Method of manufacturing a micro heatsink by an additive process

Patent metadata

Field	Value
Publication number	US-10221498-B2
Application number	US-201514823194-A
Country	US
Kind code	B2
Filing date	Aug 11, 2015
Priority date	Aug 11, 2015
Publication date	Mar 5, 2019
Grant date	Mar 5, 2019

Abstract

A method of producing a complex product includes designing a three dimensional preform of the complex product, creating a three dimensional preform of the complex product using the model, depositing a material on the preform, and removing the preform to complete the complex product. In one embodiment the system provides a complex heat sink that can be used in heat dissipation in power electronics, light emitting diodes, and microchips.

First claim

The invention claimed is:

1. A method of producing a micro heatsink, comprising the steps of:
designing a three dimensional preform of the micro heatsink by creating a model preform, wherein the model preform includes
a first heat transfer section, said first heat transfer section including a multiplicity of first micro channels adapted to contain a heat transfer fluid,
a second heat transfer section spaced from said first heat transfer section, said second heat transfer section including a multiplicity of second micro channels adapted to contain said heat transfer fluid; and
a connection section between said first heat transfer section and said second heat transfer section, said connection section including a multiplicity of connecting micro channels adapted to contain said heat transfer fluid;
electronically slicing said model preform into a series of data files each representing a planar cross section of said three dimensional preform;
creating said three dimensional preform of the micro heatsink using stereo micro lithography and said series of data files to produce said three dimensional preform;
depositing copper and diamonds on said created three dimensional preform, wherein said step of depositing copper and diamonds on said created three dimensional preform comprises using electrophoretic deposition for depositing diamonds on said created three dimensional preform and using plating for depositing copper on said created three dimensional preform; and
removing the created three dimensional preform producing the micro heatsink.

2. The method of producing a micro heatsink of claim 1 wherein said step of using electrophoretic deposition for depositing diamonds on said created three dimensional preform comprises
providing a deposition chamber,
providing electrodes in said deposition chamber,
introducing nanoparticle suspensions into said deposition chamber wherein said nanoparticle suspensions include diamond particles, and
using said electrodes for electrophoretic deposition of said diamond particles on said created three dimensional preform.

Assignees

• L Livermore Nat Security Llc

Inventors

• Pascall Andrew J
• Coe Hannah Grace
• Jackson Julie A
• Patra Susant K

Classifications

• C25D15/02

  Combined electrolytic and electrophoretic processes {with charged materials} · CPC title

• C25D13/12 Primary

  characterised by the article coated · CPC title

• F28F3/12

  Elements constructed in the shape of a hollow panel, e.g. with channels {(F28D1/02, F28D1/03 take precedence)} · CPC title

• C25D15/00

  Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires · CPC title

• F28F21/04

  of ceramic; of concrete; of natural stone · CPC title