Composite Substrate, Elastic Wave Device, and Method for Producing Elastic Wave Device
US-2018053679-A1 · Feb 22, 2018 · US
US10211389B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10211389-B2 |
| Application number | US-201615001501-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 20, 2016 |
| Priority date | Jul 25, 2013 |
| Publication date | Feb 19, 2019 |
| Grant date | Feb 19, 2019 |
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In the composite substrate 10 , the piezoelectric substrate 12 and the support substrate 14 are bonded by direct bonding using an ion beam. One surface of the piezoelectric substrate 12 is a negatively-polarized surface 12 a and another surface of the piezoelectric substrate 12 is a positively-polarized surface 12 b . An etching rate at which the negatively-polarized surface 12 a is etched with a strong acid may be higher than an etching rate at which the positively-polarized surface 12 b is etched with the strong acid. The positively-polarized surface 12 b of the piezoelectric substrate 12 is directly bonded to the support substrate 14 . The negatively-polarized surface 12 a of the piezoelectric substrate 12 may be etched with the strong acid.
Opening claim text (preview).
What is claimed is: 1. A composite substrate comprising: a piezoelectric substrate, one surface of which is a negatively-polarized surface and another surface of which is a positively-polarized surface; and a support substrate bonded to the positively-polarized surface of the piezoelectric substrate by direct bonding; wherein the piezoelectric substrate is a lithium tantalate substrate or a lithium niobate substrate, and the support substrate is a silicon substrate or a glass substrate. 2. The composite substrate according to claim 1 , wherein the negatively-polarized surface of the piezoelectric substrate is etched with a strong acid, and wherein an etching rate at which the negatively-polarized surface is etched with the strong acid is higher than an etching rate at which the positively-polarized surface is etched with the strong acid, and an etching rate at which the support substrate is etched with the strong acid is higher than the etching rate at which the negatively-polarized surface is etched with the strong acid. 3. The composite substrate according to claim 2 , wherein the strong acid is hydrofluoric nitric acid or hydrofluoric acid. 4. The composite substrate according to claim 1 , wherein the support substrate has a thermal expansion coefficient smaller than a thermal expansion coefficient of the piezoelectric substrate.
for obtaining desired frequency or temperature coefficient · CPC title
of temperature influence (cut angles H03H9/02543) · CPC title
of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate · CPC title
Electricity · mapped topic
Electricity · mapped topic
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