Contact arrangement for a multi-layer circuit board

Patent metadata

Field	Value
Publication number	US-10225926-B2
Application number	US-201314652182-A
Country	US
Kind code	B2
Filing date	Oct 24, 2013
Priority date	Dec 13, 2012
Publication date	Mar 5, 2019
Grant date	Mar 5, 2019

Abstract

The invention relates to a contact arrangement ( 30 ) for a multi-layer circuit board ( 1 a ), said circuit board ( 1 a ) having at least one inner wire ( 2 ) which is contacted via at least one cutout ( 10 ). According to the invention, at least two cutouts ( 10 ) are arranged on different sides of the at least one inner wire ( 2 ), the center axes ( 2 ) of the at least two cutouts ( 10 ) having a predefined distance (a s ) to a target center line ( 2.4 ) of the at least one inner wire ( 2 ). The at least two cutouts ( 10 ) expose the at least one inner wire ( 2 ) in at least two contact zones ( 2.1 ) for the purpose of contact, said contact zones being arranged on different sides of the wire ( 2 ).

First claim

What is claimed is:

1. A contact arrangement for a multi-layer circuit carrier ( 1 a , 1 b , 1 c , 1 d ), wherein the circuit carrier ( 1 a , 1 b , 1 c , 1 d ) comprises at least one inner-lying wire ( 2 ) that is contacted by way of at least one cut-out ( 10 ), characterized in that at least two cutouts ( 10 ) are spaced apart on different sides of the at least one inner-lying wire ( 2 ), wherein at least one of the cut-outs ( 10 ) receives a contact element ( 22 ), wherein center axes ( 12 ) of the at least two cut-outs ( 10 ) comprise a predetermined spacing (as) with respect to a desired center line ( 2 . 4 ) of the at least one inner-lying wire ( 2 ), wherein the at least two cut-outs ( 10 ) expose the at least one inner-lying wire ( 2 ) to enable contact with at least two contact regions ( 2 . 1 ) that are arranged on different sides of the inner-lying wire ( 2 ), whereby, the contact element ( 22 ) is connected to the inner-lying wire ( 2 ) in an electrically conductive manner.

2. The contact arrangement as claimed in claim 1 , characterized in that the predetermined spacing (a s ) of the center axes ( 12 ) of the at least two cut-outs ( 10 ) with respect to the desired center line ( 2 . 4 ) of the at least one inner-lying wire ( 2 ) is reduced corresponding to a tolerance deviation (Δa) of the at least one inner-lying wire ( 2 ) with respect to the desired center line ( 2 . 4 ).

3. The contact arrangement as claimed in claim 1 , characterized in that a spacing (a m ) between the center axes ( 12 ) of the at least two cut-outs ( 10 ) can be varied in the case of the predetermined spacing (a s ) with respect to the desired center line ( 2 . 4 ) by way of an alignment angle (α).

4. The contact arrangement as claimed in claim 1 , characterized in that the walls of the cut-outs ( 10 ) are embodied in an electrically conductive manner.

5. The contact arrangement as claimed in claim 1 , characterized in that the at least two cut-outs ( 10 ) are arranged in a region of a wire end ( 2 . 2 ) of the at least one inner-lying wire ( 2 ).

6. The contact arrangement as claimed in claim 1 , characterized in that at least one cut-out ( 10 ) is arranged between two inner-lying wires ( 2 ) and contacts the two wires ( 2 ).

7. The contact arrangement as claimed in claim 1 , characterized in that two contact elements ( 22 ) are inserted in respective ones of the two cut-outs ( 10 ).

8. The contact arrangement as claimed in claim 7 , characterized in that each of the contact elements ( 22 ) is force fitted and/or soldered into a corresponding cut-out ( 10 ).

9. The contact arrangement as claimed in claim 7 , characterized in that the two contact elements ( 22 ) are mutually connected by way of a connecting piece ( 24 ) and form a double pin ( 20 ).

10. The contact arrangement as claimed in claim 9 , characterized in that a spacing (a m ) between the center axes ( 12 ) of the at least two cut-outs ( 10 ) is adjusted by way of an alignment angle (α) to a predetermined spacing (a k ) between the contact elements ( 22 ) of the double pin ( 20 ).

11. The contact arrangement as claimed in claim 1 , wherein one of the at least two contact regions ( 2 . 1 ) includes a wall embodied from an electrically conductive hole bushing ( 14 ).

12. The contact arrangement as claimed in claim 11 , wherein the at least one inner-lying wire ( 2 ) is in physical contact with an exterior of the electrically conductive hole bushing ( 14 ), and wherein the contact element is in physical contact with an interior of the bushing.

13. The contact arrangement as claimed in claim 7 , wherein the at least two contact regions ( 2 . 1 ) each include a wall embodied from an electrically conductive hole bushing ( 14 ).

14. The contact arrangement as claimed in claim 13 , wherein the at least one inner-lying wire ( 2 ) is in physical contact with an exterior of the electrically conductive hole bushing ( 14 ) in each of the contact regions, and wherein each of the contact elements is in physical contact with an interior of the bushing in the respective one of the cut-outs.

Assignees

• Bosch Gmbh Robert

Inventors

• Schaefer Rainer

Classifications

• H05K2201/10287

  Metal wires as connectors or conductors · CPC title

• H05K1/0263 Primary

  High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board (H05K1/0293 takes precedence) · CPC title

• H05K1/0298

  Multilayer circuits · CPC title

• H05K1/115

  Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title

• H05K1/0265 Primary

  characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections · CPC title