Method of extracting properties of a layer on a wafer
US-2024234216-A9 · Jul 11, 2024 · US
US10215712B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10215712-B2 |
| Application number | US-201414556231-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 30, 2014 |
| Priority date | Sep 2, 2009 |
| Publication date | Feb 26, 2019 |
| Grant date | Feb 26, 2019 |
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Disclosed herein is a system and method for automatic beam shaping (i.e., spot size) and steering (i.e., position) for a spinning wafer inspection system, combined into a single module. Also disclosed is a method and system for measuring the beam position/size/shape and angle with sufficient resolution to make corrections using feedback from the monitor.
Opening claim text (preview).
With this in mind, we claim: 1. A spinning wafer inspection system including an automatic beam steering and shaping mechanism which combines beam shaping and beam steering of said beam in a single beam shaping/steering module, said beam steering and shaping mechanism configured to enable adjustment of position, angle, size, and spot scaling and magnification of said beam; wherein said beam shaping/steering module comprises said beam traversing at least one prism group comprising at least a first prism and a second prism, one of said first and said second prism being rotatable, a second of said first and said second prism being rotatable and translatable, each said prism group affecting both anamorphic magnification and beam direction/shear of said beam in one direction; and said beam steering and shaping mechanism comprising; a partially reflecting mirror and a beam splitter for splitting an incoming laser beam into two channels; two cameras, each positioned on one of the two channels; wherein the two channels are optimized, a first channel for measuring tilt angle and a second channel for measuring shear position. 2. The inspection system of claim 1 , wherein said at least one prism group is a prism pair. 3. The inspection system of claim 1 , wherein said at least one prism group contains more than two prisms. 4. The inspection system of claim 1 , wherein said beam shaping/steering module comprises said beam traversing two prism groups arranged in series, said two prism groups being oriented orthogonally to each other such that said two prism groups affect both anamorphic magnification and beam direction/shear independently in two orthogonal directions. 5. The inspection system of claim 1 , wherein said adjustment of angle comprises adjustment in a desired range between 0.1 urad and 100 urad. 6. The inspection system of claim 1 , wherein said adjustment of magnification comprises magnification in the range of about 0.4 to 2.6. 7. The inspection system of claim 1 , wherein said beam steering and shaping mechanism is configured to enable implementation of a control algorithm that provides feedback about tilt and shear. 8. The inspection system of claim 7 , wherein said control algorithm includes an iterative process that checks after a first adjustment and runs it again if output is not within said desired range. 9. An automatic beam shaping/steering module, said automatic beam shaping/steering module suitable for being used on a spinning wafer inspection system; said automatic beam steering and shaping module configured to enable adjustment of position, angle, size, and spot scaling and magnification of said beam; wherein said beam shaping/steering module comprises said beam traversing at least one prism group comprising at least a first prism and a second prism, one of said first and said second prism being rotatable, a second of said first and said second prism being rotatable and translatable, each said prism group affecting both anamorphic magnification and beam direction/shear of said beam in one direction; and said beam steering and shaping mechanism comprising; a partially reflecting mirror and a beam splitter for splitting an incoming laser beam into two channels; two cameras, each positioned on one of the two channels; wherein the two channels are optimized, a first channel for measuring tilt angle and a second channel for measuring shear position.
Specially adapted optical and illumination features · CPC title
Directed, collimated illumination · CPC title
Prisms (prisms per se G02B5/04) · CPC title
Semiconductor wafers (manufacturing processes per se of semiconductor devices implementing a measuring step H10P74/20) · CPC title
Coherent sources; lasers · CPC title
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