Systems and methods for a smart module directly embedded on a lighting fixture

Patent metadata

Field	Value
Publication number	US-10215389-B2
Application number	US-201715859409-A
Country	US
Kind code	B2
Filing date	Dec 30, 2017
Priority date	Jun 7, 2017
Publication date	Feb 26, 2019
Grant date	Feb 26, 2019

Abstract

Examples of the present disclosure are related to systems and methods for lighting fixtures. More particularly, embodiments disclose directly embedded a smart module with a lighting fixture utilizing metal core PCB (MCPCB).

First claim

What is claimed is:

1. A light fixture comprising:
a substrate formed of metal core PCB;
a first grouping of light sources embedded on the substrate;
a second grouping of light sources embedded on the substrate, wherein there is a space between the first grouping of light sources and the second grouping of light sources;
a smart module including at least one sensor being embedded on the substrate within the space, wherein traces associated with the smart module are directly embedded on the substrate, the traces being configured to electrically couple the first grouping of light sources, the second grouping of light sources, and electronic components associated with the smart module.

2. The light fixture of claim 1 , further comprising:
a heat sink attached to the substrate, wherein the heat sink is formed of a folded fin or extrusions.

3. The light fixture of claim 1 , wherein the smart module includes a camera, wherein the camera is configured to capture images of an area of interest positioned directly under the substrate.

4. The light fixture of claim 1 , wherein the substrate is coupled with a heat sink.

5. The light fixture of claim 1 , wherein the smart modules includes at least one antenna configured to transmit data associated with the at least one sensor.

6. The light fixture of claim 1 , wherein the at least one antenna is embedded within the substrate.

7. A light fixture comprising:
a substrate formed of metal core PCB;
a first grouping of light sources embedded on the substrate;
a second grouping of light sources embedded on the substrate, wherein there is a space between the first grouping of light sources and the second grouping of light sources;
a smart module including at least one sensor being embedded on the substrate within the space, wherein the smart module includes a housing configured to cover the smart module, wherein the substrate includes a first bend, a second bend, and a planer surface extending between a proximal end of the first bend and a proximal end of the second bend, and the housing extends from a distal end of the first bend to a distal end of the second bend.

8. The light fixture of claim 7 , wherein the housing is comprised of plastic or metal.

9. A method of forming a light fixture comprising:
embedding a first grouping of light sources on a substrate formed of metal core PCB;
embedding a second grouping of light sources the substrate, wherein there is a space between the first grouping of light sources and the second grouping of light sources;
embedding a smart module including at least one sensor on the substrate within the space;
electrically coupling the smart module with the first grouping of light sources and the second grouping of light sources via traces that are directly embedded on the substrate.

10. The method of claim 9 , wherein the smart module includes a housing configured to cover the smart module.

11. The method of claim 10 , wherein the substrate includes a first bend, a second bend, and a planer surface extending between a proximal end of the first bend and a proximal end of the second bend, and the housing extends from a distal end of the first bend to a distal end of the second bend.

12. The method of claim 10 , wherein the housing is comprised of plastic or metal.

13. The method of claim 9 , further comprising:
attaching a heat sink to the substrate, wherein the heat sink is formed of a folded fin or extrusions.

14. The method of claim 9 , wherein the smart module includes a camera, wherein the camera is configured to capture images of an area of interest positioned directly under the substrate.

15. The method of claim 9 , wherein the substrate is coupled with a heat sink.

16. The method of claim 9 , wherein the smart modules includes at least one antenna configured to transmit data associated with the at least one sensor.

17. The method of claim 9 , wherein the at least one antenna is embedded within the substrate.

Assignees

• Fluence Bioengineering
• Fluence Bioengineering Inc

Inventors

• Duong Dung
• Johnson Randy
• Klase Nick

Classifications

• A01G9/249

  Lighting means (with special arrangements for promoting growth A01G7/045) · CPC title

• H05B47/105

  in response to determined parameters · CPC title

• H05B45/10

  Controlling the intensity of the light · CPC title

• F21V23/0442

  activated by means of a sensor, e.g. motion or photodetectors · CPC title

• H05K1/0209

  External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings · CPC title