Polycrystalline diamond compacts having parting compound and methods of making the same

Patent metadata

Field	Value
Publication number	US-10213835-B2
Application number	US-201715417639-A
Country	US
Kind code	B2
Filing date	Jan 27, 2017
Priority date	Feb 10, 2016
Publication date	Feb 26, 2019
Grant date	Feb 26, 2019

Abstract

Polycrystalline diamond compacts having parting compound within the interstitial volumes are disclosed herein. In one embodiment, a polycrystalline diamond compact includes a polycrystalline diamond body having a plurality of diamond grains bonded together in diamond-to-diamond bonds, interstitial volumes positioned between the adjacent diamond grains, and a parting compound positioned in at least a portion of the interstitial volumes of the polycrystalline diamond body.

First claim

The invention claimed is:

1. A method of making a polycrystalline diamond compact, comprising:
subjecting a polycrystalline diamond body to a leaching operation in which catalytic material positioned in the interstitial volumes between diamond grains sintered in diamond-to-diamond bonds is removed;
applying a parting compound to external surfaces of the polycrystalline diamond body and allowing the parting compound to enter the interstitial volumes between the diamond grains, wherein the parting compound is removed from the external surfaces of the polycrystalline diamond body in an abrasive blasting operation; and
removing the parting compound from the external surfaces of the polycrystalline diamond body.

2. The method of claim 1 , wherein the parting compound comprises yttria oxide, aluminum oxide, titanium oxide, magnesium oxide, boron nitride, silicon carbide, titanium silicide, or combinations thereof.

3. The method of claim 1 , wherein the parting compound comprises a water-based parting compound, a solvent-based parting compound, or combinations thereof.

4. The method of claim 1 , wherein:
the polycrystalline diamond body comprises a working surface, an attachment surface positioned distally from the working surface, a perimeter, and a thickness that measures from the working surface to an attachment surface, and
the parting compound is applied to the polycrystalline body along the working surface.

5. The method of claim 4 , wherein the parting compound is further applied to the polycrystalline body along at least a portion of the perimeter and any surface bridging the perimeter and the working surface.

Assignees

• Diamond Innovations Inc

Inventors

• Gledhill Andrew

Classifications

• B22F3/26

  Impregnating {(making ferrous alloys by impregnation C22C33/0242)} · CPC title

• C04B2235/85

  Intergranular or grain boundary phases · CPC title

• B28B11/08

  for reshaping the surface, e.g. smoothing, roughening, corrugating, making screw-threads · CPC title

• B22F2302/406

  Diamond · CPC title

• B22F2005/001

  Cutting tools, earth boring or grinding tool other than table ware · CPC title