Systems and methods for coupling a metal core PCB to a heat sink

US10208940B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10208940-B2
Application numberUS-201715678880-A
CountryUS
Kind codeB2
Filing dateAug 16, 2017
Priority dateMay 3, 2017
Publication dateFeb 19, 2019
Grant dateFeb 19, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Embodiments may utilize a series of exposed fins, which increase the surface area of the heat sink creating additional air flow. As hotter air rises within the system, cooler is drawn into the heatsink. The fins may be exposed on both sides of the longitudinal axis, allowing cooler air to be drawn towards the longitudinal axis above the heatsink and flow upward. This process may cool the fins. Additionally, the spacing between the fins may have to be wide enough to allow for air to freely enter the heatsink.

First claim

Opening claim text (preview).

What is claimed is: 1. A heat sink for a light fixture comprising: a plurality of fins positioned from a first end of the heat sink to a second end of the heat sink, the plurality of fins being positioned perpendicular to a central axis of the heat sink; a base being coupled to lower surfaces of the plurality of fins, the base being comprised of metal core PCB, wherein the base does not cover an entirety of the lower surfaces of the plurality of fins; angled protrusions positioned on the sides of the base, the angled protrusions extending in a downward direction away from the lower surfaces of the plurality of fins to create a space between upper surfaces of the angled protrusions and the lower surfaces of the plurality of fins. 2. The heat sink of claim 1 , wherein outer edges of the angled protrusions are positioned between the sides of the base and sides of the fins. 3. The heat sink of claim 1 , wherein the lower surfaces of the fins are extruded to form a contoured depression between overhangs, the overhangs being positioned on edges of the fins. 4. The heat sink of claim 3 , wherein the base is configured to be positioned between the overhangs. 5. The heat sink of claim 4 , wherein the base includes a plurality of rows of vents orifices, the plurality of rows of vent orifices being offset from the central axis of the heat sink. 6. A method for creating a heat sink for a light fixture, the method comprising: coupling a base to lower surfaces of a plurality of fins, the plurality of fins being positioned from a first end of the heat sink to a second end of the heat sink, the plurality of fins having a fin width positioned perpendicular to a central axis of the heat sink, the base being comprised of metal core PCB, wherein the base does not cover an entirety of the lower surfaces of the plurality of fins; creating orifices extending through the base, the orifices having an orifice length extending in a direction from the first end of the heat sink towards the second end of the heat sink, the orifice length being greater than an orifice width, wherein the orifices expose the central axis of the heat sink; forming angled by bending the sides of the base along a direction in parallel with a longitudinal axis of the heat sink, the angled protrusions extending in a downward direction away from the lower surfaces of the plurality of fins to create a space between upper surfaces of the angled protrusions and the lower surfaces of the plurality of fins. 7. The method of claim 6 , wherein a base width of the base is less than the fin width of the plurality of fins. 8. The method of claim 6 , wherein outer edges of the angled protrusions are positioned between the sides of the base and sides of the fins. 9. The method of claim 6 , further comprising: extruding the lower surface of the fins to form a contoured depression between overhangs, the overhangs being positioned on edges of the fins. 10. The method of claim 9 , further comprising: positioning the base between the overhangs. 11. The method of claim 10 , wherein the base includes a plurality of rows of vents orifices, the plurality of rows of vent orifices being offset from the central axis of the heat sink. 12. The method of claim 11 , further comprising: coupling the base to the fins via a plurality of coupling orifices that are aligned with the central axis of the heat sink.

Assignees

Inventors

Classifications

  • characterised by their shape, e.g. having conical or cylindrical projections · CPC title

  • Insulated {conductive substrates, e.g. insulated} metal substrate · CPC title

  • the elements having apertures, ducts or channels, e.g. heat radiation holes · CPC title

  • comprising a linear array of point-like light-generating elements · CPC title

  • the means being corrugated, plate-like elements · CPC title

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Frequently asked questions

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What does patent US10208940B2 cover?
Embodiments may utilize a series of exposed fins, which increase the surface area of the heat sink creating additional air flow. As hotter air rises within the system, cooler is drawn into the heatsink. The fins may be exposed on both sides of the longitudinal axis, allowing cooler air to be drawn towards the longitudinal axis above the heatsink and flow upward. This process may cool the fins. …
Who is the assignee on this patent?
Fluence Bioengineering, Fluence Bioengineering Inc
What technology area does this patent fall under?
Primary CPC classification F21V29/502. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Feb 19 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).