Fracture-Resistant Layered-Substrates and Articles Including the Same
US-2015079398-A1 · Mar 19, 2015 · US
US10214445B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10214445-B2 |
| Application number | US-201515128004-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 17, 2015 |
| Priority date | Mar 21, 2014 |
| Publication date | Feb 26, 2019 |
| Grant date | Feb 26, 2019 |
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Embodiments of an article including a substrate and a patterned coating are provided. In one or more embodiments, when a strain is applied to the article, the article exhibits a failure strain of 0.5% or greater. Patterned coating may include a particulate coating or may include a discontinuous coating. The patterned coating of some embodiments may cover about 20% to about 75% of the surface area of the substrate. Methods for forming such articles are also provided.
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What is claimed is: 1. An article comprising: a substrate including a surface; a patterned coating disposed on the surface forming a coated surface, wherein, when a strain is applied to the article, the article exhibits a failure strain of 0.5% or greater, wherein the patterned coating comprises a bimodal distribution of coating thickness, the bimodal distribution comprising a lower-mode thickness in the range from 10 nm to 90 nm, and a higher-mode thickness in the range from about 50 to about 5000 nm, and wherein the substrate surface has a surface area and the patterned coating covers at least about 20% of the surface area. 2. The article of claim 1 , wherein, when a strain is applied to the article, the patterned coating has a first region and a second region, and wherein the first region comprises a first tensile stress and the second region comprises a second tensile stress greater than the first tensile stress. 3. The article of claim 1 , wherein, when a strain is applied to the article, the substrate comprises a maximum substrate tensile stress and the patterned coating has at least one local region comprising a local tensile stress that is less than the maximum substrate tensile stress. 4. The article of claim 1 , wherein, when a strain is applied to the article, the substrate comprises a maximum substrate tensile strain and the patterned coating has at least one local region comprising a local tensile strain that is less than the maximum substrate tensile strain. 5. The article of claim 1 , wherein the patterned coating comprises a bimodal distribution of coating thickness, the bimodal distribution comprising a lower-mode thickness comprising a full-width-at half-maximum (FWHM) of about 1 nm or less and a higher-mode thickness comprising a FWHM greater than the FWHM of the lower-mode thickness. 6. The article of claim 5 , wherein the FWHM of the higher-mode thickness is less than the difference in the surface topographical heights of the lower-mode thickness and the higher-mode thickness. 7. The article of claim 6 , wherein the patterned coating comprises a plurality of peaks and a plurality of valleys between the peaks. 8. The article of claim 7 , wherein the patterned coating at the plurality of valleys comprises a coating thickness of at least about 5 nm. 9. The article of claim 1 , wherein the substrate exhibits an average strain-to-failure that is greater than an amount selected from 0.7%, 1.0%, 1.5%, 2%, 2.5% and 3%. 10. The article of claim 1 , wherein the patterned coating comprises a hardness of 8 GPa or greater, as measured by a Berkovich Indenter Hardness Test along indentation depths of about 100 nm or greater. 11. A consumer electronic device comprising: a substrate including a surface; a patterned coating disposed on the surface, wherein, when a strain is applied to the article, the crack onset strain of the patterned coating is greater than 0.5%, wherein the patterned coating comprises a bimodal distribution of coating thickness, the bimodal distribution comprising a lower-mode thickness comprising a full-width-at half-maximum (FWHM) of about 1 nm or greater, and a higher-mode thickness comprising a FWHM greater than the FWHM of the lower-mode thickness, and wherein the substrate surface has a surface area and the patterned coating covers at least about 20% of the surface area. 12. The consumer electronic device of claim 11 , wherein the patterned coating comprises a hardness of 8 GPa or greater, as measured by a Berkovich Indenter Hardness Test along indentation depths of about 100 nm or greater. 13. The consumer electronic device of claim 11 , wherein the FWHM of the higher-mode thickness is at most two times the difference in the surface topographical heights of the lower-mode thickness and the higher-mode thickness. 14. The consumer electronic device of claim 11 , wherein the patterned coating comprises a plurality of peaks and a plurality of valleys between the peaks. 15. The consumer electronic device of claim 11 , wherein the patterned coating comprises a bimodal distribution of coating thickness, the bimodal distribution comprising a lower-mode thickness in the range from about 0 to about 100 nm, and a higher-mode thickness in the range from about 200 to about 5000 nm.
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