Microsystem enabled photovoltaic modules and systems
US-9029681-B1 · May 12, 2015 · US
US10215447B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10215447-B2 |
| Application number | US-201615142802-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 29, 2016 |
| Priority date | Apr 29, 2015 |
| Publication date | Feb 26, 2019 |
| Grant date | Feb 26, 2019 |
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A solar thermal absorber including a spectrally selective filter comprising a stack of dielectric layers and one or more semiconductor absorber layers. The dielectric layers are transparent to infrared radiation and have a refractive index contrast, and the semiconductor absorber layers have a band gap, such that the semiconductor absorber layers absorb at least a portion of the solar spectrum and the stack reflects infrared radiation.
Opening claim text (preview).
What is claimed is: 1. A solar thermal absorber, comprising: a stack of dielectric layers and one or more semiconductor absorber layers on a metal reflector, wherein: the dielectric layers are transparent to infrared radiation and have a refractive index contrast, and the semiconductor absorber layers comprise amorphous silicon or amorphous germanium and have a band gap, such that the semiconductor absorber layers absorb visible light and the stack reflects infrared radiation so as to suppress emission of black-body radiation. 2. The absorber of claim 1 , wherein the layers are sputtered on the metal reflector. 3. The absorber of claim 2 , wherein the metal reflector comprises Ag sandwiched between Cr layers. 4. The absorber of claim 1 , wherein the dielectric layers comprise one or more ZnS layers and one or more CaF 2 layers. 5. The absorber of claim 1 , wherein: the dielectric layers comprise a ZnS layer, a first CaF 2 layer, a second CaF 2 layer, a third CaF 2 layer, and a fourth CaF 2 layer; the semiconductor absorber layers comprise a first semiconductor absorber layer, a second semiconductor absorber layer, and a third semiconductor absorber layer; the first semiconductor absorber layer is on the metal reflector; the first CaF 2 layer is on the first semiconductor absorber layer; the second semiconductor absorber layer is on the first CaF 2 layer; the second CaF 2 layer is on the second semiconductor absorber layer; the third semiconductor absorber layer is on the second CaF 2 layer; the third CaF 2 layer is on the third semiconductor absorber layer; the ZnS layer is on the third CaF 2 layer; and the fourth CaF 2 layer is on the ZnS layer. 6. The absorber of claim 5 , wherein: the first semiconductor absorber layer has a thickness of 20-80 nm, the second semiconductor absorber layer has a thickness of 20-100 nm, the third semiconductor absorber layer has a thickness of 1-70 nm, the first CaF 2 layer has a thickness of 50-300 nm, the second and third CaF 2 layers each have thicknesses between 10-70 nm, the fourth CaF 2 layer has a thickness of 50-100 nm, and the ZnS layer has a thickness of 1-50 nm. 7. The absorber of claim 5 , wherein the metal reflector is a silver reflector sandwiched between Cr layers. 8. The absorber of claim 1 , wherein: the dielectric layers comprise a first CaF 2 layer, a second CaF 2 layer, a third CaF 2 layer, a fourth CaF 2 layer, a fifth CaF 2 layer, and a ZnS layer; the semiconductor absorber layers are amorphous germanium layers comprising a first semiconductor absorber layer, a second semiconductor absorber layer, a third semiconductor absorber layer, and a fourth semiconductor absorber layer; the first semiconductor absorber layer is on or above metal layers comprising a silver layer sandwiched between chromium layers; the first CaF 2 layer is on the first semiconductor absorber layer; the second semiconductor absorber layer is on the first CaF 2 layer; the second CaF 2 layer is on the second semiconductor absorber layer; the third semiconductor absorber layer is on the second CaF 2 layer; the third CaF 2 layer is on the third semiconductor absorber layer; the fourth semiconductor absorber layer is on the third CaF 2 layer; the fourth CaF 2 layer is on the fourth semiconductor absorber layer; the ZnS layer is on the fourth CaF 2 layer; and the fifth CaF 2 layer is on the ZnS layer. 9. A thermal absorber, comprising: a spectrally selective filter comprising a stack of dielectric layers transparent to infrared radiation and one or more semiconductor absorber layers, wherein: the filter receives electromagnetic radiation, the electromagnetic radiation comprising in-band electromagnetic radiation having wavelengths less than a critical wavelength and out-of-band electromagnetic radiation having wavelengths at or longer than the critical wavelength, the critical wavelength defined such that black body radiation, having wavelengths at or longer than the critical wavelength, is emitted from the semiconductor absorber layers with an intensity that exceeds an intensity of the out-of-band electromagnetic radiation absorbed by the semiconductor absorber layers; and the dielectric layers and the semiconductor absorber layers have a refractive index contrast, the semiconductor absorber layers have a band gap, and the dielectric layers have a transparency such that: absorptance of the stack decreases by at least 80% as wavelength of the electromagnetic radiation increases over a wavelength range of 500 nanometers centered on a boundary between an absorptance pass band and an absorptance stop band of the filter, reflectance of the stack increases by at least 80% as wavelength of the electromagnetic radiation increases over a wavelength range of 100 nanometers centered on a boundary between a reflectance pass band and an reflectance stop band of the filter, and the boundaries are no more than 500 nm less than the critical wavelength, thereby suppressing emission of the black-body radiation and allowing the semiconductor absorber layers to generate thermal energy by increasing in temperature in response to absorbing the in-band electromagnetic radiation. 10. The absorber of claim 9 , wherein the in-band electromagnetic radiation comprises wavelengths of the solar spectrum and the out-of-band electromagnetic radiation includes infrared wavelengths. 11. The absorber of claim 9 , wherein the critical wavelength is at least 1.6 micrometers. 12. The absorber of claim 9 , wherein the stack comprises layers alternating between one of the dielectric layers and one of the semiconductor absorbing layers. 13. The absorber of claim 9 , wherein the dielectric layers comprise one or more ZnS layers and one or more CaF 2 layers. 14. The absorber of claim 9 , wherein the dielectric layers comprise one or more first dielectric layers comprising a first dielectric material and one or more second dielectric layers comprising a second dielectric material, the absorber further comprising: a first region including one of the first dielectric layers between two of the second dielectric layers, and a second region including layers alternating between one of the second dielectric layers and one of the semiconductor absorbing layers, a metal reflector positioned such that the second region is between the first region and the metal reflector, and wherein the electromagnetic radiation is incident on the first region. 15. The absorber of claim 14 , wherein: the first dielectric layer comprises at least one dielectric selected from ZnS and ZnSe, the second dielectric layer comprises at least one dielectric selected from CaF 2 and KBr, and the semiconductor absorber layer comprises at least one semiconductor selected from amorphous silicon, amorphous germanium, and GaSb. 16. The absorber of claim 14 , wherein: the semiconductor absorber layer closest to the metal reflector and the semiconductor absorber layer closest to the first region are both thinner than the remaining semiconductor absorber layers, and the dielectric layer closest to the metal reflector, and the dielectric layer closest to a top surface of the first region on which the electromagnetic radiation is incident, are both thicker than the remaining dielectric layers. 17. The absorber of claim 9 , wherein the filter is a Fabry-Perot filter or a photonic bandgap filter. 18. A method of fabricating a thermal absorber, comprising: depositing a spectrally selective filter, including depositing a s
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