Anisotropic conductive film and display device using the same

Patent metadata

Field	Value
Publication number	US-10217807-B2
Application number	US-201615382077-A
Country	US
Kind code	B2
Filing date	Dec 16, 2016
Priority date	Jun 3, 2016
Publication date	Feb 26, 2019
Grant date	Feb 26, 2019

Abstract

An anisotropic conductive film includes a conductive layer; a first resin insulating layer over a first surface of the conductive layer; and a second resin insulating layer over a second surface of the conductive layer, wherein the conductive layer comprises a plurality of conductive particles and a nano fiber connecting the plurality of conductive particles to each other, each of the plurality of conductive particles comprising a plurality of needle-shaped protrusions having a conical shape, and wherein the first resin insulating layer and the second resin insulating layer comprise a same material and have different thicknesses.

First claim

What is claimed is:

1. A display device comprising:
a substrate;
a display unit over the substrate;
a pad unit over one edge of the substrate and connected to the display unit;
a driving integrated circuit (IC) electrically connected to the pad unit; and
an anisotropic conductive film between the pad unit and the driving IC and electrically connecting the pad unit to the driving IC,
wherein the anisotropic conductive film comprises an adhesive resin insulating portion and a plurality of conductive particles dispersed in the adhesive resin insulating portion, and
wherein each of the plurality of conductive particles comprises a surface having a plurality of needle-shaped protrusions each having a conical shape, wherein some of the plurality of needle-shaped protrusions having the conical shape are stuck to the pad unit,
wherein the pad unit comprises a second layer and a third layer that are sequentially stacked, and
wherein the some of the plurality of needle-shaped protrusions having the conical shape contact the second layer through the third layer.

2. The display device of claim 1 ,
wherein the display unit comprises a thin film transistor comprising an active layer, a gate electrode, a source electrode, and a drain electrode, and
wherein the pad unit comprises a same material as the source electrode and the drain electrode.

3. The display device of claim 2 ,
wherein the pad unit further comprises a first layer, the second layer being stacked on the first layer.

4. The display device of claim 3 , wherein the first layer and the third layer each comprise titanium, and the second layer comprises aluminum.

5. The display device of claim 2 ,
wherein the display unit comprises a display element electrically connected to the thin film transistor, and
wherein the display element comprises a first electrode, a second electrode, and an intermediate layer between the first electrode and the second electrode and comprising an organic emission layer.

6. The display device of claim 1 , further comprising: a thin film encapsulation layer covering and sealing the display unit.

7. The display device of claim 1 ,
wherein each of the plurality of conductive particles comprises a core having elasticity and a base portion including a metal material and covering an outer surface of the core, and
wherein the plurality of needle-shaped protrusions are arranged over the base portion.

8. The display device of claim 7 , wherein the base portion and the plurality of needle-shaped protrusions comprise a same material and are integrally formed.

9. The display device of claim 1 , wherein the plurality of conductive particles are spaced apart from each other.

10. The display device of claim 1 , wherein the plurality of conductive particles are connected to each other by a nano fiber comprising a non-conductive polymer material.

Assignees

• Samsung Display Co Ltd

Inventors

• Lee Chungseok
• Park Donghee
• An Cheolgeun
• Oh Jihoon
• Jang Euiyun
• Hwang Jeongho

Classifications

• H10W99/00

  Subject matter not provided for in other groups of this subclass · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/732

  between stacked chips · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/07338

  hardening the adhesive by curing, e.g. thermosetting · CPC title