Photoelectric sensing device for cancellate crosstalk
US-2024333264-A1 · Oct 3, 2024 · US
US10205035B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10205035-B2 |
| Application number | US-201214007740-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 2, 2012 |
| Priority date | Apr 1, 2011 |
| Publication date | Feb 12, 2019 |
| Grant date | Feb 12, 2019 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
The present invention relates to an electronic proximity sensor having a decorative surface, characterized in that the decorative surface comprises a semiconductor layer, the thickness of which is between 10 nm and 100 nm. This coating imparts a desired metallic appearance to the proximity sensor, without the property thereof as a proximity sensor being lost.
Opening claim text (preview).
What is claimed is: 1. Method for producing an electronic proximity sensor, having the steps of: providing a capacitive proximity sensor having a sensor surface, and coating the sensor surface with a semiconductor layer, the thickness of which is between 10 nm and 100 nm, wherein the coating is achieved by a vacuum process, wherein the semiconductor layer is a silicon layer or a germanium layer or a layer consisting of silicon and germanium, and wherein the electronic proximity sensor has a decorative surface with a metallic appearance. 2. The method according to claim 1 , characterized in that the vacuum process comprises at least one of PVD and CVD process. 3. The method of claim 1 , wherein the semiconductor layer is a layer component of a layer system. 4. The method of claim 1 , wherein the semiconductor layer is a layer component of a layer system and the layer system is structured as alternating layer system comprising at least one semiconductor layer and one dielectric layer. 5. The method of claim 4 , wherein the semiconductor layer is a Si-layer and the dielectric layer is a SiO 2 -layer. 6. The method of claim 4 , wherein the semiconductor layer comprises germanium and the dielectric layer is a SiO 2 -layer. 7. The method of claim 1 , wherein a primer of UV acryl lacquer is first applied onto the surface. 8. The method of claim 1 , wherein a top layer of UV acryl lacquer is applied. 9. The method of claim 2 , wherein the vacuum process includes or is magnetron sputtering. 10. The method of claim 6 , wherein germanium and silicon oxide are alternately formed. 11. The method of claim 4 , wherein the one semiconductor layer comprises silicon and germanium combined, and the one dielectric layer comprises silicon oxide. 12. The method of claim 1 , wherein the decorative surface comprises an entire decorative surface.
Touch switches (specially adapted for electronic time-pieces with no moving parts G04G21/08) · CPC title
by capacitive means · CPC title
using a capacitive detector · CPC title
Digitisers structurally integrated in a display · CPC title
Constructional details of capacitive touch and proximity switches · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.