Optical modules including customizable spacers for focal length adjustment and/or reduction of tilt, and fabrication of the optical modules

Patent metadata

Field	Value
Publication number	US-10204945-B2
Application number	US-201715850003-A
Country	US
Kind code	B2
Filing date	Dec 21, 2017
Priority date	Feb 18, 2014
Publication date	Feb 12, 2019
Grant date	Feb 12, 2019

Abstract

Optical modules are made using customizable spacers to reduce variations in the focal lengths of the optical channels, to reduce the occurrence of tilt of the optical channels, and/or prevent adhesive from migrating to active portions of an image sensor.

First claim

What is claimed is:

1. A wafer-level fabrication process for making a plurality of optical modules, the method comprising:
providing a respective beam shaping system over a first surface of each of a plurality of transparent covers;
forming a spacer laterally surrounding each transparent cover, wherein the spacer has respective through-holes each of which is substantially aligned with a corresponding one of the beam shaping systems and corresponds to a respective optical channel, the spacer including first extensions to provide respective alignment edges and second extensions to provide respective adhesion edges, the first and second extensions extending away from the beam shaping systems;
measuring at least one optical property for an optical channel corresponding to each beam shaping system;
modifying a height of one or more of the extensions based on the measuring; and
subsequently bringing each alignment edge into contact with a surface of a respective image sensor, and attaching each adhesion edge either to the surface of the respective image sensor or to a surface of a respective printed circuit board on which the image sensor is mounted.

2. The method of claim 1 wherein forming the spacer includes a plurality of vacuum injection steps.

3. The method of claim 1 wherein modifying a height of one or more of the extensions includes micromachining the one or more extensions.

4. The method of claim 1 wherein the adhesion edges are substantially perpendicular to side surfaces of the transparent covers that are laterally surrounded by the material.

5. The method of claim 1 wherein the material laterally surrounding the respective transparent covers is composed of a vacuum injection molded epoxy.

Assignees

• Heptagon Micro Optics Pte Ltd

Inventors

• Rudmann Hartmut
• Alasirniö Jukka
• Tesanovic Bojan
• Senn Tobias
• Kupusamy Devanraj
• Bietsch Alexander

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H04N23/57

  Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices · CPC title

• H04N23/54

  Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils · CPC title

• H04N23/45

  for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images · CPC title