Method for manufacturing cooler for semiconductor-module, cooler for semiconductor-module, semiconductor-module and electrically-driven vehicle

Patent metadata

Field	Value
Publication number	US-10214109-B2
Application number	US-201414895789-A
Country	US
Kind code	B2
Filing date	Nov 17, 2014
Priority date	Nov 28, 2013
Publication date	Feb 26, 2019
Grant date	Feb 26, 2019

Abstract

A cooler for a semiconductor-module includes: a heat sink which has an appearance of a cuboid structure to one side of which a flow rate control plate is fixed; a thermal radiation plate on an outer surface of which semiconductor devices are bonded; and a tray-shaped cooling jacket having: a coolant introduction channel; a coolant extraction channel extending in parallel to the coolant introduction channel; and a cooling channel provided between the coolant introduction and extraction channels. The heat sink is provided in the cooling channel of the cooling jacket so that the flow rate control plate extends in a boundary between the coolant extraction channel and the cooling channel, and channels provided for the heat sink extend orthogonally to the coolant introduction and extraction channels. The thermal radiation plate is fixed so as to close an opening the cooling jacket.

First claim

The invention claimed is:

1. A method for manufacturing a cooler for a semiconductor module, the cooler including: a heat sink having an appearance of a cuboid structure; a heat radiation plate to which a semiconductor device is bonded; and a tray-shaped cooling jacket including: a coolant introduction channel to introduce a coolant through a coolant inlet portion; a coolant extraction channel to extract the coolant to a coolant outlet portion, the coolant extraction channel extending in parallel to the coolant introduction channel; and a cooling channel between the coolant introduction and extraction channels, the method comprising:
fixing a flow rate control plate to one side of the heat sink;
arranging the heat sink in the cooling channel of the cooling jacket so that the flow rate control plate extends longitudinally along a boundary between the coolant extraction channel and the cooling channel in a direction parallel to the coolant extraction channel, and so that the flow rate control plate extends across a plurality of channels provided for the heat sink which extend orthogonally to the coolant introduction and extraction channels; and
bonding the heat radiation plate so as to close an opening of the cooling jacket.

2. A method for manufacturing a cooler for a semiconductor module, the cooler including: a heat sink having an appearance of a cuboid structure; a heat radiation plate to which a semiconductor device is bonded; and a tray-shaped cooling jacket including: a coolant introduction channel to introduce a coolant through a coolant inlet portion; a coolant extraction channel to extract the coolant to a coolant outlet portion, the coolant extraction channel extending in parallel to the coolant introduction channel; and a cooling channel between the coolant introduction and extraction channels, the method comprising:
fixing a flow rate control plate to one side of the heat sink;
arranging the heat sink in the cooling channel of the cooling jacket so that the flow rate control plate extends in a boundary between the coolant extraction channel and the cooling channel, and a plurality of channels provided for the heat sink extend orthogonally to the coolant introduction and extraction channels; and
bonding the heat radiation plate so as to close an opening of the cooling jacket, wherein the flow rate control plate includes:
a flow rate decreasing section standing from a lower edge of the heat sink to a first height below an upper edge of the heat sink; and
a flow rate increasing section having a second height from the lower edge of the heat sink which is lower than that of the flow rate decreasing section.

3. The method of claim 1 , wherein one end of the flow rate control plate is fixed to the heat sink at a location next to the coolant outlet portion.

4. The method of claim 1 , wherein the flow rate control plate has a shape that increases a flow rate of the coolant flowing through the plurality of channels of the heat sink below a part of the heat radiation plate to which the semiconductor device is bonded.

5. The method of claim 1 , wherein
the heat sink includes a plurality of fins arranged at predetermined intervals in a thickness direction of the fins,
each of the plurality of channels provided for the heat sink is provided between adjacent fins among the plurality of fins, and
the flow rate control plate is fixed to the plurality of fins arranged at the predetermined intervals.

6. A cooler for a semiconductor module, comprising:
a heat sink having an appearance of a cuboid structure to one side of which a flow rate control plate is fixed;
a heat radiation plate, to which a semiconductor device is bonded; and
a tray-shaped cooling jacket including:
a coolant introduction channel to introduce a coolant through a coolant inlet portion,
a coolant extraction channel to extract the coolant to a coolant outlet portion, the coolant extraction channel extending in a direction parallel to the coolant introduction channel, and
a cooling channel provided between the coolant introduction and extraction channels,

wherein
the heat sink is arranged in the cooling channel of the cooling jacket so that the flow rate control plate extends longitudinally along a boundary between the coolant extraction channel and the cooling channel in the direction parallel to the coolant introduction channel,
a plurality of channels provided for the heat sink extend orthogonally to the coolant introduction channel and the coolant extraction channel and the flow rate control plate extends across the plurality of channels,
the heat radiation plate is fixed so as to close an opening of the cooling jacket,
an upper surface of the heat sink faces and is contact with an inner surface of the heat radiation plate, and
a lower surface of the heat sink faces and is in contact with an inner surface of the cooling jacket.

7. A cooler for a semiconductor module, comprising:
a heat sink having an appearance of a cuboid structure to one side of which a flow rate control plate is fixed;
a heat radiation plate, to which a semiconductor device is bonded; and
a tray-shaped cooling jacket including:
a coolant introduction channel to introduce a coolant through a coolant inlet portion,
a coolant extraction channel to extract the coolant to a coolant outlet portion, the coolant extraction channel extending in a direction parallel to the coolant introduction channel, and
a cooling channel provided between the coolant introduction and extraction channels,

wherein
the heat sink is arranged in the cooling channel of the cooling jacket so that the flow rate control plate extends in a boundary between the coolant extraction channel and the cooling channel,
a plurality of channels provided for the heat sink extend orthogonally to the coolant introduction channel and the coolant extraction channel,
the heat radiation plate is fixed so as to close an opening of the cooling jacket,
an upper surface of the heat sink faces and is contact with an inner surface of the heat radiation plate,
a lower surface of the heat sink faces and is in contact with an inner surface of the cooling jacket, and
the flow rate control plate includes:
a flow rate decreasing section standing from a lower edge of the heat sink to a first height below an upper edge of the heat sink, and
a flow rate increasing section having a second height from the lower edge of the heat sink which is lower than that of the flow rate decreasing section.

8. The cooler of claim 6 , wherein one end of the flow rate control plate is fixed to the heat sink at a location next to the coolant outlet portion.

9. The cooler of claim 6 , wherein the flow rate control plate has a shape that increases a flow rate of the coolant flowing through the plurality of channels of the heat sink below a part of the heat radiation plate to which the semiconductor device is bonded.

10. The cooler of claim 6 , wherein
the heat sink includes a plurality of fins arranged at predetermined intervals in a thickness direction of the fins,
each of the plurality of channels provided for the heat sink is provided between adjacent fins among the plurality of fins, and
the flow rate control plate is fixed to the plurality of fins arranged at the predetermined intervals.

11. A semiconductor module, comprising:
a cooler externally supplied with a coolant, configured to cool a semiconductor device provided on an outer side of the cooler, the cooler including:
a heat sink having an appearance of a cuboid structure to one side of which a flow rate control plate is fixed,
a heat radiation plate, to which a semiconductor device is bonded, and
a tray-shaped cooling jacket incl

Assignees

• Fuji Electric Co Ltd

Inventors

• Gohara Hiromichi
• Arai Nobuhide

Classifications

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W72/352

  comprising metals or metalloids, e.g. solders · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title