Imprint apparatus, foreign particle removal method, and method of manufacturing article

Patent metadata

Field	Value
Publication number	US-10201927-B2
Application number	US-201414561576-A
Country	US
Kind code	B2
Filing date	Dec 5, 2014
Priority date	Dec 20, 2013
Publication date	Feb 12, 2019
Grant date	Feb 12, 2019

Abstract

The present invention provides an imprint apparatus which performs an imprint process of molding an imprint material on a substrate using a mold and forming a pattern on the substrate, the apparatus including a substrate chuck configured to hold the substrate, a protective plate configured to surround the substrate chuck, and a suction mechanism configured to suction at least a part of a gap between the substrate chuck and the protective plate, wherein while the suction mechanism suctions at least the part of the gap, the substrate chuck holds a plate which is different from the substrate on which the pattern is to be formed.

First claim

What is claimed is:

1. An imprint apparatus which performs an imprint process of molding an imprint material on a substrate using a mold and forming a pattern on the substrate, the apparatus comprising:
a substrate chuck configured to hold a substrate;
a first plate configured to surround the substrate chuck;
a suction mechanism including a nozzle arranged to face a gap between the substrate chuck and the first plate, configured to suction a gas contained in the gap through the nozzle; and
a first stocker which stocks a second plate which is different from the substrate on which a pattern is formed,
wherein the substrate chuck is configured to hold the second plate while the suction mechanism suctions the gas contained in the gap,
wherein the second plate prevents a foreign particle, which is diffused from the gap by suctioning the gas contained in the gap by the suction mechanism, from adhering onto the substrate chuck.

2. The apparatus according to claim 1 , further comprising a mold chuck configured to hold a mold,
wherein the mold chuck is configured to hold a dummy mold which is different from a mold used to pattern the substrate, the dummy mold including an unevenness pattern corresponding to a pattern that should be formed on the substrate.

3. The apparatus according to claim 1 , wherein a trap surface including a rough surface or an adhesive surface for trapping a foreign particle is formed on a surface of the second plate.

4. The apparatus according to claim 2 , wherein a trap surface including a rough surface or an adhesive surface for trapping a foreign particle is formed on a surface of the dummy mold.

5. An imprint apparatus which performs an imprint process of molding an imprint material on a substrate using a mold and forming a pattern on the substrate, the apparatus comprising:
a substrate chuck configured to hold a substrate;
a first plate configured to surround the substrate chuck;
a suction mechanism including a nozzle arranged to face a gap between the substrate chuck and the first plate, configured to suction a gas contained in the gap through the nozzle; and
a first stocker which stocks a second plate which is different from the substrate on which a pattern is formed, and
a blowing mechanism configured to blow a gas into the gap,
wherein the suction mechanism is configured to suction the gas contained in the gap while the gas is blowing into the gap, and
wherein the substrate chuck is configured to hold the second plate while the suction mechanism suctions the gas contained in the gap.

6. The apparatus according to claim 1 , further comprising an air conditioner configured to supply a gas to a space between the mold and the substrate chuck, wherein the suction mechanism is configured to suction the gas contained in the gap while the air conditioner supplies the gas in a direction from a center of the second plate toward a portion in the gap.

7. The apparatus according to claim 6 , wherein the air conditioner is configured to supply the gas to the space at a flow rate that is higher than a flow rate during an imprint process.

8. The apparatus according to claim 1 , further comprising a movable substrate stage configured to hold the substrate chuck and the first plate,
wherein the suction mechanism is arranged above the gap and the nozzle configured to suction the gas contained in some regions in the gap within a surface parallel to a holding surface of the substrate chuck, and
wherein the substrate stage is configured to move to position all regions in the gap under the nozzle successively within the surface parallel to the holding surface of the substrate chuck while the suction mechanism suctions the gas contained in the gap.

9. The apparatus according to claim 1 , wherein the suction mechanism is arranged above the gap and the nozzle is configured to suction the gas contained in all regions in the gap within a surface parallel to a holding surface of the substrate chuck.

10. The apparatus according to claim 1 , further comprising a supply mechanism configured to supply the imprint material onto the substrate,
wherein the suction mechanism is configured such that a distance between the mold and the suction mechanism is equal to a distance between the mold and the supply mechanism.

11. The apparatus according to claim 1 , further comprising
a first conveyance system configured to convey the second plate between the first stocker and the substrate chuck.

12. The apparatus according to claim 2 , further comprising
a second stocker configured to stock the dummy mold; and
a second conveyance system configured to convey the dummy mold stocked in the second stocker between the second stocker and the mold chuck.

13. A method of manufacturing an article, the method comprising:
forming a pattern on a substrate using an imprint apparatus; and
processing the substrate on which the pattern has been formed,
wherein the imprint apparatus performs an imprint process of molding an imprint material on the substrate using a mold and forming the pattern on the substrate, and includes:
a substrate chuck configured to hold the substrate;
a first plate configured to surround the substrate chuck;
a suction mechanism including a nozzle arranged to face a gap between the substrate chuck and the first plate, configured to suction a gas contained in the gap through the nozzle, and
a first stocker which stocks a second plate which is different from the substrate on which a pattern is formed,
wherein the substrate chuck is configured to hold the second plate while the suction mechanism suctions the gas contained in the gap, and
wherein the first plate prevents a foreign particle, which is diffused from the gap by suctioning the gas contained in the gap by the suction mechanism, from adhering onto the substrate chuck.

14. An imprint apparatus which performs an imprint process of molding an imprint material on a substrate using a mold and forming a pattern on the substrate, the apparatus comprising:
a substrate chuck configured to hold a substrate;
a first plate configured to surround the substrate chuck;
a suction mechanism including a nozzle arranged to face a gap between the substrate chuck and the first plate, configured to suction a gas contained in the gap through the nozzle; and
a first stocker which stocks a second plate which is different from the substrate on which a pattern is formed,
wherein the substrate chuck is configured to hold the second plate while the suction mechanism suctions the gas contained in the gap, and
wherein the surface of a substrate held by the substrate chuck and an upper surface of the first plate are flush with each other.

Assignees

• Canon Kk

Inventors

• Mizuno Makoto
• Shudo Shinichi
• Arai Tsuyoshi

Classifications

• B29L2031/001

  Profiled members, e.g. beams, sections · CPC title

• G03F7/0002 Primary

  Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping · CPC title

• B29C59/002

  Component parts, details or accessories; Auxiliary operations · CPC title

• B29C59/026 Primary

  of layered or coated substantially flat surfaces · CPC title

• B29C59/02 Primary

  by mechanical means, e.g. pressing {(B29C59/007 takes precedence; embossing expanded porous articles B29C44/5627)} · CPC title