Surface-mount inductor

Patent metadata

Field	Value
Publication number	US-10224144-B2
Application number	US-201514972965-A
Country	US
Kind code	B2
Filing date	Dec 17, 2015
Priority date	Dec 20, 2014
Publication date	Mar 5, 2019
Grant date	Mar 5, 2019

Abstract

A surface-mount inductor including: a coil formed by winding insulated wire and bringing out lead ends therefrom; and a plurality of premolded bodies for accommodating the coil inside, thereby thermopressing to form, wherein a pair of metal terminals is embedded laterally on the outer surface of the surface-mount inductor, and the lead ends of the coil are brought out from the bottom surface of the surface-mount inductor and laterally laid on the outer surface of the metal terminals, as well as a method for manufacturing the same.

First claim

What is claimed is:

1. A surface-mount inductor including: a coil formed by winding insulated wire and bringing out lead ends therefrom; and a premolded body formed of a mixture of magnetic powder and thermosetting resin to accommodate the coil whose lead ends are brought out therefrom, whereby processing the premolded body by thermopressing to form, the surface-mount inductor comprising
a pair of metal terminals each of which comprises a bottom surface portion with a cutout from which one of the lead ends is brought out, a side surface portion folded from the bottom surface portion, and an embedding portion folded from the side surface portion in parallel to the bottom surface portion, the embedding portion being embedded into an inside of the surface-mount inductor, and the bottom surface portion and the side surface portion being arranged on an outer exposed surface of the surface-mount inductor and being embedded thereon in their thickness direction,
wherein each of the lead ends is brought out from the cutout of the bottom surface portion of one of the metal terminals onto the bottom surface portion of one of the metal terminals and arranged on and extending along the bottom surface portion of the metal terminal, a base portion brought out from the cutout of the metal terminal being embedded into the bottom surface of the surface-mount inductor together with the cutout; and
each of the lead ends arranged on the outer surface of the metal terminal, together with the metal terminal, are embedded on the bottom of the outer exposed surface of the surface-mount inductor in its diameter direction,
wherein the lead ends of the winding and the metal terminals are connected with solder, respectively, and
the metal terminals are formed on the bottom surface of the outer exposed surface of the surface-mount inductor, and the metal terminals comprise a winding lead ends base region, a winding lead ends embedded region and a terminal region.

2. A surface-mount inductor including: a coil formed by winding insulated wire and bringing out lead ends therefrom; and a premolded body formed of a mixture of magnetic powder and thermosetting resin to accommodate the coil whose lead ends are brought out therefrom, whereby processing the premolded body by thermopressing to form,
wherein each of a pair of metal terminals comprises a bottom surface portion with a cutout from which one of the lead ends is brought out, a side surface portion folded from the bottom surface portion, and an embedding portion folded from the side surface portion and embedded into an inside of the surface-mount inductor, and the bottom surface portion being arranged to be embedded on a bottom surface of an outer exposed surface of the surface-mount inductor in its thickness direction,
wherein each of the lead ends is brought out from the cutout of one of the metal terminals onto the bottom surface portion of one of the metal terminals, and arranged on and extending along the bottom surface portion of the metal terminal, a base portion brought out from the cutout of the metal terminal being embedded into the bottom surface of the surface-mount inductor together with the cutout; and
each of the lead ends arranged on the outer surface of the metal terminal, together with the metal terminal, are embedded on the bottom surface of the outer exposed surface of the surface-mount inductor in its diameter direction,
wherein the lead ends of the winding and the metal terminals are connected with solder, respectively, and
the metal terminals are formed on the bottom surface of the outer exposed surface of the surface-mount inductor, and the metal terminals comprise a winding lead ends base region, a winding lead ends embedded region and a terminal region.

Assignees

• Toko Inc
• Murata Manufacturing Co

Inventors

• Watanabe Ryota
• Ohaga Takeo
• Mori Hiroyasu
• Mizukoshi Yasutaka
• Arai Takumi
• Totsuka Masaaki
• Sasamori Kunio

Classifications

• H01F27/292 Primary

  Surface mounted devices · CPC title

• H01F27/2828

  Construction of conductive connections, of leads · CPC title

• H01F27/306

  Fastening or mounting coils or windings on core, casing or other support · CPC title

• H01F27/255

  made from particles (H01F27/26 takes precedence) · CPC title