Socket contact techniques and configurations

Patent metadata

Field	Value
Publication number	US-10205292-B2
Application number	US-201715716356-A
Country	US
Kind code	B2
Filing date	Sep 26, 2017
Priority date	Sep 26, 2014
Publication date	Feb 12, 2019
Grant date	Feb 12, 2019

Abstract

Embodiments of the present disclosure are directed towards socket contact techniques and configurations. In one embodiment, an apparatus may include a socket substrate having a first side and a second side disposed opposite to the first side, an opening formed through the socket substrate, an electrical contact disposed in the opening and configured to route electrical signals between the first side and the second side of the socket substrate, the electrical contact having a cantilever portion that extends beyond the first side, wherein the first side and surfaces of the socket substrate in the opening are plated with a metal. Other embodiments may be described and/or claimed.

First claim

What is claimed is:

1. An apparatus comprising:
a socket substrate having a first side and a second side disposed opposite to the first side;
an opening formed through the socket substrate, wherein the opening extends from the first side to the second side and a surface of the socket substrate extends from the first side to the second side in the opening;
an electrical contact disposed in the opening and configured to route electrical signals between the first side and the second side of the socket substrate, the electrical contact having a cantilever portion that extends beyond the first side, wherein the first side and the surface of the socket substrate that extends in the opening are plated with a metal.

2. The apparatus of claim 1 , wherein the second side of the socket substrate is not plated with a metal.

3. The apparatus of claim 1 , wherein:
the cantilever portion has a width or thickness that increases and decreases in a direction along the cantilever portion from the opening toward a terminating end of the electrical contact that is configured to make electrical contact with a die package.

4. The apparatus of claim 1 , wherein the electrical contact is a ground contact and the opening is a first opening, the apparatus further comprising:
an input/output (I/O) signal contact disposed in a second opening formed through the socket substrate, wherein surfaces of the socket substrate in the second opening are not plated with a metal.

5. The apparatus of claim 1 , wherein the opening is a first opening, the apparatus further comprising:
a cover having a first side and a second side disposed opposite to the first side;
a second opening formed through the cover and configured to accommodate the cantilever portion such that a first portion of the cover is configured to contact the cantilever portion and a second portion of the cover serves as a barrier to prevent overdeflection of the cantilever portion when loading a die package on the cover.

6. A method comprising:
providing a socket substrate including:
a first side and a second side disposed opposite to the first side;
an opening formed through the socket substrate, wherein the opening extends from the first side to the second side and a surface of the socket substrate extends from the first side to the second side in the opening;
an electrical contact disposed in the opening and configured to route electrical signals between the first side and the second side of the socket substrate, the electrical contact having a cantilever portion that extends beyond the first side, wherein the first side and the surface of the socket substrate that extends in the opening are plated with a metal; and

coupling the electrical contact with a circuit board, wherein the electrical contact is configured to electrically couple with a die package.

7. The method of claim 6 , wherein the second side of the socket substrate is not plated with a metal.

8. The method of claim 6 , wherein:
the cantilever portion has a width or thickness that increases and decreases in a direction along the cantilever portion from the opening toward a terminating end of the electrical contact that is configured to make electrical contact with a die package.

9. The method of claim 6 , wherein the electrical contact is a ground contact and the opening is a first opening, the method further comprising:
an input/output (I/O) signal contact disposed in a second opening formed through the socket substrate, wherein surfaces of the socket substrate in the second opening are not plated with a metal.

10. The method of claim 6 , wherein the opening is a first opening, the method further comprising:
a cover having a first side and a second side disposed opposite to the first side;
a second opening formed through the cover and configured to accommodate the cantilever portion such that a first portion of the cover is configured to contact the cantilever portion and a second portion of the cover serves as a barrier to prevent overdeflection of the cantilever portion when loading the die package on the cover.

11. The apparatus of claim 1 , wherein an entirety of the surface is plated with the metal.

12. The apparatus of claim 1 , wherein the metal is electrically coupled to the electrical contact.

13. The apparatus of claim 1 , wherein the metal has a thickness between one micron and twenty microns.

14. An apparatus comprising:
a socket substrate having a first side and a second side, the second side located on an opposite side of the socket substrate from the first side, wherein the first side is plated with a metal;
an opening that extends through the socket substrate from the first side to the second side, wherein a surface of the socket substrate extends in the opening from the first side to the second side, and wherein the surface is plated with the metal; and
an electrical contact located within the opening, wherein the electrical contact extends through the opening.

15. The apparatus of claim 14 , wherein the electrical contact extends beyond the first side and beyond the second side.

16. The apparatus of claim 14 , wherein the electrical contact has a cantilever portion that extends beyond the first side.

17. The apparatus of claim 14 , wherein the metal plated to the first side is electrically coupled to the metal plated to the surface.

18. The apparatus of claim 14 , wherein the electrical contact is electrically coupled to the metal plated to the surface.

19. The apparatus of claim 14 , wherein the electrical contact is electrically coupled to the metal plated to the first side.

20. The apparatus of claim 14 , wherein the metal plated to the first side and the metal plated to the second side have a thickness between one micron and twenty microns.

Assignees

• Intel Corp

Inventors

• Athreya Dhanya
• Chawla Gaurav
• Aygun Kemal
• Gordon Glen P
• Canny Sarah M
• Smalley Jeffory L
• Nekkanty Srikant
• Garcia Michael
• Heppner Joshua D

Classifications

• H10W78/00 Primary

  Detachable holders for supporting packaged chips in operation · CPC title

• H10W70/635

  Through-vias · CPC title

• H10W70/644

  Elastic or compliant interconnections, e.g. springs, cantilevers or elastic pads · CPC title

• H01L23/49827

  Electricity · mapped topic

• H01L2924/00

  Electricity · mapped topic