Method and apparatus for producing and measuring dynamically focused, steered, and shaped oblique laser illumination for spinning wafer inspection system

US10215712B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10215712-B2
Application numberUS-201414556231-A
CountryUS
Kind codeB2
Filing dateNov 30, 2014
Priority dateSep 2, 2009
Publication dateFeb 26, 2019
Grant dateFeb 26, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Disclosed herein is a system and method for automatic beam shaping (i.e., spot size) and steering (i.e., position) for a spinning wafer inspection system, combined into a single module. Also disclosed is a method and system for measuring the beam position/size/shape and angle with sufficient resolution to make corrections using feedback from the monitor.

First claim

Opening claim text (preview).

With this in mind, we claim: 1. A spinning wafer inspection system including an automatic beam steering and shaping mechanism which combines beam shaping and beam steering of said beam in a single beam shaping/steering module, said beam steering and shaping mechanism configured to enable adjustment of position, angle, size, and spot scaling and magnification of said beam; wherein said beam shaping/steering module comprises said beam traversing at least one prism group comprising at least a first prism and a second prism, one of said first and said second prism being rotatable, a second of said first and said second prism being rotatable and translatable, each said prism group affecting both anamorphic magnification and beam direction/shear of said beam in one direction; and said beam steering and shaping mechanism comprising; a partially reflecting mirror and a beam splitter for splitting an incoming laser beam into two channels; two cameras, each positioned on one of the two channels; wherein the two channels are optimized, a first channel for measuring tilt angle and a second channel for measuring shear position. 2. The inspection system of claim 1 , wherein said at least one prism group is a prism pair. 3. The inspection system of claim 1 , wherein said at least one prism group contains more than two prisms. 4. The inspection system of claim 1 , wherein said beam shaping/steering module comprises said beam traversing two prism groups arranged in series, said two prism groups being oriented orthogonally to each other such that said two prism groups affect both anamorphic magnification and beam direction/shear independently in two orthogonal directions. 5. The inspection system of claim 1 , wherein said adjustment of angle comprises adjustment in a desired range between 0.1 urad and 100 urad. 6. The inspection system of claim 1 , wherein said adjustment of magnification comprises magnification in the range of about 0.4 to 2.6. 7. The inspection system of claim 1 , wherein said beam steering and shaping mechanism is configured to enable implementation of a control algorithm that provides feedback about tilt and shear. 8. The inspection system of claim 7 , wherein said control algorithm includes an iterative process that checks after a first adjustment and runs it again if output is not within said desired range. 9. An automatic beam shaping/steering module, said automatic beam shaping/steering module suitable for being used on a spinning wafer inspection system; said automatic beam steering and shaping module configured to enable adjustment of position, angle, size, and spot scaling and magnification of said beam; wherein said beam shaping/steering module comprises said beam traversing at least one prism group comprising at least a first prism and a second prism, one of said first and said second prism being rotatable, a second of said first and said second prism being rotatable and translatable, each said prism group affecting both anamorphic magnification and beam direction/shear of said beam in one direction; and said beam steering and shaping mechanism comprising; a partially reflecting mirror and a beam splitter for splitting an incoming laser beam into two channels; two cameras, each positioned on one of the two channels; wherein the two channels are optimized, a first channel for measuring tilt angle and a second channel for measuring shear position.

Assignees

Inventors

Classifications

  • Specially adapted optical and illumination features · CPC title

  • Directed, collimated illumination · CPC title

  • Prisms (prisms per se G02B5/04) · CPC title

  • Semiconductor wafers (manufacturing processes per se of semiconductor devices implementing a measuring step H10P74/20) · CPC title

  • Coherent sources; lasers · CPC title

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Frequently asked questions

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What does patent US10215712B2 cover?
Disclosed herein is a system and method for automatic beam shaping (i.e., spot size) and steering (i.e., position) for a spinning wafer inspection system, combined into a single module. Also disclosed is a method and system for measuring the beam position/size/shape and angle with sufficient resolution to make corrections using feedback from the monitor.
Who is the assignee on this patent?
Wolters Christian, Whiteside Bret, Romanovsky Anatoly, and 1 more
What technology area does this patent fall under?
Primary CPC classification G01N21/9501. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Feb 26 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).