Method for manufacturing waveguide structures on wafer-level and corresponding waveguide structures

Patent metadata

Field	Value
Publication number	US-10215909-B2
Application number	US-201815992273-A
Country	US
Kind code	B2
Filing date	May 30, 2018
Priority date	Feb 4, 2015
Publication date	Feb 26, 2019
Grant date	Feb 26, 2019

Abstract

The waveguide structure can be manufactured on wafer-scale and comprises a holding structure and a first and a second waveguides each having a core and two end faces. The holding structure comprises a separation structure being arranged between the first and the second waveguide and provides an optical separation between the first and the second waveguide in a region between the end faces of the first and second waveguides. A method for manufacturing such a waveguide structure with at least one waveguide comprises shaping replication material by means of tool structures to obtain the end faces, hardening the replication material and removing the tool structures from a waveguide structures wafer comprising a plurality of so-obtained waveguides.

First claim

The invention claimed is:

1. A method for manufacturing a plurality of waveguide structures, each of the waveguide structures comprising a holding structure and a first waveguide having a core comprising two end faces, the method comprising
providing a carrier wafer comprising a plurality of carrier structures;

wherein, in a first variant, the method comprises
providing a replication tool comprising at least one first tool structure comprising two end face structures;
repeating a plurality of times the step of shaping replication material present between the carrier wafer and the replication tool by the at least one first tool structure and by one of the plurality of carrier structures, wherein each of the plurality of times,
the replication material is shaped by another one of the plurality of carrier structures and by the at least one first tool structure; and
the replication material present at the end face structures is shaped by the end face structures;

and wherein, in a second variant, the method comprises
providing a replication tool wafer comprising a plurality of first tool structures, each of the first tool structures comprising two end face structures;
bringing together the carrier wafer and the replication tool wafer;
shaping replication material present between the carrier wafer and the replication tool wafer by the carrier structures and by the first tool structures, wherein the replication material present at the end face structures is shaped by the end face structures;

the method further comprising
hardening the shaped replication material to obtain a waveguide structures wafer comprising the plurality of first waveguides, the carrier structures establishing the holding structures, the shaped and hardened replication material establishing the cores of the first waveguides, the hardened replication material present at and shaped by the end face structures establishing the end faces of the cores of the first waveguides;
removing, in the first variant the replication tool, and, in the second variant the replication tool wafer, from the shaped and hardened replication material, the shaped and hardened replication material adhering to the holding structures.

2. The method according to claim 1 , wherein during the shaping of the replication material, the end face structures are present within a channel structure of the carrier wafer established by the carrier structures.

3. The method according to claim 1 , wherein at least one of the two end faces of each of the plurality of first waveguides is non-planar.

4. The method according to claim 1 , wherein at least one of the two end faces of each of the plurality of first waveguides establishes a lens.

5. The method according to claim 1 , wherein the shaping of the replication material comprises inserting the replication material between the carrier wafer and, in the first variant the replication tool, and in the second variant the replication tool wafer by application of a vacuum.

6. The method according to claim 1 , wherein the shaping of the replication material comprises applying the replication material to at least one of
the carrier wafer; and
in the first variant the replication tool, and in the second variant the replication tool wafer.

7. The method according to claim 6 , wherein the method comprises accomplishing the shaping of the replication material by means of embossing.

8. The method according to claim 1 , wherein the holding structures are at least in part made of a non-transparent material.

9. The method according to claim 1 , wherein each of the first waveguides comprises a cladding surrounding the core of the respective waveguide, wherein a portion of the cladding is established by the respective holding structure.

10. The method according to claim 9 wherein, for each of the first waveguides, the cladding comprises, in addition, another cladding portion, which is established by a coating applied to the respective core.

11. The method according to claim 1 , comprising manufacturing the carrier wafer using a replication technique.

12. The method according to claim 1 , wherein the carrier wafer comprises a dimensionally stable base wafer and a first tape layer arranged between the base wafer and the carrier structures which is removable from the base wafer, the method comprising after the step of removing, in the first variant the replication tool, and, in the second variant the replication tool wafer, from the shaped and hardened replication material the steps of
attaching a second tape layer to the carrier structures to sandwich the carrier structures between the first and second tape layers; and
removing the base wafer from the first tape layer; and

subsequent thereto,
removing the first tape layer from the carrier structures.

13. The method according to claim 12 , wherein each of the carrier structures comprises a base structure separating the respective first waveguide from the first tape layer, and wherein the base structures are separate from each other or are contiguous, the method comprising reducing a thickness of the base structures after the removing of the first tape layer from the carrier structures.

14. The method according to claim 13 , each of the plurality of waveguide structures comprising, in addition to the first waveguide, a second waveguide, wherein respective first and second waveguides are arranged on one and the same side of the base wafer, and wherein each of the carrier structures comprises a separating structure laterally separating associated first and second waveguides.

15. The method according to claim 1 , wherein the carrier structures comprise at least two slits extending through the carrier wafer, and wherein at least a portion of each of the plurality of waveguides extends from one of the slits to another.

16. The method according to claim 15 , wherein the shaping of the end face structures is accomplished, at least predominantly, inside the slits.

17. The method according to claim 15 , wherein in the first variant,
the first tool structure comprises at least two protrusions comprising one of the end face structures each, and each of which, during the shaping of the replication material, extends into one of the at least two slits;

in the second variant,
each of the first tool structures comprises at least two protrusions comprising one of the end face structures each, and each of which, during the shaping of the replication material, extends into one of the at least two slits.

18. The method according to claim 15 , each of the plurality of waveguide structures comprising, in addition to the first waveguide, a second waveguide, wherein each of the carrier structures comprises a separating structure vertically separating associated first and second waveguides.

19. The method according to claim 1 , each of the plurality of waveguide structures comprising, in addition to the first waveguide, a second waveguide, the first and the second waveguide running parallel to each other.

20. The method according to claim 1 , wherein, in the first variant the replication tool and, in the second variant the replication tool wafer is, at least in part, made of a resilient material.

Assignees

• Heptagon Micro Optics Pte Ltd

Inventors

• Gubser Simon
• Sobel Frank
• Bietsch Alexander
• Geiger Jens

Classifications

• G02B6/0065 Primary

  Manufacturing aspects; Material aspects · CPC title

• B29D11/00663

  Production of light guides · CPC title