Electronic package and conductive structure thereof

Patent metadata

Field	Value
Publication number	US-10204865-B2
Application number	US-201614990891-A
Country	US
Kind code	B2
Filing date	Jan 8, 2016
Priority date	Jan 16, 2015
Publication date	Feb 12, 2019
Grant date	Feb 12, 2019

Abstract

An electronic package is provided, which includes: an insulator; an electronic element embedded in the insulator and having a sensing area exposed from the insulator; and a conductive structure disposed on the insulator and electrically connected to the electronic element, thereby reducing the thickness of the overall structure.

First claim

What is claimed is:

1. An electronic package, comprising:
an insulator having opposite first and second surfaces;
a circuit structure formed in the insulator and communicating with the first surface of the insulator, wherein the circuit structure has a plurality of circuit layers and a plurality of conductive posts electrically connecting the circuit layers, and the conductive posts communicate with the first surface of the insulator;
an electronic element embedded in the first surface of the insulator and having a plurality of electrode pads and at least a sensing area exposed from the first surface of the insulator; and
a conductive structure disposed on the first surface of the insulator and electrically connected to the plurality of electrode pads of the electronic element and the conductive posts of the circuit structure, wherein the conductive structure is a lead frame and the sensing area is exposed from the conductive structure, and the conductive structure is attached to the first surface of the insulator and electrically connected to the electronic element and the conductive posts through a plurality of first conductive elements.

2. The electronic package of claim 1 , wherein the electronic element protrudes from the first surface of the insulator.

3. The electronic package of claim 1 , wherein the conductive structure has a plurality of height levels.

4. The electronic package of claim 1 , wherein the first conductive elements are conductive bumps.

5. The electronic package of claim 1 , further comprising another electronic element, electrically connected to the conductive structure through a plurality of conductive bumps.

6. The electronic package of claim 1 , wherein the lead frame has a plurality of openings and the plurality of first conductive elements are formed in the openings and electrically connected to the electronic element.

7. The electronic package of claim 1 , wherein the conductive structure has a plurality of protruding contacts serving as the first plurality of conductive elements.

8. The electronic package of claim 1 , further comprising a plurality of second conductive elements formed on the second surface of the insulator.

9. The electronic package of claim 1 , further comprising a recessed portion formed on the first surface of the insulator, wherein the electronic element is received in the recessed portion.

10. The electronic package of claim 1 , further comprising a covering layer covering the sensing area of the electronic element.

11. The electronic package of claim 1 , wherein the conductive structure has a step shape.

12. The electronic package of claim 1 , further comprising another electronic element bonded to the insulator.

13. The electronic package of claim 12 , wherein the another electronic element is an active element, a passive element or a combination thereof.

14. The electronic package of claim 12 , wherein the another electronic element is partially disposed in the insulator, and partially protrudes from the first surface of the insulator.

15. The electronic package of claim 14 , wherein the conductive posts formed in the insulator are electrically connected to the another electronic element.

16. The electronic package of claim 12 , wherein the another electronic element is completely disposed in the insulator.

17. The electronic package of claim 12 , wherein the another electronic element is completely disposed on the first surface of the insulator.

18. The electronic package of claim 1 , further comprising a transparent element covering the sensing area of the electronic element.

Assignees

• Phoenix Pioneer Technology Co Ltd

Inventors

• Hu Chu-Chin
• Hsu Shih-Ping

Classifications

• H10W72/5522

  comprising gold [Au] · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W70/479

  on or in insulating or insulated package substrates, interposers, or redistribution layers · CPC title

• H10W70/614 Primary

  the multiple chips being integrally enclosed · CPC title

• H01L2224/45144

  Electricity · mapped topic