Method of placing window in thin polishing pad

US10213894B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10213894-B2
Application numberUS-201615054849-A
CountryUS
Kind codeB2
Filing dateFeb 26, 2016
Priority dateFeb 26, 2016
Publication dateFeb 26, 2019
Grant dateFeb 26, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A polishing pad includes a polishing layer stack that has a polishing surface, a bottom surface, and an aperture from the polishing surface to the bottom surface. The polishing layer stack includes a polishing layer that has the polishing surface. A fluid-impermeable layer spans the aperture and the polishing pad. A first adhesive layer of a first adhesive material is in contact with and secures the bottom surface of the polishing layer to the fluid-impermeable layer. The first adhesive layer spans the aperture and the polishing pad. The light-transmitting body is positioned in the aperture and has a lower surface in contact with, is secured to the first adhesive layer, and is spaced apart from a side-wall of the aperture by a gap. An adhesive sealant of a different second material is disposed in and laterally fills the gap.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of making a polishing pad, comprising: forming an aperture through a polishing layer stack from a polishing surface to a bottom surface of the polishing layer stack to expose a first adhesive layer that is positioned on and contacts the bottom surface of the polishing layer stack and spans the aperture and the polishing pad, the polishing layer stack including a polishing layer having the polishing surface, wherein the first adhesive layer secures the bottom surface of the polishing layer stack to a fluid-impermeable layer that layer spans the aperture and the polishing pad, wherein forming the aperture comprises peeling a disposable cover away from the first adhesive layer while leaving a majority of the first adhesive layer in the aperture on the fluid-impermeable layer, wherein the disposable cover is a different material than the polishing layer; positioning a pre-formed light-transmitting body in the aperture in the polishing layer stack such that a lower surface of the light-transmitting body contacts and adheres to the first adhesive layer; dispensing an adhesive sealant into a gap that separates the light-transmitting body from side-walls of the aperture to laterally fill the gap; and curing the adhesive sealant.

Assignees

Inventors

Classifications

  • B24B37/205Primary

    provided with a window for inspecting the surface of the work being lapped · CPC title

  • characterised by a multi-layered structure · CPC title

  • characterised by the composition or properties of the pad materials · CPC title

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Frequently asked questions

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What does patent US10213894B2 cover?
A polishing pad includes a polishing layer stack that has a polishing surface, a bottom surface, and an aperture from the polishing surface to the bottom surface. The polishing layer stack includes a polishing layer that has the polishing surface. A fluid-impermeable layer spans the aperture and the polishing pad. A first adhesive layer of a first adhesive material is in contact with and secure…
Who is the assignee on this patent?
Applied Materials Inc
What technology area does this patent fall under?
Primary CPC classification B24B37/205. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Feb 26 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).