Substrate processing apparatus

Patent metadata

Field	Value
Publication number	US-10201888-B2
Application number	US-201715604328-A
Country	US
Kind code	B2
Filing date	May 24, 2017
Priority date	Aug 26, 2014
Publication date	Feb 12, 2019
Grant date	Feb 12, 2019

Abstract

An embodiment of the present invention provides a buff process module. The buff process module includes: a buff table on which a processing target object is mounted; a buff head that holds a buff pad for applying a predetermined process to the processing target object; a buff arm that supports and swings the buff head; a dresser for dressing the buff pad; and a cleaning mechanism that is disposed between the buff table and the dresser and is for cleaning the buff pad.

First claim

What is claimed is:

1. A conditioner comprising a dresser for dressing a buff pad of a buff process module, the buff process module comprising a buff table configured to hold a wafer, and a buff head configured to hold the buff pad and to buff-processes the wafer,
the dresser further comprising a dresser cleaning mechanism configured to jet a cleaning liquid to the dresser to clean the dresser, wherein a surface of the dresser is at a lower position than a position of a buff table disposed adjacent to the dresser.

2. The conditioner according to claim 1 , wherein the dresser cleaning mechanism jets the cleaning liquid in a direction away from the buff table.

3. The conditioner according to claim 1 , wherein a cover for preventing the cleaning liquid from dispersing is disposed between the dresser and the buff table.

4. The conditioner according to claim 3 , wherein the cover includes a contact avoiding mechanism that avoids contact with the swinging buff pad.

5. The conditioner according to claim 4 , wherein the contact avoiding mechanism includes a cover moving mechanism configured to move the cover in an axial direction of a rotation axis of the dresser or the buff table.

6. The conditioner according to claim 4 ,
wherein the cover includes a substantially cylindrical cover that covers at least a part of a periphery of the dresser, or a periphery of the buff table, and
the contact avoiding mechanism includes a notch formed at at least a part of the substantially cylindrical cover for allowing the buff pad to pass, and a rotational drive mechanism configured to rotate the cover concentrically with a rotation axis of the dresser or the buff table.

7. The conditioner according to claim 6 , wherein the contact avoiding mechanism includes a movable cover member for opening and closing the notch.

8. The conditioner according to claim 7 , wherein the movable cover member is movable along a circumferential direction or a central axial direction with respect to the cover.

9. The conditioner according to claim 1 , further comprising an air curtain forming mechanism configured to form an air curtain in a space between the buff table and this mechanism.

10. The conditioner according to claim 1 , further comprising a locally exhausted state forming mechanism configured to form a locally exhausted state around the dresser.

11. The conditioner according to claim 1 , wherein the cleaning liquid is a liquid including at least any one selected from a group consisting of deionized water, a chemical solution and a slurry, or a mixture of the liquid and compressed air.

12. The conditioner according to claim 11 , wherein supply of each type of the liquid is switchable.

13. The conditioner according to claim 1 , wherein the cleaning liquid is a high pressure cleaning fluid.

14. A buff process module, comprising: the conditioner according to claim 1 ; a buff table configured to hold a wafer; and a buff head configured to hold a buff pad and to buff-processes the wafer,
wherein if a cover for preventing the cleaning liquid from dispersing is fixedly provided between the dresser and the buff table, the buff head is movable in a direction of a rotation axis of the dresser or a rotation axis of the wafer, and the buff head is movable between the conditioner and the buff table in a state of being moved to a higher position than a position of the cover.

15. The buff process module according to claim 14 , wherein a buff table cover is provided at at least a part of a periphery of the buff table.

16. The buff process module according to claim 14 , further comprising a descending air current generating mechanism configured to generate a descending air current from above the buff table.

17. A dresser rinsing method of cleaning a dresser in a conditioner, the conditioner including the dresser, the dresser being for dressing a buff pad of a buff process module, the buff process module comprising a buff table configured to hold a wafer, and a buff head configured to hold the buff pad and to buff-processes the wafer, the method comprising:
providing a dresser cleaning mechanism configured to jet a cleaning liquid to the dresser to clean the dresser; disposing a surface of the dresser at a lower position than a position of a buff table disposed adjacent to the dresser, and jetting the cleaning liquid from the dresser cleaning mechanism to the dresser.

18. The method according to claim 17 , wherein the jetting of the cleaning liquid to the dresser is performed in parallel with a process to a substrate on the buff table.

19. The method according to claim 17 , wherein a predetermined cover is provided at least at a part of a periphery of the dresser or a periphery of the buff table, and when the buff pad is moved between the buff table and the dresser, a contact avoiding mechanism is operated to avoid contact between the buff pad and the cover.

20. The method according to claim 17 , wherein the method performs at least any one of forming an air curtain between the buff table and the dresser, forming a locally exhausted state around the dresser, and forming a descending air current from above the buff table, at a same time of jetting the cleaning liquid to the dresser.

Assignees

• Ebara Corp

Inventors

• Yamaguchi Kuniaki
• Kobata Itsuki
• Mizuno Toshio
• Miyazaki Mitsuru
• Toyomura Naoki
• Inoue Takuya

Classifications

• H10P72/0414

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0412

  using mainly scrubbing means, e.g. brushes · CPC title

• B08B2203/0288

  Ultra or megasonic jets · CPC title

• B24B53/017 Primary

  Devices or means for dressing, cleaning or otherwise conditioning lapping tools · CPC title

• B24B37/20

  Lapping pads for working plane surfaces · CPC title