Method for producing an organic light-emitting diode and organic light-emitting diode

Patent metadata

Field	Value
Publication number	US-10217941-B2
Application number	US-201615549994-A
Country	US
Kind code	B2
Filing date	Feb 5, 2016
Priority date	Feb 9, 2015
Publication date	Feb 26, 2019
Grant date	Feb 26, 2019

Abstract

A method for producing an organic light-emitting diode and an organic light-emitting diode are disclosed. In an embodiment, the method includes providing a substrate with a continuous application surface, generating multiple adhesion regions on the application surface, the adhesion regions being completely surrounded by the application surface, applying metal nanowires over the entire surface of the application surface, removing the metal nanowires outside of the adhesion regions by a washing process using a solvent such that the remaining metal nanowires completely or partly form a light-permeable electrode of the organic light-emitting diode, and applying an organic layer sequence onto the light-permeable electrode.

First claim

The invention claimed is:

1. A method for producing an organic light-emitting diode, the method comprising:
providing a substrate having a continuous application surface;
generating a plurality of adhesion regions on the application surface by a targeted application of an adhesive coating in places such that the adhesive coating is present only in the adhesion regions, wherein the adhesion regions are completely surrounded by the application surface and wherein the adhesive coating is a scattering layer that comprises an organic matrix material and scattering particles embedded therein;
applying metal nanowires over the entire surface of the application surface;
removing the metal nanowires outside of the adhesion regions by washing with a solvent so that remaining metal nanowires completely or partially form a translucent electrode of the organic light-emitting diode; and
applying an organic layer sequence onto the translucent electrode.

2. The method according to claim 1 ;
wherein the method steps are carried out in the indicated order;
wherein the metal nanowires are removed using a single solvent;
wherein the metal nanowires consist of at least 95 wt. % Ag and have an average diameter of no more than 100 nm and an average length of at least 5 m;
wherein the metal nanowires are percolated;
wherein the adhesion regions are generated by a targeted cleaning of the application surface in places;
wherein the cleaning takes place by irradiation with ultraviolet radiation in combination with an ozone treatment or by irradiation with an oxygen plasma; and
wherein the adhesion regions are generated by a targeted application of an adhesive coating in places such that the adhesive coating is present only in the adhesion regions.

3. The method according to claim 1 , wherein the method steps are carried out in the specified order;
wherein the metal nanowires are removed out using a single solvent;
wherein the metal nanowires consist of at least 95 wt. % Ag and have an average diameter of no more than 100 nm and an average length of at least 5 μm; and
wherein the metal nanowires are percolated.

4. The method according to claim 1 , wherein the adhesion regions are generated by a targeted cleaning of the application surface in places.

5. The method according to claim 4 , wherein the cleaning takes place by irradiation with ultraviolet radiation in combination with an ozone treatment.

6. The method according to claim 4 , further comprising, before the cleaning, applying a temporary mask layer that covers the application surface completely apart from the adhesion regions, wherein the mask layer is removed before applying the metal nanowires.

7. The method according to claim 4 , wherein the cleaning comprises irradiation with ultraviolet radiation;
wherein the irradiation takes place only in some areas; and
wherein the application surface is freely accessible during the entire time that the adhesion regions are being generated.

8. The method according to claim 1 , wherein a thickness of the adhesive coating is between 0.5 μm and 100 μm inclusive.

9. The method according to claim 1 , wherein the matrix material comprises a material selected from the group consisting of acrylate, epoxide, polyimide, silicone, SiO 2 , ZnO, ZrO 2 , indium tin oxide, antimony tin oxide, aluminum zinc oxide, indium zinc oxide, TiO 2 , Al 2 O 3 , and gallium oxide Ga 2 O x and combinations thereof.

10. The method according to claim 1 ;
wherein the solvent is deionized water;
wherein the substrate is a glass substrate; and
wherein the metal nanowires are applied by slot die coating.

11. The method according to claim 1 , wherein applying the organic layer sequence comprises applying the organic layer sequence so that the organic layer sequence extends directly to the metal nanowires and forms a matrix for the metal nanowires.

12. An organic light-emitting diode, wherein the organic light-emitting diode is produced according to the method of claim 1 .

13. The organic light-emitting diode according to claim 12 ;
wherein an adhesive coating is disposed directly on the substrate;
wherein the metal nanowires are disposed directly on the adhesive coating and the organic layer sequence forms a matrix for the metal nanowires; and
wherein the organic layer sequence is arranged at a distance from the substrate.

14. The organic light-emitting diode according to claim 12 ;
wherein the metal nanowires are disposed directly on the substrate; and
wherein the organic layer sequence forms a matrix for the metal nanowires and touches the substrate in places.

Assignees

• Osram Oled Gmbh

Inventors

• Scharner Silke
• Wehlus Thomas
• Riegel Nina
• Fleissner Arne
• Rosenberger Johannes
• Riedel Daniel

Classifications

• H01L51/0023 Primary

  Electricity · mapped topic

• H01L51/5206

  Electricity · mapped topic

• H01L51/5268

  Electricity · mapped topic

• H01L51/56

  Electricity · mapped topic

• H10K71/621 Primary

  Providing a shape to conductive layers, e.g. patterning or selective deposition · CPC title