Flexible substrate with integrated circuit

Patent metadata

Field	Value
Publication number	US-10214019-B2
Application number	US-201514863902-A
Country	US
Kind code	B2
Filing date	Sep 24, 2015
Priority date	Apr 30, 2012
Publication date	Feb 26, 2019
Grant date	Feb 26, 2019

Abstract

Example circuits and methods are described involving a flexible substrate for a fluid cartridge, comprising an integrated circuit connected to the flexible substrate, and electrical connector pads arranged on the flexible substrate for connection to the integrated circuit.

First claim

What is claimed is:

1. A flexible circuit for a fluid cartridge, comprising:
a single flexible substrate;
an integrated circuit attached to the single flexible substrate; and
multiple electrical connector pads on the single flexible substrate for connection to a host device, comprising first electrical connector pads connected to the integrated circuit and second electrical connector pads, not connected to the integrated circuit, for connection to a fluid dispensing die.

2. The flexible circuit of claim 1 wherein the integrated circuit includes a microcontroller.

3. The flexible circuit of claim 1 wherein at least a portion of the first and the second electrical connector pads are arranged on one straight line.

4. The flexible circuit of claim 1 wherein:
the integrated circuit is arranged between the multiple electrical connector pads and a side edge of the single flexible substrate; and
an axis of symmetry of the multiple electrical connector pads is arranged parallel to and at a distance from a longitudinal center line of the flexible substrate.

5. The flexible circuit of claim 1 comprising the fluid dispensing die wherein the electrical connector pad array comprises at least one electrical connector pad that is connected to both the integrated circuit and the fluid dispensing die.

6. The flexible circuit of claim 1 comprising at least four first electrical connector pads.

7. The flexible circuit of claim 1 comprising:
bond pads for connecting the integrated circuit to a conductor line connected to the electrical connector pads; and
an encapsulation layer covering the integrated circuit and the bond pads.

8. The flexible circuit of claim 1 comprising the fluid dispensing die wherein:
the single flexible substrate comprises at least one first window and at least one second window;
the first integrated circuit is connected to the flexible substrate near edges of the first window; and
the fluid dispensing die is connected to the flexible substrate near edges of the second window.

9. A fluid dispensing cartridge, comprising:
a flexible substrate,
an integrated circuit connected to the flexible substrate;
a fluid dispensing die connected to the flexible substrate; and
a constant electrical connector pad array arranged on the same flexible substrate, for connection to a host device, comprising first electrical connector pads connected to the integrated circuit and second electrical connector pads connected to actuators of the fluid dispensing die and not connected to the integrated circuit.

10. A device, comprising:
a flexible substrate including conductor lines;
multiple electrical connector pads on the substrate to connect to a host device, each connector pad connected to a conductor line;
an integrated circuit on the substrate connected to a first one of the connector pads by a first one of the conductor lines; and
an ink dispensing die connected to a second one of the connector pads independent of the integrated circuit by a second one of the conductor lines.

11. The device of claim 10 wherein:
the integrated circuit is connected to multiple first ones of the connector pads by respective first ones of the conductor lines; and
the ink dispensing die is connected to multiple second ones of the connector pads by respective second ones of the conductor lines that are not connected to the integrated circuit.

12. The device of claim 10 wherein the integrated circuit includes a memory and a processing unit.

13. The device of claim 10 comprising a housing defining a reservoir to hold ink, the ink dispensing die attached to the housing in fluid communication with the reservoir.

14. The device of claim 10 wherein:
the integrated circuit is connected to a third one of the connector pads by a third one of the conductor lines; and
the ink dispensing die is connected to the third connector pad through a fourth one of the conductor lines that is not connected to the integrated circuit.

15. The device of claim 14 wherein the third connector pad is to function as a ground for the integrated circuit and the ink dispensing die when connected to a host device.

16. The device of claim 14 wherein the third connector pad is to function as a power supply for the integrated circuit and the ink dispensing die when connected to a host device.

Assignees

• Hewlett Packard Development Co

Inventors

• Campbell-Brown Iain
• Walsh Mark
• Oliver John
• Ward Jefferson P
• Shipman Amy

Classifications

• H10W72/0198

  batch processes · CPC title

• H01L2224/97

  Electricity · mapped topic

• B41J2/17513

  Inner structure · CPC title

• B41J2/17546

  electronically · CPC title

• B41J2/17553

  Outer structure · CPC title