Method for manufacturing structure for flexible printed circuit boards

Patent metadata

Field	Value
Publication number	US-10206290-B2
Application number	US-201414906850-A
Country	US
Kind code	B2
Filing date	Jul 24, 2014
Priority date	Jul 24, 2013
Publication date	Feb 12, 2019
Grant date	Feb 12, 2019

Abstract

A method for manufacturing a structure of a flexible printed circuit board that is installed on a substrate in a display device is provided.

First claim

The invention claimed is:

1. A method for manufacturing a structure of a flexible printed circuit board, comprising:
1) installing two or more flexible printed circuit boards at edges on a substrate; and
2) making the flexible printed circuit boards having neighboring end portions conduct electricity using at least one of soldering and wire bonding,
wherein two pairs of anode pads and cathode pads are mounted on end portions of both sides of the two or more flexible printed circuit boards, and in the step 2), the anode pads and the cathode pads that are mounted on the neighboring end portions of the flexible printed circuit boards are made to conduct electricity using at least one of the soldering and the wire bonding, and
wherein the anode pads and the cathode pads that are positioned on the end portions of one side of the flexible printed circuit board are mounted in parallel to each other in a length direction of the flexible printed circuit board, and the anode pads and the cathode pads that are positioned on the end portions of the other side of the flexible printed circuit board are mounted in parallel to each other in a direction that is perpendicular to the length direction of the flexible printed circuit board.

2. The method of claim 1 , wherein the flexible printed circuit board is a bar-type flexible printed circuit board.

3. The method of claim 1 , wherein the two or more flexible printed circuit boards include four bar-type flexible printed circuit boards.

4. The method of claim 1 , wherein a width of the flexible printed circuit board is 1 to 5 mm.

5. The method of claim 1 , wherein a width of the soldering is 0.1 to 2 mm.

6. The method of claim 1 , wherein solder that is used for the soldering is any one of brass solder, silver solder, german silver solder, manganese solder, gold solder, a lead-tin alloy, a lead-tin-zinc alloy, a lead-cadmium alloy, zinc-cadmium solder and a lead-tin-bismuth-based alloy.

7. The method of claim 1 , wherein a diameter of a wire that is used for the wire bonding is 0.1 to 2 mm.

8. The method of claim 1 , further comprising installing an anisotropic conductive film in a position that corresponds to the flexible printed circuit board on the substrate before the step 1).

9. The method of claim 1 , wherein the two or more flexible printed circuit boards do not overlap each other.

10. The method of claim 9 , wherein the two or more flexible printed circuit boards are spaced apart from each other.

11. The method of claim 10 , wherein a gap distance between the flexible printed circuit boards is longer than 0 mm and equal to or smaller than 1 mm.

12. A method of manufacturing a structure of a flexible printed circuit board, comprising:
1) installing two or more flexible printed circuit boards at edges on a substrate; and
2) making the flexible printed circuit boards having neighboring end portions conduct electricity using soldering,
wherein the step 1) is a step of installing a pair of lower flexible printed circuit boards facing each other at edges on the substrate and mounted with anode pads and cathode pads, and a pair of upper flexible printed circuit boards facing each other at edges on the substrate to partially overlap the lower flexible printed circuit boards and mounted with anode pads and cathode pads, and
the step 2) is a step of forming a hole in a portion of the upper flexible circuit board that overlaps the lower flexible printed circuit board, and making the anode pads and the cathode pads of the upper flexible printed circuit boards and the anode pads and the cathode pads of the lower flexible printed circuit boards, which overlap each other, conduct electricity by solder that fills a hole through soldering.

13. The method of claim 12 , wherein the step 1) installs the lower and upper flexible printed circuit boards so that an end portion of the upper flexible printed circuit board overlaps an end portion of the lower flexible printed circuit board.

14. The method of claim 12 , wherein the hole is formed at the anode pad and the cathode pad of the upper flexible printed circuit board.

15. The method of claim 12 , wherein a diameter of the hole is equal to or smaller than a width of the anode pad and the cathode pad.

16. The method of claim 12 , wherein a distance between the center of the hole of the anode pad and the center of the hole of the cathode pad is 0.5 to 2 mm.

17. The method of claim 12 , wherein the upper flexible printed circuit board and the lower flexible printed circuit board have a multilayer structure including two or more layers.

18. The method of claim 17 , wherein an outermost layer of the upper flexible printed circuit board is installed to extend in the length direction of the upper flexible printed circuit board, and is positioned on the lower flexible printed circuit board so that an end portion of the outermost layer of the upper flexible printed circuit board overlaps the lower flexible printed circuit board.

19. A method of manufacturing a structure of a flexible printed circuit board, comprising:
1) installing two or more flexible printed circuit boards at edges on a substrate; and
2) making the flexible printed circuit boards having neighboring end portions conduct electricity using soldering,
wherein an anode lead terminal and a cathode lead terminal are installed on an end portion of one side of the flexible printed circuit board to protrude in a length direction of the flexible printed circuit board, and an anode pad and a cathode pad are mounted on an end portion of the other side of the flexible printed circuit board, and in the step 2), the anode lead terminal and the cathode lead terminal of any one of the flexible printed circuit boards correspondingly overlap the anode pad and the cathode pad of the end portion of another neighboring flexible printed circuit boards to conduct electricity with each other by soldering; or
wherein the step 1) is a step of installing a pair of lower flexible printed circuit boards facing each other at edges on the substrate and having anode pads and cathode pads mounted on end portions of both sides thereof, and a pair of upper flexible printed circuit boards facing each other at edges on the substrate and having an anode lead terminal and a cathode lead terminal installed to protrude in the length direction on the end portions of both sides thereof, and the step 2) is a step of making the anode lead terminal and the cathode lead terminal of the upper flexible printed circuit board correspondingly overlap the anode pad and the cathode pad of the lower flexible printed circuit board to conduct electricity with each other by soldering.

20. The method of claim 19 , wherein the flexible printed circuit board has a multilayer structure including two or more layers.

21. The method of claim 20 , wherein the anode lead terminal and the cathode lead terminal protrude in the length direction of the flexible printed circuit board on the end portion of the outermost layer of the flexible printed circuit board.

Assignees

• Lg Display Co Ltd

Inventors

• Oh Ducksu
• Park Sung Soo
• Kang Minsoo

Classifications

• H05K3/4644

  by building the multilayer layer by layer, i.e. build-up multilayer circuits (making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602) · CPC title

• H05K2201/0397

  Tab · CPC title

• Y10T29/49128

  Assembling formed circuit to base · CPC title

• H01L51/0097

  Electricity · mapped topic

• H01L51/5246

  Electricity · mapped topic