologies Ag

Inventors

• Kegeler Joerg

Classifications

• H05K3/429

  Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers · CPC title

• H05K1/0233

  Filters, inductors or a magnetic substance · CPC title

• H05K2201/09309

  Core having two or more power planes; Capacitive laminate of two power planes · CPC title

• H05K1/036

  Multilayers with layers of different types · CPC title

• H01F1/0306

  Metals or alloys, e.g. LAVES phase alloys of the MgCu2-type (H01F1/0304 takes precedence) · CPC title